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1. 发明申请

WO2009048330A1 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH PORTIONED LIQUID ENCAPSULATING MATERIAL 审中-公开
标题翻译：用于封装含有液体包封材料的电子元件的方法和装置
公开(公告)号：WO2009048330A1
公开(公告)日：2009-04-16
申请号：PCT/NL2008/050643
申请日：2008-10-09
申请人： FICO B.V. , VAN DRIEL, Albertus Franciscus Gerardus , ZIJL, Joannes Leonardus Jurrian
发明人： VAN DRIEL, Albertus Franciscus Gerardus , ZIJL, Joannes Leonardus Jurrian
IPC分类号： B29C45/14 , B29C31/06 , B29C70/78
CPC分类号： B29C70/78 , B29B9/10 , B29C45/02 , B29C45/14655 , B29C45/1808
摘要： The invention relates to a method for encapsulating electronic components placed on a carrier, wherein non-portioned encapsulating material, which is first melted to form pellets before it is employed for the encapsulation, is fed to an encapsulating device. The invention also relates to a device for encapsulating electronic components in accordance with this method.
摘要翻译：本发明涉及一种用于封装放置在载体上的电子部件的方法，其中未分配的包封材料在其被用于封装之前被首先熔化以形成颗粒，被馈送到封装装置。本发明还涉及根据该方法封装电子部件的装置。

2. 发明申请

WO2013009180A1 DEVICE FOR CLEANING AN ENCAPSULATING DEVICE FOR ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于清洁电子部件的封装装置的装置
公开(公告)号：WO2013009180A1
公开(公告)日：2013-01-17
申请号：PCT/NL2012/050500
申请日：2012-07-12
申请人： FICO B.V. , VENROOIJ, Johannes Lambertus Gerardus Maria , VAN DRIEL, Albertus Franciscus Gerardus
发明人： VENROOIJ, Johannes Lambertus Gerardus Maria , VAN DRIEL, Albertus Franciscus Gerardus
IPC分类号： B08B1/00 , B08B1/02 , B29C33/72 , A46B17/02
CPC分类号： B08B1/007 , A46B5/0004 , A46B17/02 , A46B2200/30 , B08B1/008 , B08B1/02 , B29C33/72
摘要： The invention relates to an assembly (2) for cleaning an encapsulating device (1) for electronic components which consists of a brush (13) with brush elements (14), a drive (16) for displacing the brush (13), a protruding contact element (10) and a suction device (12). The invention further also relates to an encapsulating device (1) for electronic components provided with such a cleaning assembly (2) and to a method for cleaning an encapsulating device (1) for electronic components.
摘要翻译：本发明涉及一种用于清洁电子部件的封装装置（1）的组件（2），该组件由具有刷子元件（14）的刷子（13），用于移动刷子（13）的驱动器（16）接触元件（10）和抽吸装置（12）。本发明还涉及一种用于具有这种清洁组件（2）的电子部件的封装装置（1）以及用于清洁电子部件的封装装置（1）的方法。

3. 发明申请

WO2007001179A3 METHOD AND DEVICE FOR SUPPLYING AND DISCHARGING CARRIERS WITH ELECTRONIC COMPONENTS 审中-公开
公开(公告)号：WO2007001179A3
公开(公告)日：2007-01-04
申请号：PCT/NL2006/050101
申请日：2006-04-25
申请人： FICO B.V. , VAN DRIEL, Albertus, Franciscus, Gerardus , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
发明人： VAN DRIEL, Albertus, Franciscus, Gerardus , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
IPC分类号： H01L21/677 , H01L21/00 , H05K13/00 , B29C45/14
摘要： The invention relates to methods for displacing a carrier (2, 32) with electronic components from a supply container (1, 24, 35) to a processing station (20, 31) , methods for displacing a carrier (2, 32) with electronic components from a processing station(20, 31) to a supply container (3,45) , as well as to methods for supplying to a processing station(20, 31) and discharging from a processing station (20, 31) of carriers (2 , 32) with electronic components. The invention also relates to devices (30) for displacing a carrier (2, 32) with electronic components between a supply container (1, 3, 24, 35,45) and a processing station(20, 31) , and to an assembly of such devices (30) with a processing station (20, 31) for carriers (2, 32) with electronic components .

4. 发明申请

WO1997048530A1 TRANSFER DEVICE AND ARRANGEMENT OF TRANSFER DEVICE AND HEATER 审中-公开
标题翻译：传输设备和传送设备和加热器的布置
公开(公告)号：WO1997048530A1
公开(公告)日：1997-12-24
申请号：PCT/NL1997000327
申请日：1997-06-10
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , VAN DRIEL, Albertus, Franciscus, Gerardus
发明人： FICO B.V.
IPC分类号： B25J17/02
CPC分类号： B25J17/0208 , B25J9/10
摘要： The invention relates to a device (1) for transferring electronic components mounted on a carrier from a feed position to at least two lay-off positions (7). For this purpose the device comprises a manipulator (6) which is movable between a position close to the feed position and positions close to the lay-off positions, wherein the manipulator is provided with positioning means (43) and the feed position and lay-off positions are provided with counter-positioning means (47) for precise positioning of the manipulator close to the feed position and lay-off positions. These positioning means and counter-positioning means can preferably be formed by at least one protrusion and a recess which co-acts with the protrusion and in which the protrusion can be received in close-fitting manner.
摘要翻译：本发明涉及一种用于将安装在载体上的电子部件从进给位置传送到至少两个卸下位置（7）的装置（1）。为此，该装置包括操纵器（6），该操纵器可在靠近进给位置的位置和靠近卸载位置的位置之间移动，其中操纵器设置有定位装置（43）关闭位置设置有用于将机械手精确定位在靠近进给位置和裁切位置的对位定位装置（47）。这些定位装置和反向定位装置可以优选地由至少一个突出部和与突起共同作用的凹部形成，并且突起可以以紧密配合的方式容纳在该凹部中。

5. 发明申请

WO2011008098A2 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE 审中-公开
标题翻译：用控制气体压力封装电子元件的方法和装置
公开(公告)号：WO2011008098A2
公开(公告)日：2011-01-20
申请号：PCT/NL2010050463
申请日：2010-07-19
申请人： FICO BV , GAL WILHELMUS GERARDUS JOZEF , FIERKENS HENRICUS ANTONIUS MARIA , VAN DRIEL ALBERTUS FRANCISCUS GERARDUS
发明人： GAL WILHELMUS GERARDUS JOZEF , FIERKENS HENRICUS ANTONIUS MARIA , VAN DRIEL ALBERTUS FRANCISCUS GERARDUS
IPC分类号： B29C45/34
CPC分类号： B29C45/34 , B29C45/02 , B29C45/14655 , B29C45/77 , B29C2045/14663 , B29C2945/76006 , B29C2945/762 , B29C2945/7622 , B29C2945/76257 , B29C2945/76287 , B29C2945/76381 , B29C2945/76498 , B29C2945/76762 , B29C2945/76779 , B29C2945/76789 , B29C2945/76859 , H01L24/97 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a method for encapsulating electronic components mounted on a carrier, wherein the gas pressure in a venting connecting to the mould cavity is actively increased to an overpressure of at least 3 atmosphere after filling of the mould cavity with encapsulating material. The invention also relates to a device for performing such a method for encapsulating electronic components mounted on a carrier, comprising: mould parts which in a closed position define a mould cavity, feed means for liquid encapsulating material, a venting for suctioning gas from the mould cavity, and a pressure conduit whereby an overpressure can be applied in the venting.
摘要翻译：本发明涉及一种封装安装在载体上的电子部件的方法，其中连接到模腔的通气中的气体压力在用封装材料填充模腔之后积极地增加至至少3个大气压的过压。本发明还涉及一种用于执行这种用于封装安装在载体上的电子部件的方法的装置，包括：在关闭位置限定模腔的模具部件，用于液体封装材料的进料装置，用于从模具抽吸气体的排气空腔和压力管道，由此可以在通风口中施加过压。

6. 发明申请

WO2007001179A2 METHOD AND DEVICE FOR SUPPLYING AND DISCHARGING CARRIERS WITH ELECTRONIC COMPONENTS 审中-公开
标题翻译：用电子元件供应和放电载体的方法和装置
公开(公告)号：WO2007001179A2
公开(公告)日：2007-01-04
申请号：PCT/NL2006050101
申请日：2006-04-25
申请人： FICO BV , VAN DRIEL ALBERTUS FRANCISCUS , VENROOIJ JOHANNES LAMBERTUS GE
发明人： VAN DRIEL ALBERTUS FRANCISCUS , VENROOIJ JOHANNES LAMBERTUS GE
IPC分类号： H01L21/677 , B29C45/14 , H01L21/00 , H05K13/00
CPC分类号： H01L21/67126 , H01L21/67201 , H01L21/67236 , H01L21/67778
摘要： The invention relates to methods for displacing a carrier with electronic components from a supply container to a processing station, methods for displacing a carrier with electronic components from a processing station to a supply container, as well as to methods for supplying to a processing station and discharging from a processing station of carriers with electronic components. The invention also relates to devices for displacing a carrier with electronic components between a supply container and a processing station, and to an assembly of such devices with a processing station for carriers with electronic components.
摘要翻译：本发明涉及用于将具有电子部件的载体从供应容器移动到处理站的方法，用于将具有电子部件的载体从处理站移动到供应容器的方法以及用于向处理站供应的方法和从具有电子部件的载体的处理站放电。本发明还涉及用于在供应容器和处理站之间移动具有电子部件的载体的装置，以及具有用于具有电子部件的载体的处理站的这种装置的组件。

7. 发明申请

WO1997035703A1 MOULD ASSEMBLY AND METHOD FOR USE THEREOF 审中-公开
标题翻译：模具组装及其使用方法
公开(公告)号：WO1997035703A1
公开(公告)日：1997-10-02
申请号：PCT/NL1997000143
申请日：1997-03-19
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , WEGGEN, Martin, Herman , DANNENBERG, Johannes, Lambertus, Martinus , VAN DRIEL, Albertus, Franciscus, Gerardus
发明人： FICO B.V.
IPC分类号： B29C45/02
CPC分类号： B29C45/2675 , B29C45/02 , B29C45/14655 , B29C45/2673
摘要： The invention relates to a mould assembly for encapsulating electronic components mounted on so-called lead frames, comprising: support elements which can be coupled to the sides of the two mould halves remote from the sides closing onto each other. The invention also comprises a method for placing at least a part of such a mould assembly in a pressing device. Another aspect of the invention relates to a mould assembly comprising a base in which can be placed a carriage having at least one mould cavity. Another aspect of the invention relates to a mould assembly wherein a plunger can be connected releasably to a plunger carrier.
摘要翻译：本发明涉及一种用于封装安装在所谓的引线框架上的电子部件的模具组件，包括：支撑元件，其可以耦合到远离彼此闭合的侧面的两个半模的侧面。本发明还包括用于将这种模具组件的至少一部分放置在压制装置中的方法。本发明的另一方面涉及一种包括基座的模具组件，其中可以放置具有至少一个模腔的托架。本发明的另一方面涉及一种模具组件，其中柱塞可以可拆卸地连接到柱塞架。

8. 发明申请

WO2011008098A3 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE 审中-公开
公开(公告)号：WO2011008098A3
公开(公告)日：2011-01-20
申请号：PCT/NL2010/050463
申请日：2010-07-19
申请人： FICO B.V. , GAL, Wilhelmus Gerardus Jozef , FIERKENS, Henricus Antonius Maria , VAN DRIEL, Albertus Franciscus Gerardus
发明人： GAL, Wilhelmus Gerardus Jozef , FIERKENS, Henricus Antonius Maria , VAN DRIEL, Albertus Franciscus Gerardus
IPC分类号： B29C45/34
摘要： The present invention relates to a method for encapsulating electronic components mounted on a carrier, wherein the gas pressure in a venting connecting to the mould cavity is actively increased to an overpressure of at least 3 atmosphere after filling of the mould cavity with encapsulating material. The invention also relates to a device for performing such a method for encapsulating electronic components mounted on a carrier, comprising: mould parts which in a closed position define a mould cavity, feed means for liquid encapsulating material, a venting for suctioning gas from the mould cavity, and a pressure conduit whereby an overpressure can be applied in the venting.

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