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41. 发明申请

WO2008091987A2 COMPRESSION CLAMPING OF SEMICONDUCTOR COMPONENTS 审中-公开
标题翻译：半导体元件的压缩钳位
公开(公告)号：WO2008091987A2
公开(公告)日：2008-07-31
申请号：PCT/US2008/051879
申请日：2008-01-24
申请人： INDUCTOTHERM CORP. , FISHMAN, Oleg, S. , PRABHU, Satyen, N.
发明人： FISHMAN, Oleg, S. , PRABHU, Satyen, N.
IPC分类号： B25B1/06
CPC分类号： H01L24/72 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/13034 , Y10T24/44974 , Y10T29/41 , H01L2924/00
摘要： The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally distributed across the opposing surfaces of the devices and associated components. The semiconductor devices and components are located between opposing jaws that are joined together by at least two tie rods, which compressively load the opposing jaws to apply the desired compression force to the semiconductor devices and components. The desired compression force is first achieved in even distribution between independent clamp pressure set point assemblies and the first jaw, where each of the independent clamp pressure set point assemblies is associated with one of the tie rods. Upon final assembly of the clamping device the desired pressure force is achieved across the semiconductor devices and components by compression of the opposing jaws between the one or more semiconductor devices and associated semiconductor components until the clamp pressure indicator elements associated with each of the clamp pressure set point assemblies indicates the desired compression force has been applied.
摘要翻译：本发明涉及一种夹紧装置，用于通过平均分布在装置和相关部件的相对表面上的期望的压缩力来压缩夹持一个或多个半导体器件和相关联的半导体部件。半导体器件和部件位于通过至少两个拉杆连接在一起的相对的夹爪之间，该拉杆压缩地加载相对的夹爪以对半导体器件和部件施加所需的压缩力。所需的压缩力首先在独立夹紧压力设定点组件和第一钳口之间的均匀分布中实现，其中每个独立的夹紧压力设定点组件与一个拉杆相关联。在夹紧装置的最终组装之后，通过在一个或多个半导体器件和相关联的半导体部件之间压缩相对的钳口，跨越半导体器件和部件实现期望的压力，直到夹紧压力指示器元件与每个夹紧压力组点组件表示已经应用了所需的压缩力。

42. 发明申请

WO2007067982A2 FLIP CHIP MLP WITH CONDUCTIVE INK 审中-公开
标题翻译：具有导电墨水的片状芯片MLP
公开(公告)号：WO2007067982A2
公开(公告)日：2007-06-14
申请号：PCT/US2006061799
申请日：2006-12-08
申请人： FAIRCHILD SEMICONDUCTOR
发明人： CHOI SEUNG-YOUNG , SHIAN TI-CHING , ESTACIO MARIA CRISTINA B
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L23/49524 , H01L23/3121 , H01L23/49506 , H01L23/49861 , H01L2224/16225 , H01L2924/1301 , H01L2924/13034 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The invention provides a flip chip molded leadless package (MLP) with electrical paths printed in conducting ink. The MLP includes a taped Ieadframe with a plurality of leads and a non-conducting tape placed thereon. The electrical paths are printed on the tape to connect the features of the semiconductor device to the ieads and an encapsulation layer protects the package. In a second embodiment, the MLP includes a pre-molded leadframe with the electrical paths printed directly thereon. The present invention also provides a method of fabricating the semiconductor package according to each embodiment.
摘要翻译：本发明提供了一种倒装芯片模制无引线封装（MLP），其具有印刷在导电油墨中的电路径。 MLP包括带有多个引线的带状Iead框架和放置在其上的非导电胶带。电气路径被打印在磁带上，以将半导体器件的特征连接到电容层，封装层保护封装。在第二实施例中，MLP包括其中直接印刷有电路径的预成型引线框架。本发明还提供了根据每个实施例的半导体封装的制造方法。

43. 发明申请

WO2005027198A2 DOPED ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：用于电气互连的合金，生产方法及其用途
公开(公告)号：WO2005027198A2
公开(公告)日：2005-03-24
申请号：PCT/US2004028837
申请日：2004-09-07
申请人： HONEYWELL INT INC , DEAN NANCY , FLINT JAMES
发明人： DEAN NANCY , FLINT JAMES
IPC分类号： B23K35/24 , B23K35/26 , H01L20060101 , H01L21/78 , H01L23/48 , H01L23/485 , H01L23/52 , H01L29/40 , H01L
CPC分类号： H01L24/10 , B23K35/24 , B23K35/262 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00014
摘要： Solder materials and dopants described herein comprise at least one solder material, at least one phosphorus-based dopant and at least one copper-based dopant. Methods of forming doped solder materials include: a) providing at least one solder material; b) providing at least one phosphorus-based dopant; c) providing at least one copper-based dopant, and d) blending the at least one solder material, the at least one phosphorus-based dopant and the at least one copper-based dopant to form a doped solder material. Layered materials are also described herein that comprise: a) a surface or substrate; b) an electrical interconnect; c) a solder material comprising at least one phosphorus-based dopant and at least one copper-based dopant, such as those described herein, and d) a semiconductor die or package. Electronic and semiconductor components that comprise solder materials and/or layered materials described herein are also contemplated.
摘要翻译：本文所述的焊料和掺杂剂包括至少一种焊料材料，至少一种磷基掺杂剂和至少一种铜基掺杂剂。形成掺杂焊料的方法包括：a）提供至少一种焊料; b）提供至少一种磷基掺杂剂; c）提供至少一种铜基掺杂剂，以及d）将所述至少一种焊料材料，所述至少一种磷基掺杂剂和所述至少一种铜基掺杂剂共混以形成掺杂的焊料材料。本文还描述了分层材料，其包括：a）表面或基底; b）电互连; c）包含至少一种磷基掺杂剂和至少一种铜基掺杂剂的焊料材料，例如本文所述的那些，以及d）半导体管芯或封装。包括本文所述的焊料材料和/或层状材料的电子和半导体部件也被考虑。

44. 发明申请

WO2004036660A1 A SURFACE MOUNTING TYPE LIGHT EMITTING DIODE 审中-公开
标题翻译：表面安装型发光二极管
公开(公告)号：WO2004036660A1
公开(公告)日：2004-04-29
申请号：PCT/KR2003/001781
申请日：2003-09-01
申请人： TCO CO., LTD , LEE, Hyun-Woo
发明人： LEE, Hyun-Woo
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/13033 , H01L2924/13034 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The present invention is related to a surface mounting type of LED (Light Emitting Diode), whose purpose is, by mounting LED chip of InGaN, GaN type which is the emitting source of LED, on the die pad cup of lead frame which is plated with silver of high reflexibility of light, that the particle of light totally reflected from the chip is emitted toward front, and then the light brightness in package lens surface can be improved. The LED chip of InGaN, GaN type is die bonded and wire bonded, then molded by light transmitting epoxy resin so that the light transmitting epoxy resin in lower part of package can produce a projection of 10-50um approximately comparing the lower part of lead frame in the same plate, and then the upper part and lower part is fixed through penetration hole.
摘要翻译：本发明涉及一种表面安装型LED（发光二极管），其目的是通过将InGaN的LED芯片，作为LED的发光源的GaN型安装在电镀的引线框架的焊盘杯上具有光的高反射性的银，从芯片全反射的光的粒子向前发射，然后可以提高封装透镜表面中的光亮度。 InGaN，GaN型的LED芯片被芯片焊接和引线接合，然后通过透光环氧树脂模制，使得下部封装中的透光环氧树脂可以产生10-50um的投影，大约比较引线框架的下部在相同的板上，然后上部和下部通过穿透孔固定。

45. 发明申请

WO2003058104A1 CIRCUIT PACKAGE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：电路封装及其制造方法
公开(公告)号：WO2003058104A1
公开(公告)日：2003-07-17
申请号：PCT/US2002/040393
申请日：2002-12-17
申请人： MEDTRONIC PHYSIO-CONTROL MANUFACTURING CORP.
发明人： MCLINAY, Ronald, G. , ABBENHOUSE, Martin, S.
IPC分类号： F16L3/08
CPC分类号： H01L23/5385 , H01L25/0652 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： A circuit package (100) with improved heat dissipation properties for high-power circuits. In one embodiment, the circuit package (100) comprises two circuit boards positioned in different planes, at least one brace affixed between the two circuit boards (201 and 202), a molded housing (101) enclosing an area between the circuit boards (201 and 202), and a plurality of electrically conductive leads (110) extending from the sides of the circuit package. The molded housing (101) is configured to expose at least one surface of the circuit boards (201 and 202) to the exterior surface of the circuit package (100). The leads (110) are configured in a J-shape, which allows the circuit package (100) to be mounted in an upright position. The brace functions as a flexible spacer for holding the two circuit boards (201 and 202) in position during the application of the molded housing (101). In one embodiment, an H-bridge circuit (900) is configured on the first and second circuit boards (201 and 202) of the circuit package (100).
摘要翻译：一种电路封装（100），具有改进的大功率电路散热性能。在一个实施例中，电路封装（100）包括定位在不同平面中的两个电路板，固定在两个电路板（201和202）之间的至少一个支架，封装电路板（201）之间的区域的模制外壳和202），以及从电路封装的侧面延伸的多个导电引线（110）。模制外壳（101）被配置为将电路板（201和202）的至少一个表面暴露于电路封装（100）的外表面。引线（110）被构造成J形，其允许电路封装（100）以直立位置安装。支架用作柔性间隔件，用于在施加模制壳体（101）期间将两个电路板（201和202）保持在适当位置。在一个实施例中，H桥电路（900）配置在电路封装（100）的第一和第二电路板（201和202）上。

46. 发明申请

WO02019422A2 METHOD FOR MANUFACTURING DIODE SUBASSEMBLIES USED IN RECTIFIER ASSEMBLIES OF ENGINE DRIVEN GENERATORS 审中-公开
标题翻译：制造电机驱动的发电机整流器组件中使用的二极管分组件的方法
公开(公告)号：WO02019422A2
公开(公告)日：2002-03-07
申请号：PCT/US2001/025428
申请日：2001-08-14
IPC分类号： B23K1/008 , H01L21/60 , H01L23/051 , H01L23/24 , H01L23/04
CPC分类号： H01L24/83 , B23K1/008 , B23K2201/40 , H01L23/051 , H01L23/24 , H01L24/01 , H01L24/29 , H01L2224/29109 , H01L2224/2919 , H01L2224/8319 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/13034 , Y10S438/909 , H01L2924/00 , H01L2924/0133 , H01L2924/3512 , H01L2924/00014
摘要： A method of manufacturing a diode assembly used in rectifier assemblies of engine/driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup on an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.
摘要翻译：本发明涉及一种制造在电动发电机的整流器组件中使用的二极管组件的方法。二极管组件包括杯子，管芯和二极管引线。二极管子系统被熔焊，使得半导体二极管阵列和二极管导体在氩/氢气氛中在二极管杯中熔融结合。在本发明的另一方面，具有支撑二极管引线的可移除引线载体的导体负载位于二极管舟上，使得二极管引线与各个二极管杯对齐。导电载体从导体负载滑动，使得二极管导体落入也包围半导体管芯的中心杯中，并且将二极管盒插入炉中用于焊接融合。

47. 发明申请

WO1998020542A1 ELECTRONIC PARTS DEVICE 审中-公开
标题翻译：电子部件设备
公开(公告)号：WO1998020542A1
公开(公告)日：1998-05-14
申请号：PCT/JP1997004003
申请日：1997-11-04
申请人： HITACHI CHEMICAL COMPANY, LTD. , TAKEMURA, Kenzo , WATANABE, Itsuo , NAGAI, Akira , WATANABE, Osamu , KOJIMA, Kazuyoshi , NAKASO, Akishi , YAMAMOTO, Kazunori , TSURU, Yoshiyuki , INADA, Teiichi , SHIMADA, Yasushi
发明人： HITACHI CHEMICAL COMPANY, LTD.
IPC分类号： H01L21/60
CPC分类号： H05K1/0271 , H01L21/563 , H01L23/145 , H01L23/5383 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07811 , H01L2924/1301 , H01L2924/13034 , H05K3/323 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0133 , H05K2201/068 , H05K2201/10674 , H01L2924/00 , H01L2924/00014
摘要： A mounting board (20) on which a semiconductor chip (10) is mounted is manufactured by subjecting the surface copper foil of a double-sided copper-clad glass-epoxy resin laminated sheet (21) to formation of circuit (32) and inner-layer bonding, sticking an epoxy adhesive film with copper foil upon the surface of the inner-layer circuit under pressure, forming a through hole (25) through the sheet, and subjecting the board to electroless copper plating, formation of circuits (31, 33) by a subtractive method, and solder coating. The bump electrodes (11) of the semiconductor chip (10) are bonded to the board (20) through an adhesive film (40).
摘要翻译：通过对双面覆铜玻璃 - 环氧树脂层压片（21）的表面铜箔进行电路（32）和内部（32）的形成来制造安装有半导体芯片（10）的安装板（20）层压接合，在压力下在内层电路的表面上粘附具有铜箔的环氧粘合膜，通过该片形成通孔（25），并对该板进行无电镀铜，形成电路（31， 33）通过减色法和焊料涂布。半导体芯片（10）的突起电极（11）通过粘合膜（40）与基板（20）接合。

48. 发明申请

WO1997033308A1 Os RECTIFYING SCHOTTKY AND OHMIC JUNCTION AND W/WC/TiC OHMIC CONTACTS ON SiC 审中-公开
标题翻译： Os修整肖特基和OHMIC结和W / WC / TiC OHMIC接触SiC
公开(公告)号：WO1997033308A1
公开(公告)日：1997-09-12
申请号：PCT/US1997003497
申请日：1997-03-04
申请人： 3C SEMICONDUCTOR CORPORATION , PARSONS, James, D.
发明人： 3C SEMICONDUCTOR CORPORATION
IPC分类号： H01L21/283
CPC分类号： H01L24/01 , H01L21/0485 , H01L21/0495 , H01L29/45 , H01L29/47 , H01L29/6606 , H01L29/66068 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01059 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/3025 , H01L2924/00
摘要： Metallic osmium on SiC (either beta or alpha ) forms a contact that remains firmly attached to the SiC surface and forms an effective barrier against diffusion from the conductive metal. On n-type SiC (12), Os (20) forms an abrupt Schottky rectifying junction having essentially unchanged operating characteristics to at least 1050 DEG C and Schottky diodes that remain operable to 1175 DEG C and a barrier height over 1.5 eV. On p-type SiC, Os forms an ohmic contact with specific contact resistance of ohm-cm . Ohmic and rectifying contacts to a TiC layer (30) on a SiC substrate (12) are formed by depositing a WC layer (32) over the TiC layer (30), followed by a metallic W layer (34). Such contacts are stable to at least 1150 DEG C. Electrodes (38) connect to the contacts either directly or via a protective bonding layer (36) such as Pt or PtAu alloy.
摘要翻译： SiC（β或α）上的金属锇形成一个保持牢固地附着在SiC表面上的接触，并形成有效的屏障，防止导电金属的扩散。在n型SiC（12）上，Os（20）形成突变的肖特基整流结，具有基本上不变的工作特性至少为1050℃，肖特基二极管保持可操作至1175℃，势垒高度超过1.5eV。在p型SiC上，Os形成具有<10 -4欧姆 - 厘米2的比接触电阻的欧姆接触。通过在TiC层（30）上沉积WC层（32），随后是金属W层（34）来形成与SiC衬底（12）上的TiC层（30）的欧姆和整流接触。这种接触对于至少1150℃是稳定的。电极（38）直接或通过诸如Pt或PtAu合金的保护性结合层（36）连接到触点。

49. 发明申请

WO1990010731A1 METHOD FOR IMPROVING THE ADHESION OF A PLASTIC ENCAPSULANT TO COPPER CONTAINING LEADFRAMES 审中-公开
标题翻译：一种改善粘合剂对包含铅的铜的粘合剂的方法
公开(公告)号：WO1990010731A1
公开(公告)日：1990-09-20
申请号：PCT/US1990000119
申请日：1990-01-10
申请人： MOTOROLA, INC.
发明人： MOTOROLA, INC. , SPANJER, Keith, Gordon , FLOWERS, Dervin, Leo
IPC分类号： C23F03/02
CPC分类号： C23C22/68 , H01L21/4821 , H01L21/56 , H01L23/49586 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01014 , H01L2924/01078 , H01L2924/12033 , H01L2924/13034 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/45147 , H01L2924/00011
摘要： The adhesion of plastic encapsulants (12) to electrical leadframes (16) containing substanstial amounts of copper is improved by exposing the leadframes to an active oxygen ambient (e.g., 10-30 % H2O2) at temperatures below the leadframe annealing temperature (e.g., room temperature to 100°C) for a few minutes. There is no need to remove the native oxide. A preliminary degreasing step is desirable but not essential. The treatment strengthens any native oxide present on the leadframes without producing an oxide which is so thick as to interfere with subsequent bonding of electronic components or connecting wires to the leadframe. Delamination between the leadframe and the plastic encapsulant by temperature cycling from -65 to 150°C is substantially reduced.

50. 发明申请

WO2014160225A2 PRINTING COMPLEX ELECTRONIC CIRCUITS 审中-公开
标题翻译：打印复杂电子电路
公开(公告)号：WO2014160225A2
公开(公告)日：2014-10-02
申请号：PCT/US2014/026081
申请日：2014-03-13
申请人： NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
发明人： RAY, William Johnstone , BLANCHARD, Richard Austin , LOWENTHAL, Mark David , ORAW, Bradley Steven
IPC分类号： H01L21/98
CPC分类号： H01L24/95 , H01L21/563 , H01L23/3121 , H01L24/06 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/0655 , H01L25/072 , H01L25/0753 , H01L25/18 , H01L25/50 , H01L33/20 , H01L2221/68381 , H01L2224/06181 , H01L2224/24137 , H01L2224/25105 , H01L2224/25174 , H01L2224/32225 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82143 , H01L2224/92244 , H01L2224/95085 , H01L2224/95101 , H01L2224/95102 , H01L2224/95115 , H01L2224/95143 , H01L2224/95146 , H01L2924/10253 , H01L2924/12 , H01L2924/1203 , H01L2924/12041 , H01L2924/13 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H05K1/029 , H05K1/0296 , H05K3/12
摘要： A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.
摘要翻译：可编程电路包括微阵列晶体管或二极管的印刷组阵列。这些装置被预先形成并印刷成油墨并固化。每个组中的设备并联连接，以使每个组充当单个设备。在一个实施例中，每个组中包含约10个设备，因此冗余使得每个组非常可靠。每个组具有终止于衬底上的贴片区域中的至少一个电引线。互连导体图案将贴片区域中的组的至少一些引线互连以产生用于通用电路的定制应用的逻辑电路。这些组也可以互连成逻辑门，并且栅极引线终止于贴片区域。然后，互连导体图案将形成复合逻辑电路的栅极互连。

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