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1. 发明申请

WO2011008098A2 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE 审中-公开
标题翻译：用控制气体压力封装电子元件的方法和装置
公开(公告)号：WO2011008098A2
公开(公告)日：2011-01-20
申请号：PCT/NL2010050463
申请日：2010-07-19
申请人： FICO BV , GAL WILHELMUS GERARDUS JOZEF , FIERKENS HENRICUS ANTONIUS MARIA , VAN DRIEL ALBERTUS FRANCISCUS GERARDUS
发明人： GAL WILHELMUS GERARDUS JOZEF , FIERKENS HENRICUS ANTONIUS MARIA , VAN DRIEL ALBERTUS FRANCISCUS GERARDUS
IPC分类号： B29C45/34
CPC分类号： B29C45/34 , B29C45/02 , B29C45/14655 , B29C45/77 , B29C2045/14663 , B29C2945/76006 , B29C2945/762 , B29C2945/7622 , B29C2945/76257 , B29C2945/76287 , B29C2945/76381 , B29C2945/76498 , B29C2945/76762 , B29C2945/76779 , B29C2945/76789 , B29C2945/76859 , H01L24/97 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a method for encapsulating electronic components mounted on a carrier, wherein the gas pressure in a venting connecting to the mould cavity is actively increased to an overpressure of at least 3 atmosphere after filling of the mould cavity with encapsulating material. The invention also relates to a device for performing such a method for encapsulating electronic components mounted on a carrier, comprising: mould parts which in a closed position define a mould cavity, feed means for liquid encapsulating material, a venting for suctioning gas from the mould cavity, and a pressure conduit whereby an overpressure can be applied in the venting.
摘要翻译：本发明涉及一种封装安装在载体上的电子部件的方法，其中连接到模腔的通气中的气体压力在用封装材料填充模腔之后积极地增加至至少3个大气压的过压。本发明还涉及一种用于执行这种用于封装安装在载体上的电子部件的方法的装置，包括：在关闭位置限定模腔的模具部件，用于液体封装材料的进料装置，用于从模具抽吸气体的排气空腔和压力管道，由此可以在通风口中施加过压。

2. 发明申请

WO2007043884A3 METHOD AND DEVICE FOR LASER CUTTING AT AN ACUTE ANGLE OF CARRIERS FOR ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于激光切割电子元件运动员角度的方法和装置
公开(公告)号：WO2007043884A3
公开(公告)日：2008-05-22
申请号：PCT/NL2006050253
申请日：2006-10-09
申请人： FICO BV , ZIJL JOANNES LEONARDUS JURRIAN , VAN EGMOND HENRI JOSEPH
发明人： ZIJL JOANNES LEONARDUS JURRIAN , VAN EGMOND HENRI JOSEPH
IPC分类号： H05K3/00 , B23K26/04 , B23K26/38
CPC分类号： H05K3/0026 , B23K26/04 , B23K26/38 , H05K3/0052 , H05K2203/1476 , H05K2203/1527
摘要： The invention relates to a method for cutting a substantially- flat carrier (22) for electronic components (23) with a laser beam(20) by mutually displacing the laser beam(20) and the carrier. The invention also relates to a device for cutting a substantially flat carrier (22) for electronic components (23) with a laser beam (20), comprising: a holder (33) for holding the flat carrier(22), a laser source(31), a frame(32) connecting the holder(33) and the laser source, and control means for mutually displacing the laser beam (20) and the holder (33).
摘要翻译：本发明涉及一种通过相互移动激光束（20）和载体来切割具有激光束（20）的电子部件（23）的基本平坦的载体（22）的方法。本发明还涉及一种用于用激光束（20）切割用于电子部件（23）的基本平坦的载体（22）的装置，包括：用于保持平坦载体（22）的保持器（33），激光源 31），连接保持器（33）和激光源的框架（32）和用于相互移动激光束（20）和保持器（33）的控制装置。

3. 发明申请

WO2006135236A3 METHOD AND DEVICE FOR CUTTING ELECTRONIC COMPONENTS WITH A LASER BEAM 审中-公开
标题翻译：用激光束切割电子元件的方法和装置
公开(公告)号：WO2006135236A3
公开(公告)日：2007-03-08
申请号：PCT/NL2006050130
申请日：2006-06-01
申请人： FICO BV , ZIJL JOANNES LEONARDUS JURRIAN
发明人： ZIJL JOANNES LEONARDUS JURRIAN
IPC分类号： H01L21/78 , B23K26/16 , B23K26/40
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/16 , B23K26/40 , B23K2201/42 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H05K3/0026 , H05K3/0052
摘要： The present invention relates to a method for cutting electronic components with a laser beam. The invention also relates to a device for separating electronic components, comprising at least: a laser source for generating a cutting beam and a holder for holding unseparated electronic components, wherein the holder and the laser source are displaceable relative to each other.
摘要翻译：本发明涉及一种用激光束切割电子元件的方法。本发明还涉及用于分离电子部件的装置，该装置至少包括：用于产生切割光束的激光源和用于保持未分离的电子部件的保持器，其中保持器和激光源可相对于彼此移位。

4. 发明申请

WO2006112711A3 METHOD AND DEVICE FOR DISPLACING ELECTRONIC COMPONENTS ORDERED IN A RECTANGUALR STRUCTURE 审中-公开
标题翻译：用于取代矩形结构中订购的电子元件的方法和装置
公开(公告)号：WO2006112711A3
公开(公告)日：2007-03-08
申请号：PCT/NL2006050084
申请日：2006-04-13
申请人： FICO BV , HARMSEN WILHELMUS HENDRIKUS JO
发明人： HARMSEN WILHELMUS HENDRIKUS JO
IPC分类号： H01L21/68 , H05K13/00 , H05K13/02 , H05K13/04
CPC分类号： H05K13/022 , H01L21/681
摘要： The invention relates to a method and a device for placing on a flat carrier electronic components ordered in a rectangular structure, comprising of picking up a number of components ordered in a matrix structure and placing the components on the flat carrier, wherein the components are placed initially on a positioning table after being picked up, and the products placed on the positioning table are subsequently picked up again before they are placed on the flat carrier. This is applicable in the production of semiconductors which are processed in different processing stations and transported between these processing stations. However, the processing stations usually deliver the batches of electronic components in a rectangular structure, but in incorrect numbers, with incorrect pitch or in incorrect orientation for further transport. Numbers of components, their pitch or orientation can be modified by displacing the groups of electronic components in two steps.
摘要翻译：本发明涉及一种用于放置在平坦载体上的矩形结构中订购的电子部件的方法和装置，包括拾取多个以矩阵结构排列的部件并将部件放置在平坦的载体上，其中部件被放置最初在拾取后的定位台上，放置在定位台上的产品在被放置在平坦的载体上之后被再次拾取。这适用于在不同处理站处理并在这些处理站之间运输的半导体生产。然而，处理站通常将矩形结构中的电子组件批量输送，但是以不正确的数字，不正确的音高或不正确的方向传送以进一步传送。可以通过两个步骤移动电子组件组来修改组件数量，它们的间距或取向。

5. 发明申请

WO2007001179A2 METHOD AND DEVICE FOR SUPPLYING AND DISCHARGING CARRIERS WITH ELECTRONIC COMPONENTS 审中-公开
标题翻译：用电子元件供应和放电载体的方法和装置
公开(公告)号：WO2007001179A2
公开(公告)日：2007-01-04
申请号：PCT/NL2006050101
申请日：2006-04-25
申请人： FICO BV , VAN DRIEL ALBERTUS FRANCISCUS , VENROOIJ JOHANNES LAMBERTUS GE
发明人： VAN DRIEL ALBERTUS FRANCISCUS , VENROOIJ JOHANNES LAMBERTUS GE
IPC分类号： H01L21/677 , B29C45/14 , H01L21/00 , H05K13/00
CPC分类号： H01L21/67126 , H01L21/67201 , H01L21/67236 , H01L21/67778
摘要： The invention relates to methods for displacing a carrier with electronic components from a supply container to a processing station, methods for displacing a carrier with electronic components from a processing station to a supply container, as well as to methods for supplying to a processing station and discharging from a processing station of carriers with electronic components. The invention also relates to devices for displacing a carrier with electronic components between a supply container and a processing station, and to an assembly of such devices with a processing station for carriers with electronic components.
摘要翻译：本发明涉及用于将具有电子部件的载体从供应容器移动到处理站的方法，用于将具有电子部件的载体从处理站移动到供应容器的方法以及用于向处理站供应的方法和从具有电子部件的载体的处理站放电。本发明还涉及用于在供应容器和处理站之间移动具有电子部件的载体的装置，以及具有用于具有电子部件的载体的处理站的这种装置的组件。

6. 发明申请

WO2005060327A3 DEVICE AND METHOD FOR PRODUCT-RELATED ADJUSTMENT OF AN APPARATUS FOR PROCESSING A CARRIER WITH ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于处理与电子元件的载体的装置的产品相关调整的装置和方法
公开(公告)号：WO2005060327A3
公开(公告)日：2005-11-03
申请号：PCT/NL2004000798
申请日：2004-11-15
申请人： FICO BV , HARMSEN WILHELMUS HENDRIKUS JO
发明人： HARMSEN WILHELMUS HENDRIKUS JO
IPC分类号： H05K13/00
CPC分类号： H05K13/0061 , Y10T29/49002 , Y10T29/49133 , Y10T29/5136 , Y10T29/5137 , Y10T29/5142 , Y10T29/53048 , Y10T29/53052 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261
摘要： The invention relates to an apparatus for processing electronic components mounted on a carrier, comprising at least two engaging elements which co-act when engaging on a carrier. The invention also relates to a processing element for processing electronic components mounted on a carrier, which processing element can be coupled interchangeably to an apparatus according to the invention. The invention furthermore relates to a method for product-related adjustment of such an apparatus.
摘要翻译：本发明涉及一种用于处理安装在载体上的电子部件的装置，包括至少两个啮合元件，所述接合元件在与载体接合时共同作用。本发明还涉及一种用于处理安装在载体上的电子部件的处理元件，该处理元件可以与根据本发明的设备互换地耦合。本发明还涉及这种装置的产品相关调整方法。

7. 发明申请

WO9819845A3 SEALING EJECTORPIN 审中-公开
标题翻译：密封胶管
公开(公告)号：WO9819845A3
公开(公告)日：2002-10-03
申请号：PCT/NL9700603
申请日：1997-11-04
申请人： FICO BV , VENROOIJ JOHANNES LAMBERTUS GE , TOMASSEN MARCEL GERARDUS ANTON
发明人： VENROOIJ JOHANNES LAMBERTUS GE , TOMASSEN MARCEL GERARDUS ANTON
IPC分类号： B29C45/40
CPC分类号： B29C45/4005 , B29C45/401 , B29C2045/4015 , B29C2045/4094 , Y10S425/047
摘要： The invention relates to an ejector pin (8) receivable in a mould part of a mould for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin (8) is provided with a side wall in which at least one recess (11) is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mould part (16) in which an opening is arranged for guiding an ejector pin, wherein at least one recess (19) is arranged in the wall of the opening. The invention also comprises a mould for encapsulating electronic components in addition to a method for sealing an interspace between an ejector pin and an opening in a mould part.
摘要翻译：本发明涉及一种能够接收在模具中用于密封安装在载体上的电子部件的模具部件中的顶针（8），其中，大体上圆柱形的推杆（8）设置有侧壁，在该侧壁中至少有一个凹部）靠近端部布置，其与产品接触以便喷射。本发明还涉及一种模具部件（16），其中布置有用于引导推杆的开口，其中至少一个凹部（19）布置在开口的壁中。本发明还包括用于密封电子部件的模具，以及用于密封顶模销和模具部件中的开口之间的间隙的方法。

8. 发明申请

WO2007046704A3 COATING FOR A MOULD FOR ENCAPSULATING ELECTRONIC COMPONENTS 审中-公开
标题翻译：涂料用于封装电子元件
公开(公告)号：WO2007046704A3
公开(公告)日：2007-08-30
申请号：PCT/NL2006050263
申请日：2006-10-20
申请人： FICO BV , DE VRIES FRANCISCUS BERNARDUS , PETERS HENRIKUS JOHANNES BERNA
发明人： DE VRIES FRANCISCUS BERNARDUS , PETERS HENRIKUS JOHANNES BERNA
IPC分类号： B29C33/56 , B29C45/14 , C23C30/00
CPC分类号： B29C33/56 , B29C45/0001 , B29C45/14655 , B29C45/43
摘要： The present invention relates to a coating for a mould for encapsulating electronic components, which composition comprises a nickel/chrome compound wherein the weight ratio of nickel/chrome preferably lies between 20/80 and 80/20 % by weight. The invention also relates to a mould provided with such a coating for feeding encapsulating material to a mould cavity for the purpose of encapsulating electronic components, and to a device intended for this purpose.
摘要翻译：本发明涉及一种用于封装电子元件的模具的涂层，该组合物包括镍/铬化合物，其中镍/铬的重量比优选在20/80至80/20重量％之间。本发明还涉及一种具有这样的涂层的模具，用于将包封材料供给到用于密封电子部件的模腔的模具以及用于此目的的装置。

9. 发明申请

WO2006135237A3 DEVICE AND METHOD FOR PROCESSING ELECTRONIC COMPONENTS WITH A DOUBLE CUTTING FLOW 审中-公开
标题翻译：用双重切割流程处理电子元件的装置和方法
公开(公告)号：WO2006135237A3
公开(公告)日：2007-03-29
申请号：PCT/NL2006050131
申请日：2006-06-01
申请人： FICO BV , WENSINK HENDRIK
发明人： WENSINK HENDRIK
IPC分类号： H01L21/304 , B23K26/067 , B26F3/00 , H01L21/78
CPC分类号： B24C3/322 , B24C1/045 , B26D11/00 , B26F3/004 , H01L21/78
摘要： The present invention relates to a device for processing an assembly of electronic components with at least a double cutting flow, comprising: a power source for generating at least two cutting flows, a double cutter head, a carrier for the assembly of electronic components, and drive means for mutually displacing the double cutter head and the carrier device. The present invention also relates to a method for processing an assembly of electronic components with a cutting flow.
摘要翻译：本发明涉及一种用于处理至少具有双切割流动的电子部件的组件的装置，包括：用于产生至少两个切割流的电源，双切割头，用于组装电子部件的载体，以及用于相互移位双刀头和载体装置的驱动装置。本发明还涉及一种用于处理具有切割流的电子部件的组装的方法。

10. 发明申请

WO2006088365A2 POSITIONING DEVICE, TRANSFER DEVICE AND METHOD FOR POSITIONING A HOLDER FOR ELECTRONIC COMPONENTS 审中-公开
标题翻译：定位装置，转移装置和用于定位电子部件的支架的方法
公开(公告)号：WO2006088365A2
公开(公告)日：2006-08-24
申请号：PCT/NL2006050022
申请日：2006-02-09
申请人： FICO BV , HARMSEN WILHELMUS HENDRIKUS JO , IN DEN BOSCH WILHELMUS JOHANNE
发明人： HARMSEN WILHELMUS HENDRIKUS JO , IN DEN BOSCH WILHELMUS JOHANNE
CPC分类号： H05K13/021
摘要： The present invention relates to a device for positioning a holder for electronic components with an engaging member for engaging the holder. The present invention also relates to a device for positioning and transferring a holder for electronic components, of which the positioning device forms part. The present invention moreover also relates to a method for positioning a holder for electronic components.
摘要翻译：本发明涉及一种用于定位用于电子部件的保持器的装置，其具有用于接合保持器的接合构件。本发明还涉及一种用于定位和传送用于电子部件的保持器的装置，其中定位装置构成其中的一部分。本发明还涉及一种用于定位用于电子部件的保持器的方法。

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