会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • OFFSET TEST PADS FOR WLCSP FINAL TEST
    • 用于WLCSP最终测试的偏移测试垫
    • WO2017031027A1
    • 2017-02-23
    • PCT/US2016/046968
    • 2016-08-15
    • ADESTO TECHNOLOGIES CORPORATION
    • PEDERSEN, Bard, M.
    • H01L23/12H01L23/50H01L23/498H01L21/768
    • H01L23/50H01L22/32H01L23/12H01L23/498H01L2224/11
    • A device configured for WLCSP, can include: a first pad; a test pad offset from the first pad; a first RDL path that connects the first pad to the test pad; and a second RDL path that connects the test pad to a solder ball. In another case, a device configured for WLCSP can include: a first pad; a test pad offset from the first pad; a first RDL path that connects the first pad to a solder ball; and a second RDL path that connects the test pad to the solder ball. A wafer having devices configured for WLCSP, can include: a first device having a first pad; a second device having a test pad; a first RDL path that connects the first pad to a solder ball; and a second RDL path that connects the test pad to the solder ball.
    • 配置用于WLCSP的设备可以包括:第一焊盘; 测试垫偏离第一焊盘; 将第一焊盘连接到测试焊盘的第一RDL路径; 以及将测试垫连接到焊球的第二RDL路径。 在另一种情况下,配置用于WLCSP的设备可以包括:第一焊盘; 测试垫偏离第一焊盘; 将第一焊盘连接到焊球的第一RDL路径; 以及将测试焊盘连接到焊球的第二RDL路径。 具有被配置用于WLCSP的器件的晶片可以包括:具有第一焊盘的第一器件; 具有测试垫的第二设备; 将第一焊盘连接到焊球的第一RDL路径; 以及将测试焊盘连接到焊球的第二RDL路径。
    • 5. 发明申请
    • READ LATENCY REDUCTION IN A MEMORY DEVICE
    • 读取存储设备中的延迟时间
    • WO2017151665A1
    • 2017-09-08
    • PCT/US2017/020021
    • 2017-02-28
    • ADESTO TECHNOLOGIES CORPORATION
    • INTRATER, GideonPEDERSEN, BardNAVEH, Ishai
    • G11C7/06G11C7/10G11C7/22G11C8/06
    • G11C8/06G11C5/066G11C7/062G11C7/103G11C7/1057G11C7/106G11C7/22G11C29/021G11C29/028G11C2029/0409G11C2029/5006
    • A memory device can include: a memory array with memory cells arranged as data lines; an interface that receives a read command requesting bytes of data in a consecutively addressed order from an address of a starting byte; a first buffer that stores a first data line from the memory array that includes the starting byte; a second buffer that stores a second data line from the memory array, which is consecutively addressed with respect to the first data line; output circuitry configured to access data from the buffers, and to sequentially output each byte from the starting byte through a highest addressed byte of the first data line, and each byte from a lowest addressed byte of the second data line until the requested data bytes has been output; and a data strobe driver that clocks each byte of data output by a data strobe on the interface.
    • 存储器件可以包括:具有排列为数据线的存储单元的存储器阵列; 接口,其从起始字节的地址以连续寻址的顺序接收请求字节数据的读命令; 第一缓冲器,其存储来自所述存储器阵列的包括所述起始字节的第一数据线; 第二缓冲器,其存储来自所述存储器阵列的第二数据线,所述第二数据线相对于所述第一数据线被连续寻址; 输出电路,被配置为访问来自缓冲器的数据,并且从起始字节顺序地输出每个字节通过第一数据线的最高寻址字节,并且每个字节从第二数据线的最低寻址字节开始直到所请求的数据字节具有 已输出; 以及一个数据选通驱动器,用于为接口上的数据选通器输出的每个字节的数据输出时钟。