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1. 发明申请

WO2006022597A2 SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE 审中-公开
标题翻译：集成电路设备的提供机制
公开(公告)号：WO2006022597A2
公开(公告)日：2006-03-02
申请号：PCT/SG2005/000288
申请日：2005-08-23
申请人： ROKKO SYSTEMS PTE LTD , YANG, Hae Choon
发明人： YANG, Hae Choon
IPC分类号： H01L21/304 , H01L21/677 , B28D5/02
CPC分类号： H01L21/67144 , B28D5/0082 , B28D5/0094 , H01L21/67092 , H01L21/78
摘要： A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).
摘要翻译：用于切割基板以对其内的集成电路单元进行切割的系统包括与卡盘台（4）一起操作的切割机（Z）。提升组件（Ax，Ay）基本上同时从基板（4）移除先前分离的单元的同时将衬底分离到卡盘台（4）上。

2. 发明申请

WO2016105277A1 PROCESSING SYSTEM AND METHOD FOR LARGE SCALE SUBSTRATES 审中-公开
标题翻译：大规模基板的加工系统和方法
公开(公告)号：WO2016105277A1
公开(公告)日：2016-06-30
申请号：PCT/SG2015/050243
申请日：2015-07-30
申请人： ROKKO SYSTEMS PTE LTD
发明人： SHIN, Yun Suk , JUNG, Jong Jae , BAEK, Seung Ho
IPC分类号： H01L21/68 , H01L21/304 , H01L21/67
CPC分类号： H01L21/67144 , H01L24/97 , H01L2924/14
摘要： An alignment assembly for aligning a plurality of IC units, the assembly comprising: a plate having vacuum apertures for receiving said IC units on an engagement surface; a first alignment member having a plurality of projections and recesses uniformly distributed along a first engagement edge; a second alignment member having a plurality of projections and recesses uniformly distributed along a second engagement edge; said first and second alignment members in sliding contact with the engagement surface; wherein said first and second alignment members arranged to move relative to each other so as to intermesh said respective projections and recesses, said intermeshed projections and recesses arranged to define a linear array of rectangular apertures sized to fit said IC units in an aligned condition.
摘要翻译：一种用于对准多个IC单元的对准组件，所述组件包括：具有用于在所述接合表面上接收所述IC单元的真空孔的板; 第一对准构件，其具有沿着第一接合边缘均匀分布的多个突起和凹部; 第二对准构件，具有沿着第二接合边缘均匀分布的多个突起和凹部; 所述第一和第二对准构件与所述接合表面滑动接触; 其中所述第一和第二对准构件被布置成相对于彼此移动以便互相啮合所述相应的突起和凹部，所述相互啮合的突起和凹陷布置成限定矩形孔的线性阵列，其大小适于将所述IC单元配合成对准状态。

3. 发明申请

WO2010053451A3 SYSTEM AND METHOD FOR ENGAGING SINGULATED SUBTRATES 审中-公开
标题翻译：用于接合复合物的系统和方法
公开(公告)号：WO2010053451A3
公开(公告)日：2013-02-28
申请号：PCT/SG2009000406
申请日：2009-11-04
申请人： ROKKO SYSTEMS PTE LTD , BAEK SEUNG HO , JUNG JONG JAE , YANG HAE CHOON
发明人： BAEK SEUNG HO , JUNG JONG JAE , YANG HAE CHOON
IPC分类号： H01L21/683 , H01L21/687
CPC分类号： H05K13/0408 , H01L21/6838 , H01L24/74 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/14
摘要： A unit picker assembly for engaging singulated IC units, the assembly comprising; a plurality of unit pickers, each unit picker having an engagement end for engagement of an IC unit; each of said unit pickers movably mounted to permit movement from a retracted position to a unit engagement position; an actuator assembly arranged to move to a plurality of actuating positions, each of said positions corresponding to one of said unit pickers from the retracted position to the unit engagement position; wherein whilst in any of said actuating positions the actuator assembly is arranged to move the corresponding unit picker from the retracted position to the engagement position.
摘要翻译：一种用于接合单个IC单元的单元选择器组件，该组件包括：多个单元选择器，每个单元选择器具有用于IC单元接合的接合端; 每个所述单元选择器可移动地安装以允许从缩回位置移动到单元接合位置; 致动器组件布置成移动到多个致动位置，每个所述位置对应于所述单元拾取器中的一个从缩回位置到单元接合位置; 其中在所述致动位置中的任何一个中，所述致动器组件布置成使所述对应的单元拾取器从所述缩回位置移动到所述接合位置。

4. 发明申请

WO2012118447A1 IMPROVED SYSTEM FOR SUBSTRATE PROCESSING 审中-公开
标题翻译：改进的基板处理系统
公开(公告)号：WO2012118447A1
公开(公告)日：2012-09-07
申请号：PCT/SG2012/000066
申请日：2012-03-02
申请人： ROKKO SYSTEMS PTE LTD , BAEK, Seung Ho , JUNG, Jong Jae , KIM, Tae Jin
发明人： BAEK, Seung Ho , JUNG, Jong Jae , KIM, Tae Jin
IPC分类号： H01L21/78 , H01L21/66
CPC分类号： H01L21/67288 , B28D5/029 , H01L21/67 , H01L21/67092 , H01L21/67271 , H01L21/67703 , H01L21/681 , H01L21/6838 , H01L22/12 , H01L22/20 , Y10T29/41 , Y10T83/8742
摘要： A method of processing IC units comprising the steps of: dicing said IC units from a substrate; delivering said IC units to a idle block; inspecting a face of said units as exposed during the dicing step using an inspection device whilst said units are on said idle block, then; engaging said units with a picker assembly; passing said units over a second inspection device to inspect an opposed face of said units.
摘要翻译：一种处理IC单元的方法，包括以下步骤：从基底切割所述IC单元; 将所述IC单元传送到空闲块; 在所述单元处于所述空闲块时，使用检查装置检查在切割步骤期间露出的所述单元的面部，然后; 将所述单元与拾取器组件接合; 将所述单元通过第二检查装置以检查所述单元的相对面。

5. 发明申请

WO2008060244A8 NET BLOCK ASSEMBLY 审中-公开
公开(公告)号：WO2008060244A8
公开(公告)日：2008-08-28
申请号：PCT/SG2007000373
申请日：2007-11-05
申请人： ROKKO SYSTEMS PTE LTD , LING NEE SENG , ANG SOO LOO , LIM CHONG CHEN , BAEK SEUNG HO , JUNG JONG JAE , SHIN YUN SUK
发明人： LING NEE SENG , ANG SOO LOO , LIM CHONG CHEN , BAEK SEUNG HO , JUNG JONG JAE , SHIN YUN SUK
IPC分类号： H01L21/00 , B28D5/00
CPC分类号： B28D5/0088 , B28D5/0094 , H01L21/67092 , H01L21/67144 , H01L21/67271
摘要： The present invention relates to a net block assembly in a system for positioning singulated integrated circuits, having a net block surface partially covered by a two dimensional array of first (12) and second elements (14), each first element (12) having an aperture provided with vacuum adapted to receive an integrated circuit and each second element (14) projecting from the surface said net block assembly including a plurality of rows of first (12) and second element (14) arranged in a chequer pattern, wherein the number of elements in the row is an odd number and a buffer row (16) in the array having two first elements (12) arranged adjacent to each other, wherein the number of elements in the buffer row (16) is an odd number.
摘要翻译：本发明涉及用于定位单个化的集成电路的系统中的网块组件，其具有由第一元件（12）和第二元件（14）的二维阵列部分覆盖的网块表面，每个第一元件（12）具有具有适于接收集成电路的真空的孔以及从所述表面突出的每个第二元件（14），所述网状块组件包括布置成方格图案的多排第一元件（12）和第二元件（14），其中，（16）中的元素的数量是奇数，并且该阵列中的缓冲器行（16）具有彼此相邻布置的两个第一元素（12），其中缓冲器行（16）中的元素的数量是奇数。

6. 发明申请

WO2019066722A1 SYSTEM AND METHOD FOR MOUNTING A FLIP CHIP 审中-公开
公开(公告)号：WO2019066722A1
公开(公告)日：2019-04-04
申请号：PCT/SG2018/050465
申请日：2018-09-12
申请人： ROKKO SYSTEMS PTE LTD
发明人： JUNG, Jong Jae , SHIN, Yuk Suk , JANG, Deok Chun
IPC分类号： H01L21/00 , B25J9/00
摘要： A system for mounting a flip chip, comprising: at least one flipper arm, having an engagement end; said flipper arm arranged to rotate in a vertical plane; said engagement end arranged to engage a chip and, on engagement, rotate 180⁰.

7. 发明申请

WO2019032048A1 METHOD AND APPARATUS FOR PCB WASHING 审中-公开
公开(公告)号：WO2019032048A1
公开(公告)日：2019-02-14
申请号：PCT/SG2018/050401
申请日：2018-08-07
申请人： ROKKO SYSTEMS PTE LTD
发明人： SHIN, Yun Suk , JUNG, Jong Jae , JANG, Deok Chun
IPC分类号： H05K3/40 , H01L21/02
摘要： A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units so as to project a ball face downwards, then; washing the ball face.

8. 发明申请

WO2016013981A1 IMPROVED DRY BLOCK ASSEMBLY 审中-公开
标题翻译：改进的干块组件
公开(公告)号：WO2016013981A1
公开(公告)日：2016-01-28
申请号：PCT/SG2015/050228
申请日：2015-07-23
申请人： ROKKO SYSTEMS PTE LTD
发明人： LIM, Chong Chen , BAEK, Seung Ho , JUNG, Jong Jae , SHIN, Yun Suk
IPC分类号： H01L21/683 , B23Q3/08 , H01L21/301 , H01L21/304 , H01L21/673
CPC分类号： H01L21/67333 , H01L21/6838
摘要： A dry block assembly for receiving a plurality of IC units, comprising: a support plate; a rubber layer having an array of vacuum apertures, each aperture arranged to receive an IC unit thereon; a locking device for fixing the rubber layer onto the support plate; wherein the rubber layer is arranged into sections having sub-arrays of apertures, adjacent sections separated by expansion voids.
摘要翻译：一种用于接收多个IC单元的干块组件，包括：支撑板; 具有真空孔阵列的橡胶层，每个孔布置成在其上容纳IC单元; 用于将橡胶层固定到支撑板上的锁定装置; 其中橡胶层被布置成具有孔的子阵列的部分，相邻的部分由膨胀空隙分开。

9. 发明申请

WO2010056209A3 DICING SYSTEM AND METHOD 审中-公开
标题翻译：定标系统及方法
公开(公告)号：WO2010056209A3
公开(公告)日：2013-08-08
申请号：PCT/SG2009000426
申请日：2009-11-16
申请人： ROKKO SYSTEMS PTE LTD , JUNG JONG JAE , BAEK SEUNG HO , LIM CHONG CHEN GARY
发明人： JUNG JONG JAE , BAEK SEUNG HO , LIM CHONG CHEN GARY
IPC分类号： B28D5/02 , H01L21/304 , H01L21/67
CPC分类号： B28D5/029 , B28D5/0082
摘要： A singulation system for dicing IC units from a substrate comprising; a block (30) for receiving said substrate (31), said block movable from a substrate receiving station to a dicing station; a first dicing saw (10) for dicing the substrate when at the dicing station; a second dicing saw (15) for dicing the substrate when at the dicing station; wherein the first and second dicing saws are of different varieties so as to perform different dicing functions on said substrate.
摘要翻译：一种用于从基板切割IC单元的分割系统，包括：用于接收所述衬底（31）的块（30），所述块可从衬底接收站移动到切割站; 第一切割锯（10），用于在切割台处切割基底; 第二切割锯（15），用于在切割台处切割基板; 其中第一和第二切割锯具有不同的品种，从而在所述基板上执行不同的切割功能。

10. 发明申请

WO2011078802A1 ASSEMBLY AND METHOD FOR IC UNIT ENGAGEMENT 审中-公开
标题翻译： IC单元参与的组装和方法
公开(公告)号：WO2011078802A1
公开(公告)日：2011-06-30
申请号：PCT/SG2010/000484
申请日：2010-12-23
申请人： ROKKO SYSTEMS PTE LTD , YANG, Hae Choon , JUNG, Jong Jae , JANG, Deok Chun , LIM, Chong Chen, Gary
发明人： YANG, Hae Choon , JUNG, Jong Jae , JANG, Deok Chun , LIM, Chong Chen, Gary
IPC分类号： H01L21/67 , H01L21/677 , B65H29/00
CPC分类号： H05K13/0408 , H05K13/0413 , H05K13/0478 , Y10T74/18296 , Y10T74/19051
摘要： A picker assembly comprising: a plurality of pickers in selective variable spaced relation; a shaft having a plurality of cam plates, said cam plates co-axial with said shaft and having a variable thickness; said cam plates in engagement with said pickers and positioned in interstitial spaces between said pickers; wherein the selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.
摘要翻译：选择器组件包括：多个选择性可变间隔关系的拾取器; 具有多个凸轮板的轴，所述凸轮板与所述轴同轴并具有可变的厚度; 所述凸轮板与所述拾取器接合并定位在所述拾取器之间的间隙空间中; 其中间隔的选择性变化通过轴的旋转来提供，使得凸轮板的厚度变化沿着平行于轴的轴线移动各个拾取器。

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