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    • 6. 发明申请
    • VERTICAL JUNCTION FIELD EFFECT TRANSISTOR WITH MESA TERMINATION AND METHOD OF MAKING THE SAME
    • 具有MESA终止的垂直连接场效应晶体管及其制造方法
    • WO2009023502A1
    • 2009-02-19
    • PCT/US2008/072413
    • 2008-08-07
    • SEMISOUTH LABORATORIES, INC.SANKIN, IgorMERRETT, Joseph, Neil
    • SANKIN, IgorMERRETT, Joseph, Neil
    • H01L29/80H01L29/78
    • H01L29/868H01L29/1608H01L29/872
    • A vertical junction field effect transistor (VJFET) having a mesa termination and a method of making the device are described. The device includes: an n-type mesa on an n- type substrate; a plurality of raised n-type regions on the mesa comprising an upper n-type layer on a lower n-type layer; p-type regions between and adjacent the raised n-type regions and along a lower sidewall portion of the raised regions; dielectric material on the sidewalls of the raised regions, on the p-type regions and on the sidewalls of the mesa; and electrical contacts to the substrate (drain), p-type regions (gate) and the upper n-type layer (source). The device can be made in a wide-bandgap semiconductor material such as SiC. The method includes selectively etching through an n-type layer using a mask to form the raised regions and implanting p-type dopants into exposed surfaces of an underlying n-type layer using the mask.
    • 描述具有台面终止的垂直结型场效应晶体管(VJFET)和制造该器件的方法。 该装置包括:n型衬底上的n型台面; 在台面上的多个凸起的n型区域,包括在下n型层上的上n型层; 在凸起的n型区域之间和相邻的凸起区域的下侧壁部分之间的p型区域; 介电材料在凸起区域的侧壁上,在p型区域和台面的侧壁上; 和与基板(漏极),p型区域(gate)和上部n型层(源极)的电接触。 该器件可以制成诸如SiC的宽带隙半导体材料。 该方法包括使用掩模选择性地蚀刻n型层以形成凸起区域,并使用掩模将p型掺杂剂注入到下面的n型层的暴露表面中。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE WITH SURGE CURRENT PROTECTION AND METHOD OF MAKING THE SAME
    • 具有浪涌电流保护的半导体器件及其制造方法
    • WO2007130505A2
    • 2007-11-15
    • PCT/US2007010712
    • 2007-05-01
    • SEMISOUTH LAB INCSANKIN IGORMERRETT JOSEPH NEIL
    • SANKIN IGORMERRETT JOSEPH NEIL
    • H01L29/872H01L29/0619H01L29/1608H01L29/868
    • A wide bandgap semiconductor device with surge current protection and a method of making the device are described. The device comprises a low doped n-type region formed by plasma etching through the first epitaxial layer grown on a heavily doped n-type substrate and a plurality of heavily doped p-type regions formed by plasma etching through the second epitaxial layer grown on the first epitaxial layer. Ohmic contacts are formed on p-type regions and on the backside of the n-type substrate. Schottky contacts are formed on the top surface of the n-type region. At normal operating conditions, the current in the device flows through the Schottky contacts. The device, however, is capable of withstanding extremely high current densities due to conductivity modulation caused by minority carrier injection from p-type regions.
    • 描述了具有浪涌电流保护的宽带隙半导体器件和制造该器件的方法。 该器件包括通过等离子体蚀刻形成的低掺杂n型区域,其通过在重掺杂n型衬底上生长的第一外延层和通过等离子体蚀刻形成的多个重掺杂p型区域形成,该区域通过在 第一外延层。 欧姆接触形成在p型区域和n型衬底的背面上。 在n型区域的顶表面上形成肖特基接触。 在正常工作条件下,器件中的电流流过肖特基触点。 然而,由于由p型区域的少数载流子注入引起的导电性调制,该器件能够承受极高的电流密度。