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81. 发明申请

WO01054143A1 RESISTOR AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：电阻器及其制造方法
公开(公告)号：WO01054143A1
公开(公告)日：2001-07-26
申请号：PCT/JP2001/000251
申请日：2001-01-17
IPC分类号： H01C1/14 , H01C1/148 , H01C7/00 , H01C17/00 , H01C17/075 , H01C17/28 , H01C17/06
CPC分类号： H01C17/006 , H01C1/14 , H01C1/148 , H01C7/001 , H01C17/075 , H01C17/283 , H01C17/288 , Y10T29/49082 , Y10T29/49083 , Y10T29/49098 , Y10T29/49099 , Y10T29/49101
摘要： An inexpensive fine resistor produced without a conventional step of changing the mask according to the dimensional rank of a discrete board because classification of discrete boards according to the dimensions is not needed. The resistor comprises a discrete board (11) produced by dividing a sheet insulating board into discrete boards along a slit-like first dividing part and a second dividing part in a perpendicular relation with the first dividing part, a top electrode layer (12) formed on the top of the discrete board (11), a resistor layer (13) so formed as to overlap with the top electrode layer (12), protective layers (14, 16) so formed as to cover the resistor layer (13), and a side electrode layer (17) so formed on the side of the discrete board (11 ) as to be electrically connected to the top electrode layer (12).
摘要翻译：由于不需要根据尺寸的分立板的分类，所以不需要根据分立板的尺寸等级改变掩模的常规步骤而制造的廉价的精细电阻器。电阻器包括通过沿着狭缝状的第一分割部分将片状绝缘板分成离散的板和与第一分割部垂直的第二分割部分而形成的分立板（11），形成的顶部电极层（12）在分立板（11）的顶部，形成与顶部电极层（12）重叠的电阻层（13），形成为覆盖电阻层（13）的保护层（14,16）和形成在离散基板（11）侧面的侧面电极层（17），以电连接到顶部电极层（12）。

82. 发明申请

WO9838652A9 THICK FILM CHIP RESISTOR AND ITS MANUFACTURE 审中-公开
标题翻译：厚膜片电阻及其制造
公开(公告)号：WO9838652A9
公开(公告)日：2001-07-05
申请号：PCT/IB9800133
申请日：1998-02-02
申请人： KONINKL PHILIPS ELECTRONICS NV , PHILIPS SVENSKA AB
发明人： LI HONG JYH , CHANG RUEY TZONG
IPC分类号： H01C17/06 , H01C1/00 , H01C1/142 , H01C7/00 , H01C13/02 , H01C17/00 , H01C17/065
CPC分类号： H01C1/142 , H01C7/003 , H01C13/02 , H01C17/006
摘要： An improved method of manufacturing thick film chip resistors in mass production is described. By applying two or more resistance layers per chip resistor, less variance in the eventual resistance value is obtained if the resistors are manufactured in mass production using substrate plates. Less variance in the resistance value implies less trimming activity, which leads to a considerable cost reduction. Moreover, the use of two or more sub-layers enables application of TCR compensation by applying a resistive material having a positive TCR for one sub-layer and a resistive material having a negative TCR for the other sub-layer.
摘要翻译：描述了大量生产厚膜片式电阻器的改进方法。通过每个芯片电阻器施加两个或更多个电阻层，如果使用基板进行批量生产制造电阻器，则最终电阻值的变化较小。电阻值的较小变化意味着较少的修整活动，这导致相当大的成本降低。此外，使用两个或更多个子层可以通过对一个子层施加具有正TCR的电阻材料和对另一子层具有负TCR的电阻材料来施加TCR补偿。

83. 发明申请

WO00017414A1 TANTALUM FILMS AND METHODS FOR THEIR DEPOSITION 审中-公开
标题翻译： TANTALUM薄膜及其沉积方法
公开(公告)号：WO00017414A1
公开(公告)日：2000-03-30
申请号：PCT/US1999/021739
申请日：1999-09-21
IPC分类号： C01B21/06 , C23C14/06 , C23C14/16 , C23C14/34 , C23C14/54 , C23C14/58 , H01C17/06 , H01C17/12 , H01L21/28 , H01L21/285 , H01L21/318 , H01L21/3205 , H01L21/768 , H01L23/52
CPC分类号： H01L21/76843 , C23C14/0641 , C23C14/165 , C23C14/541 , C23C14/5806 , H01L21/28556 , H01L21/318 , H01L21/76864 , Y10T428/31678
摘要： We have discovered that, by depositing a tantalum layer upon a substrate at a temperature of at least 325 DEG C, it is possible to obtain an ultra low resistivity. In addition, it is possible to deposit a TaxNy film having an ultra low resistivity by depositing the TaxNy film upon a substrate at a temperature of at least 275 DEG C, wherein x is 1 and y ranges from about 0.05 to about 0.18. A combination of elevated substrate temperature and ion bombardment of the film surface during deposition enables the use of lower substrate temperatures while maintaining film properties. In another development, we have discovered that the ultra low resistivity tantalum and TaxNy films produced by the method of the present invention also exhibit particularly low residual stress. Further, these films can be chemical mechanical polished at significantly higher rates (at least 40 % higher rates) than higher resistivity tantalum and TaxNy. This is particularly useful in damascene processes when copper is used as the interconnect metal, since it reduces the possibility of copper dishing during a polishing step.
摘要翻译：我们已经发现，通过在至少325℃的温度下在基底上沉积钽层，可以获得超低电阻率。此外，通过在至少275℃的温度下将TaxNy膜沉积在基底上，可以沉积具有超低电阻率的TaxNy膜，其中x为1，y为约0.05至约0.18。在沉积期间提高的衬底温度和膜表面的离子轰击的组合使得能够使用较低的衬底温度同时保持膜的性质。在另一个发展中，我们发现通过本发明的方法生产的超低电阻率的钽和TaxNy膜也表现出特别低的残余应力。此外，这些膜可以以比较高电阻率钽和TaxNy更高的速率（至少高出40％的速率）进行化学机械抛光。当使用铜作为互连金属时，这对于镶嵌工艺特别有用，因为它减少了在抛光步骤期间铜凹陷的可能性。

84. 发明申请

WO99018586A1 HEATING ELEMENT AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：加热元件与方法研究
公开(公告)号：WO99018586A1
公开(公告)日：1999-04-15
申请号：PCT/AT1998/000233
申请日：1998-10-02
IPC分类号： F42B3/12 , F42B3/198 , H01C1/142 , H01C17/06 , H01C17/065
CPC分类号： H01C17/065 , F42B3/124 , F42B3/198 , H01C1/142 , Y10T29/49099
摘要： The invention relates to a heating element which has a high heating-up rate and which has a predetermined resistance value, for triggering airbag systems. According to the inventive method for producing said heating element, a base consisting of an aluminium oxide ceramic is provided with a glass or glass ceramic coating. The surface of said coating can be lapped and polished if necessary. An extensive layer of AuPd-resinate is applied to the surface of the coating using the silk screen process and then structured into a resistance strip using etching technology. Said resistance strip is constricted in some areas and the ends of the resistance strip are brought into contact with an AgPd-thick-film conductor paste during the silk screen process, the Pd content of said paste being definitive for the desired resistance value. After the thick-film conductor paste has been dried and baked, the coated base is heated at temperatures of between 850 DEG C and 950 DEG C until the palladium in the resistance layer is evenly distributed and a stable resistance value has been established. Solder stop dams in the form of glass stops are arranged on the edges of the AgPd contacts facing the resistance strip in order to reduce the risk of unwanted alloys being formed on the resistance strip during a subsequent soldering process.
摘要翻译：对于具有与气囊系统的点火预定的电阻值高的加热速率加热元件的制造中，基体由具有一个玻璃或玻璃 - 陶瓷涂层的氧化铝陶瓷的设置，AUD如果需要被研磨和抛光的大面积沉积的金钯层的树酯酸screenprinted表面并且然后在具有区域，收缩，通过蚀刻，其中，所述电阻通路的端部在丝网印刷方法用的AgPd厚膜导体糊料，Pd含量为预期的电阻值显著随后联系构图的电阻片。干燥和烧制在850-950℃的范围内的热处理的如此涂覆的基体的厚膜导体浆料是后只要进行钯均匀地分布在所述电阻层和稳定的电阻值被调整。此后，银钯触点的相面对的边缘的电阻路径Lötstopdämme在玻璃纤维条带的形式，以减少在随后的焊接工艺Ablegierens电阻轨迹的风险应用。

85. 发明申请

WO98058390A1 RESISTANCE WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电阻布线及其制造方法
公开(公告)号：WO98058390A1
公开(公告)日：1998-12-23
申请号：PCT/JP1998/002602
申请日：1998-06-12
IPC分类号： H01C1/012 , H01C7/00 , H01C17/06 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/10
CPC分类号： H01C17/06533 , H01C17/281 , H05K1/167 , H05K3/107
摘要： A resistance wiring board which can be reduced in height and has a high accuracy of resistance value and excellent overload characteristics. The wiring board is obtained by forming a stepped pattern between electrode patterns formed on a green sheet and baking the green sheet after filling up the recessed section formed of the stepped pattern with a resistance paste. In addition, the height of the wiring board can be reduced by making the levels of the surfaces of electrodes (1) and a resistor (3) equal to or lower than that of the surface of an insulating substrate (2) by polishing the surface of the wiring board for improving the accuracy of thickness of the resistor (3). In addition, since the green sheet containing 1.5-2.5 wt.% TiO2, 1.5-2.5 wt.% MnO, and 1.5-4.5 wt.% SiO2 is used as a board material and a Pd-Ag electrode paste containing 60 wt.% Pd is used as an electrode material, the board material and electrode paste can be baked collectively at the same time without sacrificing the balance of the coefficients of thermal conductivity of the material and the paste.
摘要翻译：电阻布线板，其高度可降低，电阻值精度高，过载特性优异。通过在形成在生片上的电极图案之间形成阶梯图案并在用电阻膏填充由阶梯图案形成的凹部之后烘烤生片来获得布线板。此外，通过将表面（1）和电阻（3）的表面的等级等于或低于绝缘基板（2）的表面的电平，可以减少布线板的高度，以提高电阻（3）的厚度精度。此外，由于使用含有1.5-2.5重量％TiO 2，1.5-2.5重量％MnO和1.5-4.5重量％SiO 2的生片作为板材料和含有60重量％的Pd-Ag电极浆料， Pd用作电极材料，可以同时烘焙板材和电极糊料，而不牺牲材料和糊料的导热系数的平衡。

86. 发明申请

WO9853311A2 DEVICES AND METHODS FOR USING CENTRIPETAL ACCELERATION TO DRIVE FLUID MOVEMENT IN A MICROFLUIDICS SYSTEM 审中-公开
标题翻译：在微流控系统中使用中心加速驱动流体运动的装置和方法
公开(公告)号：WO9853311A2
公开(公告)日：1998-11-26
申请号：PCT/US9810520
申请日：1998-05-22
申请人： GAMERA BIOSCIENCE CORP
发明人： KELLOGG GREGORY , KIEFFER-HIGGINS STEPHEN G , CARVALHO BRUCE L , DAVIS GENE A , WILLIS JOHN P , MINIOR TED , CHAPMAN LAURA L , KOB MIKAYLA , OELTJEN SARAH D , OMMERT SHARI , MIAN ALEC
IPC分类号： G01N33/48 , B01F13/00 , B01L3/00 , B01L7/00 , B01L9/00 , B81B1/00 , B81B7/04 , F16K13/10 , F16K31/00 , G01N1/10 , G01N21/07 , G01N31/20 , G01N33/483 , G01N35/00 , G01N37/00 , H01C17/06 , H01C17/065 , H01R39/64 , G01N33/00
CPC分类号： H01R39/64 , B01F13/0059 , B01F15/0232 , B01F15/0233 , B01F2215/0037 , B01F2215/0073 , B01L3/5025 , B01L3/5027 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L3/502753 , B01L7/00 , B01L7/52 , B01L9/527 , B01L2200/02 , B01L2200/0605 , B01L2200/0621 , B01L2200/10 , B01L2300/023 , B01L2300/0645 , B01L2300/0806 , B01L2300/0861 , B01L2300/0864 , B01L2300/0867 , B01L2300/087 , B01L2300/0887 , B01L2300/1827 , B01L2300/1838 , B01L2400/0406 , B01L2400/0409 , B01L2400/0415 , B01L2400/0421 , B01L2400/0633 , B01L2400/0661 , B01L2400/0677 , B01L2400/0688 , F16K31/002 , G01N21/07 , G01N35/00069 , H01C17/06586 , Y10S366/03 , Y10S464/90 , Y10T137/1797 , Y10T137/1812 , Y10T137/4643
摘要： This invention provides methods and apparatus for performing microanalytic and microsynthetic analyses and procedures. Specifically, the invention provides a microsystem platform for use with a micromanipulation device to manipulate the platform by rotation, thereby utilizing the centripetal force resulting from rotation of the platform to motivate fluid movement through microchannels embedded in the microplatform. The microsystem platforms of the invention are also provided having microfluidics components, resistive heating elements, temperature sensing elements, mixing structures, capillary and sacrificial valves, and methods for using these microsystems platforms for performing biological, enzymatic, immunological and chemical assays. An electronic spindle designed rotor capable of transferring electrical signals to and from the microsystem platforms of the invention is also provided.
摘要翻译：本发明提供了用于进行微量分析和微合成分析和方法的方法和装置。具体而言，本发明提供了一种微系统平台，用于与微操纵装置一起通过旋转来操纵平台，从而利用由平台的旋转产生的向心力，以激励通过嵌入在微平台中的微通道的流体运动。还提供了本发明的微系统平台，其具有微流体组件，电阻加热元件，温度感测元件，混合结构，毛细管和牺牲阀，以及使用这些微系统平台进行生物，酶，免疫学和化学测定的方法。还提供了一种能够向本发明的微系统平台传送电信号的电子主轴设计的转子。

87. 发明申请

WO98047157A1 RESISTOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电阻及其制造方法
公开(公告)号：WO98047157A1
公开(公告)日：1998-10-22
申请号：PCT/JP1998/001700
申请日：1998-04-14
IPC分类号： H01C1/142 , H01C7/00 , H01C17/00 , H01C17/06 , H01C17/22 , H01C17/242
CPC分类号： H01C17/22 , H01C17/006 , H01C17/242
摘要： A resistor for high-density wiring circuit the resistance value of which precisely falls within a prescribed range regardless of the variation in the position of contact of a probe with a pair of upper-surface electrode layers in a low-resistance area and a method for manufacturing the resistor. The resistor is provided with a substrate (31), a pair of upper-surface electrode layers (32) provided on both sides of the upper surface of the substrate (31), a resistance layer (33) provided so that the layer (33) can be connected electrically to the layers (32), a protective layer (36) formed to cover at least the resistance layer (33), and side-face electrode layers (37) which are provided on the side faces of the substrate (31) so that the layers (37) can be electrically connected to the electrode layers (32) in a state where the layers (37) overlap parts of the upper-surface of the layers (32), the upper-surface electrode layers (32) being provided with notched sections (34) so as to reduce the dispersion of the measured resistance value of the resistor caused by the positional variation of the probe during trimming.
摘要翻译：无论在低电阻区域中探针与一对上表面电极层的接触位置的变化如何，高电阻布线电路的电阻值精确地落在规定范围内，制造电阻器。电阻器设置有基板（31），设置在基板（31）的上表面的两侧的一对上表面电极层（32），电阻层（33），设置成使得层（33））可以与层（32）电连接，形成为覆盖至少电阻层（33）的保护层（36）和设置在基板的侧面上的侧面电极层（37） 31），使得层（37）可以在层（37）与层（32）的上表面的重叠部分，上表面电极层（...）的部分重叠的状态下电连接到电极层（32） 32）设置有切口部（34），以减少由于在修整期间探针的位置变化引起的电阻测得的电阻值的偏差。

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