专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2011037543A1 PUNCH SINGULATION SYSTEM AND METHOD 审中-公开
标题翻译： PUNCH SINGULATION系统和方法
公开(公告)号：WO2011037543A1
公开(公告)日：2011-03-31
申请号：PCT/SG2010/000360
申请日：2010-09-24
申请人： ROKKO TECHNOLOGY PTE LTD. , YANG, Hae Choon , SHEN, Xue Fang , JANG, Deok Chun , LIM, Chong Chen, Gary , LIM, Siok Chun , SHIN, Yun Suk
发明人： YANG, Hae Choon , SHEN, Xue Fang , JANG, Deok Chun , LIM, Chong Chen, Gary , LIM, Siok Chun , SHIN, Yun Suk
IPC分类号： H01L21/78 , H01L21/677 , B21D28/00 , H01L21/68
CPC分类号： H01L21/67092 , H01L21/67132 , Y10T83/647 , Y10T83/6572
摘要： A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement.
摘要翻译：一种用于分离IC单元的冲压系统，包括：冲压组件，布置成接收衬底并将所述衬底分离成IC单元; 旋转载体，可从第一位置旋转到第二位置，所述旋转载体布置成在第一位置处接收所述单元，并通过旋转将所述单元运送到第二位置; 其中所述旋转载体包括用于容纳所述单元的至少一部分的凹部。一种冲压组件，其包括具有用于接收可选择性地替换的插入件的凹部的模具块，其中所述插入件对应于特定于预定IC封装布置的冲压模式。

2. 发明申请

WO2007126393A3 AN IMPROVED NET TABLE 审中-公开
公开(公告)号：WO2007126393A3
公开(公告)日：2007-11-08
申请号：PCT/SG2007/000122
申请日：2007-04-30
申请人： ROKKO SYSTEMS PTE LTD , LIM, Chong Chen, Gary , BAEK, Seung Ho , JUNG, Jong Jae , SHEN, Xue Fang
发明人： LIM, Chong Chen, Gary , BAEK, Seung Ho , JUNG, Jong Jae , SHEN, Xue Fang
IPC分类号： H01L21/683 , H01L21/673 , H01L21/78 , B28D5/00
摘要： A net table (1 ) comprising a net base plate (5) having an array of regions (25), each for receiving an integrated circuit unit (ICU); each of said regions (25) in communication with a vacuum source; a location device (10) having a plurality of apertures (35), said apertures (35) having peripheral barrier elements (40), wherein the location device (10) and net base plate (5) are arranged such that each region (25) corresponds to an aperture (35), and consequently the peripheral barrier elements (40) and regions (25) forming an array of recesses (55) into which the integrated circuit units (45) fit.

3. 发明申请

WO2006115466A1 IMPROVED NET BLOCK ASSEMBLY 审中-公开
标题翻译：改进的网块组件
公开(公告)号：WO2006115466A1
公开(公告)日：2006-11-02
申请号：PCT/SG2006/000104
申请日：2006-04-26
申请人： ROKKO SYSTEMS PTE LTD , BAEK, Seung Ho, James , LIM, Chong Chen, Gary
发明人： BAEK, Seung Ho, James , LIM, Chong Chen, Gary
IPC分类号： H01L21/673 , H01L21/683 , B28D5/00
CPC分类号： H01L21/67271 , B28D5/0082
摘要： The invention provides a system for positioning integrated circuits singulated from a substrate, the system including a net block in form of a try, (10a), having a surface for receiving the integrated circuits, said surface at least partially covered by a two dimensional array of alternating first and second elements arragned in a chequer pattern. Each first element (10d) is adapted to receive an integrated circuit and each second element (10e) projecting from the surface. Further included is a transport means for transporting the integrated circuits to the net block and positioning a first quantity of the singulated integrated circuits in register with respective first elements; and urging means for urging the portion of integrated circuits into the respective first elements.
摘要翻译：本发明提供了一种用于定位从衬底分离的集成电路的系统，该系统包括一个形式的网状块（10a），具有用于接收集成电路的表面，所述表面至少部分被二维阵列覆盖交替的第一和第二元件被布置成棋盘图案。每个第一元件（10d）适于接纳集成电路，并且每个第二元件（10e）从表面突出。进一步包括用于将集成电路传送到网块并将第一数量的单个集成电路定位成与相应的第一元件对准的传送装置; 以及用于将集成电路的一部分推入相应的第一元件的推动装置。

4. 发明申请

WO2010056209A2 DICING SYSTEM AND METHOD 审中-公开
标题翻译：定标系统及方法
公开(公告)号：WO2010056209A2
公开(公告)日：2010-05-20
申请号：PCT/SG2009/000426
申请日：2009-11-16
申请人： ROKKO SYSTEMS PTE LTD , JUNG, Jong, Jae , BAEK, Seung, Ho , LIM, Chong Chen, Gary
发明人： JUNG, Jong, Jae , BAEK, Seung, Ho , LIM, Chong Chen, Gary
IPC分类号： H01L21/78
CPC分类号： B28D5/029 , B28D5/0082
摘要： A singulation system for dicing IC units from a substrate comprising; a block for receiving said substrate, said block movable from a substrate receiving station to a dicing station; a first dicing saw for dicing the substrate when at the dicing station; a second dicing saw for dicing the substrate when at the dicing station; wherein the first and second dicing saws are of different varieties so as to perform different dicing functions on said substrate.
摘要翻译：一种用于从基板切割IC单元的分割系统，包括：用于接收所述衬底的块，所述块可从衬底接收站移动到切割站; 第一个切割锯，用于在切割站处切割基板; 第二个切割锯，用于在切割台处切割基板; 其中第一和第二切割锯具有不同的品种，从而在所述基板上执行不同的切割功能。

5. 发明申请

WO2007126393A2 AN IMPROVED NET TABLE 审中-公开
标题翻译：改进的网表
公开(公告)号：WO2007126393A2
公开(公告)日：2007-11-08
申请号：PCT/SG2007000122
申请日：2007-04-30
申请人： ROKKO SYSTEMS PTE LTD , LIM CHONG CHEN GARY , BAEK SEUNG HO , JUNG JONG JAE , SHEN XUE FANG
发明人： LIM CHONG CHEN GARY , BAEK SEUNG HO , JUNG JONG JAE , SHEN XUE FANG
IPC分类号： H01L21/683 , B28D5/00 , H01L21/673 , H01L21/78
CPC分类号： H01L21/67333 , H01L21/6838
摘要： A net table comprising a net base plate having an array of regions, each for receiving an integrated circuit unit (ICU); each of said regions in communication with a vacuum source; a location device having a plurality of apertures, said apertures having peripheral barrier elements, wherein the location device and net base plate are arranged such that each region corresponds to an aperture, and consequently the peripheral barrier elements and regions forming an array of recesses into which the integrated circuit units fit.
摘要翻译：一种网表，包括具有区域阵列的网板，每个用于接收集成电路单元（ICU）; 每个所述区域与真空源连通; 具有多个孔的定位装置，所述孔具有周边屏障元件，其中所述定位装置和网基底板被布置成使得每个区域对应于孔，因此周边屏障元件和区域形成凹槽阵列，集成电路单元适合。

6. 发明申请

WO2007073356A3 IMPROVED SINGULATION SYSTEM AND METHOD 审中-公开
标题翻译：改进的模拟系统和方法
公开(公告)号：WO2007073356A3
公开(公告)日：2007-08-16
申请号：PCT/SG2006000399
申请日：2006-12-20
申请人： ROKKO SYSTEMS PTE LTD , LIM CHONG CHEN GARY , BAEK SEUNG HO , JUNG JONG JAE , SHIN YUN SUK , SHEN XUE FANG , LING NEE SENG , ANG SOO LOO
发明人： LIM CHONG CHEN GARY , BAEK SEUNG HO , JUNG JONG JAE , SHIN YUN SUK , SHEN XUE FANG , LING NEE SENG , ANG SOO LOO
IPC分类号： H01L21/00 , B28D5/00 , B81C1/00 , H01L21/304 , H01L21/67 , H01L21/784
CPC分类号： B28D5/0017 , B81C1/00904 , H01L21/67173 , H01L21/67236
摘要： A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a longitudinal cutting device for cutting the linear portions of the IC unit, said cutting means located within a singulation zone.
摘要翻译：一种用于从衬底分离IC单元的系统，所述IC单元具有线性和非线性外围边缘的组合，所述系统包括用于切割IC单元的非线性部分的轮廓切割装置; 用于切割IC单元的线性部分的纵向切割装置，所述切割装置位于分割区内。

7. 发明申请

WO2010056209A3 DICING SYSTEM AND METHOD 审中-公开
标题翻译：定标系统及方法
公开(公告)号：WO2010056209A3
公开(公告)日：2013-08-08
申请号：PCT/SG2009000426
申请日：2009-11-16
申请人： ROKKO SYSTEMS PTE LTD , JUNG JONG JAE , BAEK SEUNG HO , LIM CHONG CHEN GARY
发明人： JUNG JONG JAE , BAEK SEUNG HO , LIM CHONG CHEN GARY
IPC分类号： B28D5/02 , H01L21/304 , H01L21/67
CPC分类号： B28D5/029 , B28D5/0082
摘要： A singulation system for dicing IC units from a substrate comprising; a block (30) for receiving said substrate (31), said block movable from a substrate receiving station to a dicing station; a first dicing saw (10) for dicing the substrate when at the dicing station; a second dicing saw (15) for dicing the substrate when at the dicing station; wherein the first and second dicing saws are of different varieties so as to perform different dicing functions on said substrate.
摘要翻译：一种用于从基板切割IC单元的分割系统，包括：用于接收所述衬底（31）的块（30），所述块可从衬底接收站移动到切割站; 第一切割锯（10），用于在切割台处切割基底; 第二切割锯（15），用于在切割台处切割基板; 其中第一和第二切割锯具有不同的品种，从而在所述基板上执行不同的切割功能。

8. 发明申请

WO2011078802A1 ASSEMBLY AND METHOD FOR IC UNIT ENGAGEMENT 审中-公开
标题翻译： IC单元参与的组装和方法
公开(公告)号：WO2011078802A1
公开(公告)日：2011-06-30
申请号：PCT/SG2010/000484
申请日：2010-12-23
申请人： ROKKO SYSTEMS PTE LTD , YANG, Hae Choon , JUNG, Jong Jae , JANG, Deok Chun , LIM, Chong Chen, Gary
发明人： YANG, Hae Choon , JUNG, Jong Jae , JANG, Deok Chun , LIM, Chong Chen, Gary
IPC分类号： H01L21/67 , H01L21/677 , B65H29/00
CPC分类号： H05K13/0408 , H05K13/0413 , H05K13/0478 , Y10T74/18296 , Y10T74/19051
摘要： A picker assembly comprising: a plurality of pickers in selective variable spaced relation; a shaft having a plurality of cam plates, said cam plates co-axial with said shaft and having a variable thickness; said cam plates in engagement with said pickers and positioned in interstitial spaces between said pickers; wherein the selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.
摘要翻译：选择器组件包括：多个选择性可变间隔关系的拾取器; 具有多个凸轮板的轴，所述凸轮板与所述轴同轴并具有可变的厚度; 所述凸轮板与所述拾取器接合并定位在所述拾取器之间的间隙空间中; 其中间隔的选择性变化通过轴的旋转来提供，使得凸轮板的厚度变化沿着平行于轴的轴线移动各个拾取器。

9. 发明申请

WO2007073356A2 IMPROVED SINGULATION SYSTEM AND METHOD 审中-公开
标题翻译：改进的组合系统和方法
公开(公告)号：WO2007073356A2
公开(公告)日：2007-06-28
申请号：PCT/SG2006/000399
申请日：2006-12-20
申请人： ROKKO SYSTEMS PTE LTD , LIM, Chong Chen, Gary , BAEK, Seung Ho , JUNG, Jong Jae , SHIN, Yun Suk , SHEN, Xue Fang , LING, Nee Seng , ANG, Soo Loo
发明人： LIM, Chong Chen, Gary , BAEK, Seung Ho , JUNG, Jong Jae , SHIN, Yun Suk , SHEN, Xue Fang , LING, Nee Seng , ANG, Soo Loo
IPC分类号： H01L21/00 , H01L21/304 , H01L21/67 , H01L21/784 , B81C1/00 , B28D5/00
CPC分类号： B28D5/0017 , B81C1/00904 , H01L21/67173 , H01L21/67236
摘要： A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a longitudinal cutting device for cutting the linear portions of the IC unit, said cutting means located within a singulation zone.
摘要翻译：一种用于从衬底上分离IC单元的系统，所述IC单元具有线性和非线性周边边缘的组合，所述系统包括用于切割IC单元的非线性部分的轮廓切割装置; 用于切割IC单元的直线部分的纵向切割装置，所述切割装置位于单个区域内。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式