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1. 发明申请

WO2009032960A1 MULTI-REGION PROCESSING SYSTEM AND HEADS 审中-公开
标题翻译：多区域处理系统和头
公开(公告)号：WO2009032960A1
公开(公告)日：2009-03-12
申请号：PCT/US2008/075303
申请日：2008-09-05
申请人： INTERMOLECULAR, INC. , ENDO, Rick , WEINER, Kurt , DE, Indranil , TSUNG, James , ZHAO, Maosheng
发明人： ENDO, Rick , WEINER, Kurt , DE, Indranil , TSUNG, James , ZHAO, Maosheng
IPC分类号： H01L21/205
CPC分类号： C23C16/45565 , B05B14/30 , B05B16/80 , B05D1/10 , B05D1/62 , C23C16/4412 , C23C16/45589 , C23C16/4584 , C23C16/4585 , C23C16/4587 , C23C16/50 , Y10S438/942
摘要： The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.
摘要翻译：本发明的各种实施例提供了基板和工艺头在最小空间中访问整个晶片的相对运动，以在基板的各个区域上进行组合处理。这些头使得所描述的室内的现场隔离处理和使用它们的方法被描述。

2. 发明申请

WO2007001663A2 A SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS WITH A PASSIVE SUBSTRATE GRIPPER 审中-公开
标题翻译：一种具有被动衬底剥落器的半导体衬底加工设备
公开(公告)号：WO2007001663A2
公开(公告)日：2007-01-04
申请号：PCT/US2006018703
申请日：2006-05-15
申请人： APPLIED MATERIALS INC , WADENSWEILER RALPH M , ENDO RICK R , KO ALEXANDER S
发明人： WADENSWEILER RALPH M , ENDO RICK R , KO ALEXANDER S
IPC分类号： B65H1/00
CPC分类号： H01L21/68707 , H01L21/67057 , H01L21/67173 , H01L21/67178
摘要： According to one aspect of the present invention, a passive substrate gripper, including first and second segments, is provided. The second segment may be connected to the first segment, and the first and second segments may jointly form a substrate support. The substrate support may be shaped to support a substrate in first position within the substrate support when the substrate support is in a first angular orientation. The substrate may be removable from substrate support in a first direction when in the first position. The substrate may move into a second position when the substrate support is moved into a second angular orientation. The substrate may not be removable in the first direction when in the second position within the substrate support. The passive substrate gripper may also include a support ledge extending from opposing inner surfaces of the first and second segments, on which the substrate is supported.
摘要翻译：根据本发明的一个方面，提供了包括第一和第二段的无源基板夹持器。第二段可以连接到第一段，并且第一和第二段可以共同形成衬底支撑。衬底支撑件可以被成形为当衬底支撑件处于第一角度定向时将衬底支撑在衬底支撑件内的第一位置。当处于第一位置时，衬底可以沿着第一方向从衬底支撑件移除。当衬底支撑件移动到第二角度取向时，衬底可以移动到第二位置。当衬底支撑件内的第二位置时，衬底可能不能沿第一方向移动。无源基板夹持器还可以包括从第一和第二段的相对内表面延伸的支撑凸缘，其上支撑基板。

3. 发明申请

WO2007001663A3 A SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS WITH A PASSIVE SUBSTRATE GRIPPER 审中-公开
公开(公告)号：WO2007001663A3
公开(公告)日：2007-01-04
申请号：PCT/US2006/018703
申请日：2006-05-15
申请人： APPLIED MATERIALS, INC. , WADENSWEILER, Ralph, M. , ENDO, Rick, R. , KO, Alexander, S.
发明人： WADENSWEILER, Ralph, M. , ENDO, Rick, R. , KO, Alexander, S.
IPC分类号： B65H1/00
摘要： According to one aspect of the present invention, a passive substrate gripper, including first and second segments, is provided. The second segment may be connected to the first segment, and the first and second segments may jointly form a substrate support. The substrate support may be shaped to support a substrate in first position within the substrate support when the substrate support is in a first angular orientation. The substrate may be removable from substrate support in a first direction when in the first position. The substrate may move into a second position when the substrate support is moved into a second angular orientation. The substrate may not be removable in the first direction when in the second position within the substrate support. The passive substrate gripper may also include a support ledge extending from opposing inner surfaces of the first and second segments, on which the substrate is supported.

4. 发明申请

WO2009033067A2 COMBINATORIAL PROCESS SYSTEM 审中-公开
标题翻译：组合过程系统
公开(公告)号：WO2009033067A2
公开(公告)日：2009-03-12
申请号：PCT/US2008075459
申请日：2008-09-05
申请人： INTERMOLECULAR INC , ENDO RICK , WEINER KURT , DE INDRANIL , TSUNG JAMES , ZHAO MAOSHENG , CHENG JEREMY
发明人： ENDO RICK , WEINER KURT , DE INDRANIL , TSUNG JAMES , ZHAO MAOSHENG , CHENG JEREMY
IPC分类号： H01L21/20 , C23C16/00 , H01L21/44
CPC分类号： H01L21/32051 , B01J19/0046 , B01J2219/0043 , B01J2219/00536 , B01J2219/00596 , B01J2219/00659 , B01J2219/00745 , B01J2219/00756 , C23C14/042 , C23C14/50 , C23C14/548 , C23C16/45544 , H01L21/67005 , H01L21/6719
摘要： A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.
摘要翻译：提供组合处理室。组合处理室被配置为隔离可旋转的衬底支撑件的径向部分，该可旋转衬底支撑件又被配置为支撑衬底。在一个实施例中，腔室包括多个聚集过程头。在一个实施例中，具有设置在基板支撑件和工艺头之间的基板的插入件限定了用于沉积工艺的约束区域。基板具有能够将沉积材料接近基板的开口。通过基板的旋转和开口的移动，基板的多个区域是可访问的，以在单个基板上执行组合处理。

5. 发明申请

WO2009033067A3 COMBINATORIAL PROCESS SYSTEM 审中-公开
公开(公告)号：WO2009033067A3
公开(公告)日：2009-03-12
申请号：PCT/US2008/075459
申请日：2008-09-05
申请人： INTERMOLECULAR, INC. , ENDO, Rick , WEINER, Kurt , DE, Indranil , TSUNG, James , ZHAO, Maosheng , CHENG, Jeremy
发明人： ENDO, Rick , WEINER, Kurt , DE, Indranil , TSUNG, James , ZHAO, Maosheng , CHENG, Jeremy
IPC分类号： H01L21/20 , H01L21/44 , C23C16/00
摘要： A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

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