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    • 74. 发明申请
    • ERASE OPERATION WITH CONTROLLED SELECT GATE VOLTAGE FOR 3D NON-VOLATILE MEMORY
    • 用于3D非易失性存储器的控制选择栅极电压的擦除操作
    • WO2013095831A1
    • 2013-06-27
    • PCT/US2012/065739
    • 2012-11-19
    • SANDISK TECHNOLOGIES, INC.LI, HaiboCOSTA, XiyingZHANG, Chenfeng
    • LI, HaiboCOSTA, XiyingZHANG, Chenfeng
    • G11C16/04G11C16/16G11C16/34
    • G11C16/16G11C16/0483G11C16/344
    • An erase process for a 3D stacked memory device controls a drain-side select gate (SGD) and a source-side select gate (SGS) of a NAND string. In one approach, SGD and SGS are driven to provide a predictable drain-to-gate voltage across the select gates while an erase voltage is applied to a bit line or source line (504, 506, 508). A more consistent gate-induced drain leakage (GIDL) at the select gates can be generated to charge up the body of the NAND string. Further, the select gate voltage can be stepped up with the erase voltage (506) to avoid an excessive drain-to-gate voltage across the select gates which causes degradation. The step up in the select gate voltage can begin with the first erase-verify iteration (512) of an erase operation, or at a predetermined or adaptively determined erase-verify iteration (516), such as based on a number of program-erase cycles.
    • 用于3D堆叠存储器件的擦除处理控制NAND串的漏极侧选择栅极(SGD)和源极选择栅极(SGS)。 在一种方法中,驱动SGD和SGS以在选择栅极上提供可预测的漏极到栅极电压,同时将擦除电压施加到位线或源极线(504,506,508)。 可以产生在选择栅极处更一致的栅极引起的漏极漏极(GIDL),以对NAND串的体进行充电。 此外,可以利用擦除电压(506)来升高选择栅极电压,以避免导致退化的选择栅极两端的漏极 - 栅极电压过大。 选择栅极电压的升高可以从擦除操作的第一擦除验证迭代(512)开始,或者以预定或自适应确定的擦除验证迭代(516)开始,诸如基于编程擦除的次数 周期。
    • 76. 发明申请
    • READ COMPENSATION FOR PARTIALLY PROGRAMMED BLOCKS OF NON-VOLATILE STORAGE
    • 阅读对非易失性存储部分编程块的补偿
    • WO2013028721A1
    • 2013-02-28
    • PCT/US2012/051797
    • 2012-08-22
    • SANDISK TECHNOLOGIES, INC.LEE, DanaOOWADA, Ken
    • LEE, DanaOOWADA, Ken
    • G11C11/56G11C16/34
    • G11C16/3427G11C11/5642
    • Read compensation for partially programmed blocks of non-volatile storage is provided. In partially programmed blocks, the threshold voltage distributions may be shifted down relative to their final positions. Upon receiving a request to read a page that is stored in a block, a determination may be made whether the block is partially programmed. If so, then a suitable compensation may be made when reading the requested page. This compensation may compensate for the non-volatile storage elements (or pages) in the block that have not yet been programmed. The amount of compensation may be based on the amount of interference that would be caused to the requested page by later programming of the other pages. The compensation may compensate for shifts in threshold voltage distributions of the requested page that would occur from later programming of other pages.
    • 提供了部分编程的非易失性存储块的读取补偿。 在部分编程的块中,阈值电压分布可以相对于其最终位置向下移动。 在接收到读取存储在块中的页面的请求时,可以确定块是否被部分编程。 如果是这样,那么在阅读请求的页面时可以做出适当的补偿。 该补偿可以补偿块中尚未编程的非易失性存储元件(或页)。 赔偿金额可以基于通过稍后对其他页面进行编程而对所请求的页面造成的干扰量。 该补偿可以补偿所请求页面的阈值电压分布的变化,该偏移将从其他页面的后续编程发生。
    • 78. 发明申请
    • MEMORY DIE SELF-DISABLE IF PROGRAMMABLE ELEMENT IS NOT TRUSTED
    • 如果可编程元件未被触发,则存储器自动禁止
    • WO2013019713A1
    • 2013-02-07
    • PCT/US2012/048818
    • 2012-07-30
    • SANDISK TECHNOLOGIES, INC.TU, LocHOOK, Charles, MoanaTHEIN, Nyi, Nyi
    • TU, LocHOOK, Charles, MoanaTHEIN, Nyi, Nyi
    • G11C29/00
    • G11C29/832Y10T29/49004
    • Techniques are disclosed herein for automatically self-disabling a memory die in the event that a programmable element on the memory die for indicating whether the memory die is defective cannot be trusted. Memory die are provided with chip enable circuitry to allow particular memory die to be disabled. If the programmable element can be trusted, the state of the programmable element is provided to the chip enable circuitry to enable/disable the memory die based on the state. However, if the programmable element cannot be trusted, then the chip enable circuitry may automatically disable the memory die. This provides a greater yield for multi-chip memory packages because packages having memory die with a programmable element that cannot be trusted can still be used.
    • 在本文中公开了在存储器管芯上用于指示存储器管芯是否有缺陷的可编程元件不能被信任的情况下,自动自身禁用存储器管芯的技术。 存储器管芯具有芯片使能电路,以允许禁止特定存储器管芯。 如果可编程元件可被信任,则可编程元件的状态被提供给芯片使能电路,以基于该状态启用/禁用存储器管芯。 然而,如果可编程元件不能被信任,则芯片使能电路可以自动地禁用存储器管芯。 这为多芯片存储器封装提供了更大的收益,因为仍然可以使用具有不可信任的可编程元件的存储器管芯的封装。
    • 80. 发明申请
    • ALTERNATE BIT LINE BIAS DURING PROGRAMMING TO REDUCE CHANNEL-TO-FLOATING GATE COUPLING IN MEMORY
    • 编程期间的替代位线偏移,以减少存储器中的通道到浮动栅极耦合
    • WO2012087410A1
    • 2012-06-28
    • PCT/US2011/056144
    • 2011-10-13
    • SANDISK TECHNOLOGIES, INC.DUTTA, DeepanshuLUTZE, Jeffrey, W.
    • DUTTA, DeepanshuLUTZE, Jeffrey, W.
    • G11C16/24G11C16/34
    • G11C16/24G11C16/3418G11C16/3436
    • In a non-volatile storage system, capacitive coupling effects are reduced by reducing the probability that adjacent storage elements reach the lockout condition at close to the same program pulse. A slow down measure such as an elevated bit line voltage is applied to the storage elements of a word line which are associated with odd-numbered bit lines, but not to the storage elements associated with even-numbered bit lines. The elevated bit line voltage is applied over a range of program pulses, then stepped down to ground over one or more program pulses. The range of programming pulses over which the slow down measure is applied, can be fixed or determined adaptively. A program pulse increment can be dropped, then increased, when the bit line voltage is stepped down. Storage elements which are programmed to a highest target data state can be excluded from the slow down measure.
    • 在非易失性存储系统中,通过减少相邻存储元件在接近相同的编程脉冲时达到锁定状态的可能性来降低电容耦合效应。 诸如提升的位线电压之类的减速措施被施加到与奇数位线相关联的字线的存储元件,而不是与与偶数位线相关联的存储元件。 升高的位线电压施加在编程脉冲的范围上,然后通过一个或多个编程脉冲降压到地。 施加减速措施的编程脉冲的范围可以自适应地固定或确定。 当位线电压降低时,程序脉冲增量可以下降,然后增加。 被编程为最高目标数据状态的存储元件可以从减速测量中排除。