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    • 10. 发明申请
    • HIGH-DENSITY NROM-FINFET
    • HIGH POET NROM的FinFET
    • WO2004023519A2
    • 2004-03-18
    • PCT/EP0309297
    • 2003-08-21
    • INFINEON TECHNOLOGIES AGHOFMANN FRANZLANDGRAF ERHARDLUYKEN RICHARD JOHANNESROESNER WOLFGANGSPECHT MICHAEL
    • HOFMANN FRANZLANDGRAF ERHARDLUYKEN RICHARD JOHANNESROESNER WOLFGANGSPECHT MICHAEL
    • G11C16/04H01L21/28H01L21/336H01L21/8246H01L21/8247H01L21/84H01L27/115H01L27/12H01L29/786H01L29/788H01L29/792H01R11/22H01R13/62H01L
    • H01L21/28273G11C16/0466H01L21/28282H01L21/845H01L27/115H01L27/11521H01L27/11568H01L27/1203H01L29/66795H01L29/66825H01L29/66833H01L29/785H01L29/7881H01L29/792Y10S257/903Y10S257/904Y10S257/905
    • The invention relates to a semiconductor memory comprising a plurality of memory cells, each memory cell comprising the following: a first conductively doped contact area (S/D), a second conductively doped contact area (S/D) and a channel region arranged therebetween, which are embodied in a plate-type rib (FIN) made of a semiconductor material and which are arranged successively in the above-mentioned order in the longitudinal direction of the rib (FIN), said rib (FIN) having a substantially rectangular shape, according to a cross-sectional view extending in a perpendicular manner with respect to the longitudinal direction of the rib (FIN), comprising an upper rib side (10) and opposite lateral rib surfaces (12, 14); a memory layer (18) which is embodied in order to program the memory cell and which is arranged on the upper rib side (10) and distanced by means a first insulating layer (20), said memory layer (18) protruding over at least one (12) of the lateral rib surfaces (12) in a normal direction of one lateral rib surface (12), such that said one lateral rib surface (12) and the upper rib surface (10) form an injection edge (16) for injecting charge carriers from the channel region into the memory layer (18); and at least one gate electrode (WL1) which is distanced by means of a second insulating layer (22) from said one lateral rib surface (12) and distanced by means of a third insulating layer (29) from the memory layer (18), said gate electrode (WL1) being electrically insulated in relation to the channel region and being embodied in order to control the electrical conductivity thereof.
    • 本发明涉及一种具有多个存储器单元,每个存储器单元包括一个半导体存储器:第一导电掺杂接触区(S / D),第二导电掺杂接触区(S / D)和一个介于沟道区,其中(在网状肋FIN )形成的半导体材料,以及(在肋FIN的纵向方向上按此次序)被布置成一个在另一个后面,其中所述鳍(FIN)至少在垂直(在沟道区延伸到所述肋FIN的长度方向)截面,具有一肋顶部的大致rechtsecksförmige形状 (10)和相对的肋的侧表面(12,14); 所设计的用于通过第一绝缘体层编程所述存储器单元存储层(18)(20)间隔开的肋顶部(10)布置,其中,在一个正常的方向经由肋的侧表面中的至少一个(12)(12)的存储层(18) 肋侧表面(12)突出,以使所述一个肋侧表面(12)和肋顶部(10)形成用于从沟道区的载流子到所述存储层注入(18)的喷射边缘(16); 和至少一个栅极电极(WL1),其通过第二绝缘体层隔开一个(22)的肋侧表面(12)和通过所述存储层(18)的第三绝缘层(29),其中所述沟道区相对的栅电极(WL1),其电 是绝缘的,并适于控制其导电性。