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41. 发明申请

WO1997019169A1 TUMOUR VACCINE AND PROCESS FOR THE PREPARATION THEREOF 审中-公开
标题翻译：肿瘤疫苗及其制备方法
公开(公告)号：WO1997019169A1
公开(公告)日：1997-05-29
申请号：PCT/EP1996005126
申请日：1996-11-21
申请人： BOEHRINGER INGELHEIM INTERNATIONAL GMBH , SCHMIDT, Walter , BIRNSTIEL, Max , SCHWEIGHOFFER, Tamàs , STEINLEIN, Peter , BUSCHLE, Michael
发明人： BOEHRINGER INGELHEIM INTERNATIONAL GMBH
IPC分类号： C12N05/08
CPC分类号： C07K7/06 , A61K39/00 , A61K39/0011 , A61K39/12 , A61K39/145 , A61K39/39 , A61K2039/5154 , A61K2039/55511 , A61K2039/55516 , A61K2039/55522 , A61K2039/55561 , A61K2039/585 , A61K2300/00
摘要： The invention relates to a tumour vaccine and a process for the preparation thereof. The tumour vaccine contains tumour cells, at least a portion of which has at least one MHC-I-haplotype of the patient on the cell surface, and which have been loaded in such a manner with one or a plurality of peptides bonding to the MHC-I-molecule that said tumour cells are recognised as foreign within the context of the peptides by the patient's immune system and trigger a cellular immune response. Loading takes place in the presence of a polycation such as polylysine.
摘要翻译：肿瘤疫苗及其制备方法。含有肿瘤细胞的肿瘤疫苗，其中至少一个部分具有与细胞表面上的患者中的至少一个MHC-I-单倍型，并且已经如此装载有结合至MHC一种或多种肽I分子在该肿瘤细胞中与肽上下文被患者的免疫系统对外的认可，并触发细胞免疫应答。装载在聚阳离子的存在下进行，如聚赖氨酸。

42. 发明申请

WO1997018695A1 PROCESS FOR MAKING MULTI-LAYER FOIL PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：用于生产多层薄膜电路板等
公开(公告)号：WO1997018695A1
公开(公告)日：1997-05-22
申请号：PCT/CH1996000394
申请日：1996-11-06
申请人： DYCONEX PATENTE AG , SCHMIDT, Walter
发明人： DYCONEX PATENTE AG
IPC分类号： H05K03/46
CPC分类号： H05K3/4655 , H05K3/0097 , H05K3/025 , H05K3/4652 , H05K3/4676 , H05K2201/0195 , H05K2201/0355 , H05K2201/0358 , H05K2203/1536
摘要： The invention relates to a process for making printed circuit boards from semi-finished foil products (F.2/6/6'/6") in which at least two semi-finished foil products (F.2/6/6'/6") are bonded together under pressure and temperature via at least two viscous insulating layers (2, 7) which are physically different from each other in that one insulating layer (7) does not melt to liquid form and acts as a spacer, the other insulating layer (2) melts to liquid form during bonding and acts as a bonding agent, a bonding semi-finished foil product (F.2/6/6'/6") with insulating layers (2, 7) is used therefor and spacing insulating layers (7) are applied to conductive layers (1) and bonding insulating layers (2) are applied to spacing insulating layers (7).
摘要翻译：本发明涉及一种用于制造印刷电路板的从半成品箔制品（F.2 / 6/6的方法“/ 6），其中至少两个膜的半成品（F.2 / 6/6” / 6）一起压力和温度的至少两个下粘性绝缘层（2,7）连接，其由绝缘体层物理上彼此不同（7）不会熔化连接并充当间隔装置期间流动，即（2）的其它绝缘体层中流动连接期间熔化并用作连接装置，为了这个目的连接半成品箔制品使用具有绝缘层（F.6 / 6“/ 6）（2，7），并且该空间保持绝缘层（7）被施加到导电层（1）和施加（7）上空间保持绝缘层连接绝缘体层（2）是。

43. 发明申请

WO1997000598A1 CONNECTION SUBSTRATE 审中-公开
标题翻译：连接衬底
公开(公告)号：WO1997000598A1
公开(公告)日：1997-01-03
申请号：PCT/CH1996000218
申请日：1996-06-06
申请人： DYCONEX PATENTE AG , ATOTECH DEUTSCHLAND GMBH , CIBA SC HOLDING AG , FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , TECHNISCHE UNIVERSITÄT DRESDEN , BARTE, Hans-Jürg , LOSERT, Ewald , MEYER, Heinrich , RÖHRS, Günter , RUDOLF, Frank , SCHEEL, Wolfgang , SCHMIDT, Walter , ZUR NIEDEN, Theis
发明人： DYCONEX PATENTE AG , ATOTECH DEUTSCHLAND GMBH , CIBA SC HOLDING AG , FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , TECHNISCHE UNIVERSITÄT DRESDEN
IPC分类号： H05K01/00
CPC分类号： H05K3/284 , H01L23/50 , H01L23/5385 , H01L25/065 , H01L25/162 , H01L2224/16225 , H05K1/0203 , H05K1/189 , H05K3/0058 , H05K2201/0209 , H05K2201/042 , H05K2201/046 , H05K2201/2009 , H05K2203/1316 , Y10S428/901 , Y10T29/49128 , Y10T29/49155
摘要： The proposed method of producing multifunctional multilayered connection substrates involves the following: the connection substrate is built up function by function from the various components, i.e. signal conducting substrate components (19), power supply substrate components (2), thermal substrate components (20), mechanical substrate components (7), and the arrangement of the components (4) and component-bearing substrate components as interdependent functions or modules, are designed and optimised separately before finally being assigned to spatially separated functional areas (inner/outer) of the circuit. The construction process involves connecting the modules to a circuit which forms the connection substrate. The substrate components with fine, compact, flexible and cool elements are assigned to the inner areas of the circuit, while those substrate components with coarse, rigid and warm elements and/or components are assigned to the outer areas of the circuit; a stiffening support material is applied in the outer area in such a way as to give the circuit a mechanical support structure which is designed to have rigid sections which merge into flexible sections. The circuit can be folded and/or wound according to the rigid and flexible sections. The mechanical support structure can be formed by separately manufactured device housing components or by the device housing.
摘要翻译：对于生产具有多种功能的多层互连衬底的方法，是使连接基板的功能的结构通过信号导电基底部件（19），stromversorgende基板份（2），热基底部件（20），机械基底部件（7），以及各部件的布置分开进行（4）或支撑基板份组分分开规划为相互依赖的功能或单独优化模块和最后空间上分开的功能区域（内部/外部）由模块在连接到所述互连衬底体现整体电路中发生分配给整个电路，该结构。基板的与细的，致密的，灵活的和冷却元件的片被分配给整个电路的内部区域，与粗，刚性和温暖的元件和/或与整个电路的外部区域相关联的部件，和一种硬化的载体材料的衬底部分是在外部区域可以被设计，使得电路被赋予机械载体结构，所述载体结构被局部地在越过，总电路根据折叠和/或缠绕在刚性和柔性部分的设计刚性和柔性的区域。机械支撑结构可以通过单独制造设备壳体部件或由装置壳体而形成。

44. 发明申请

WO1996036753A1 CUT-PILE MECHANISM AND PROCESS 审中-公开
标题翻译：切割机械和工艺
公开(公告)号：WO1996036753A1
公开(公告)日：1996-11-21
申请号：PCT/EP1996002145
申请日：1996-05-17
申请人： SCHMIDT, Ursula, Dorothea , SCHMIDT, Walter, Richard
发明人： SCHMIDT, Ursula, Dorothea
IPC分类号： D04B09/12
CPC分类号： D04B23/08
摘要： A process and apparatus for several pile loops in pile forming machines in the manufacturing of velour-like textiles. Severing pile loops is of considerable economical and ecological importance inasmuch as the subsequent shearing of loops can result in considerable loss of pile material and is preferably to be avoided when producing cut pile textiles. In the present invention, the cutting elements (2) are arranged to start out from a mounting position on or adjacent the inactive side or flank of the pile elements (1). The cutting elements (2) then extend, in fact they bend slightly, to contact the opposite side or flank of the pile elements (1), on which side a cutting edge is provided. This arrangement produces smoother cutting conditions and the cutting element is separated from the pile element as soon as severing has occurred and the cutting edges are not pushed apart.
摘要翻译：用于制造丝绒样织物的成型机中的多个回路的工艺和装置。由于随后的循环剪切可能导致堆积材料的相当大的损失，并且优选在生产切割绒毛织物时避免被切割的桩环具有相当的经济和生态重要性。在本发明中，切割元件（2）布置成从桩元件（1）的不活动侧或侧面上的或邻近的安装位置开始。然后，切割元件（2）实际上它们稍微弯曲以接触绒头元件（1）的相对侧或侧面，在该侧面上设置有切割边缘。这种布置产生更平滑的切割条件，并且一旦切割已经发生并且切割边缘没有被推开，切割元件就会与绒头元件分离。

45. 发明申请

WO1995031883A1 PROCESS FOR MANUFACTURING PRINTED CIRCUIT FOILS OR SEMIFINISHED PRODUCTS FOR PRINTED CIRCUIT FOILS, AND THUS MANUFACTURED PRINTED CIRCUIT FOILS AND SEMIFINISHED PRODUCTS 审中-公开
标题翻译：用于生产薄膜电路板或半成品电影电路板和直生产的电路板和半完成的电影
公开(公告)号：WO1995031883A1
公开(公告)日：1995-11-23
申请号：PCT/CH1994000092
申请日：1994-05-18
申请人： DYCONEX PATENTE AG , SCHMIDT, Walter , MARTINELLI, Marco
发明人： DYCONEX PATENTE AG
IPC分类号： H05K03/00
CPC分类号： H05K3/403 , H01L21/4857 , H01L23/5387 , H01L2924/0002 , H05K1/0218 , H05K1/0393 , H05K1/118 , H05K3/0041 , H05K3/0052 , H05K3/3442 , H05K3/363 , H05K3/427 , H05K3/428 , H05K3/4652 , H05K2201/09063 , H05K2201/09081 , H05K2201/0909 , H05K2201/09172 , H05K2203/0554 , H05K2203/0557 , Y10T29/49121 , Y10T29/49171 , Y10T428/24917 , H01L2924/00
摘要： A process is disclosed for manufacturing printed circuit boards, printed circuit foils and semifinished products for printed circuit boards and printed circuit foils from blanks with electroconductive layers (7, 8) that may be structured into conductive patterns and substrates (4) that may be structured for forming connecting means (V), profiles (K) and conductive patterns (L). The connecting means (V), profiles (K) and conductive patterns (L) are structured at the same time or in the same process steps on the blanks. The connecting means (V) and the profiles (K) are part of the structured substrate (4) of the blanks. The electric or mechanical connecting means (V) are placed in a position in which they may be connected and the finished conductive patterns (L) may be detached around the profiles (K).
摘要翻译：本发明涉及一种用于生产印刷电路板，金属箔的电路板和半成品用于电路板和薄膜电路板由前体与结构化到导电图案的导电层（7，8）和可以是结构化的基板（4），用于轮廓的连接装置（V）的形成（K），以及布线图案（L），其中，所述连接装置（V），轮廓（K）和布线图案（L）是在同一时刻或在所述前体的相同的处理步骤，并且所述连接装置（V）和轮廓（K）的所述部分图案化织构的衬底（4）中，前体是，被带到用于在位置上的电或机械连接的连接装置（V）在它们所连接，并且完成了印刷电路的图像（L）上的轮廓（K）是可拆卸的。

46. 发明申请

WO1995021517A1 STRUCTURING OF PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：结构的电路板等
公开(公告)号：WO1995021517A1
公开(公告)日：1995-08-10
申请号：PCT/CH1995000022
申请日：1995-02-01
申请人： DYCONEX PATENTE AG , SCHMIDT, Walter , MARTINELLI, Marco
发明人： DYCONEX PATENTE AG
IPC分类号： H05K03/00
CPC分类号： H05K3/0041 , H05K3/143 , H05K3/184 , H05K3/426 , H05K3/428 , H05K2201/09509 , H05K2203/0542 , H05K2203/0554 , H05K2203/1142
摘要： In the process of the invention for the production of multi-layer film printed circuit boards from semi-finished products (A), with current paths (B) structured in electrically conductive layers (1, 3) and with electrically conductive plating (C, D) from conductive layer (1) to conductive layer (3) through an insulating layer (2), or for the production of semi-finished items for such foil printed circuit boards, in initial steps in the process a structuring agent (7, 7', 13) is applied in a controlled fashion locally to the semi-finished item (A) and cover layers (8, 9) are applied to the surface of the semi-finished item (A). The structuring agent (7, 7', 13) is either applied to the cover layers (8, 9) which are then locally removed or the cover layers (8, 9) are applied to structuring agents (7, 7', 13) and in a further step the structuring agent (7, 7', 13) applied is removed leaving apertures (10, 10') in the cover layers (8, 9) extending as far as the insulating layer (2). In a further step, through or blind holes (11, 11') are locally etched into the insulating layer (2) at the location of the appertures (10, 10') and, to produce electrically conductive plating (C, D), electrically conductive deposition substances (12) are deposited in the through or blind holes (11, 11').
摘要翻译：在用于生产Vorfabrikaten（A）的多层薄膜电路板的新方法，与在导电性层（1,3）构成的电流路径（B），并用由绝缘体层中的导电层的导电性的金属镀层（C，D）（1）与导电层（3）（2），或为半成品用于这种箔的电路板，一个结构的装置（7,7”，13）在第一方法步骤和局部的预制组分（a）和抗蚀剂施加的涂层（8,9）平贴在预制组分（a）进行控制的制造其中，所述结构的装置（7,7”，13）无论是在抗蚀剂涂层（8,9）施加和覆盖层（8,9）局部地除去或者该覆盖层（8,9）的结构的装置（7，7' ， 13）可以被应用，将在另外的方法步骤中，施加的结构的装置（7，7“被除去，13），使得开口（10，10”）（在包覆层8，9）形成，所述绝缘层（ 2）雏 Breichen，在通过进一步的处理步骤或盲孔“在开口的位置（10，10）（11 11）”局部绝缘层中蚀刻（2）和用于产生导电性的金属镀层（C，D）是导电 Abscheidesubstanzen（12）在通或盲孔（11，11“）被沉积。

47. 发明申请

WO1994021808A1 PROCESS FOR PREPARING CANCER VACCINES 审中-公开
标题翻译：用于生产癌症疫苗
公开(公告)号：WO1994021808A1
公开(公告)日：1994-09-29
申请号：PCT/EP1994000859
申请日：1994-03-18
申请人： GENENTECH, INC. , BOEHRINGER INGELHEIM INTERNATIONAL GMBH , BIRNSTIEL, Max, L. , BUSCHLE, Michael , COTTEN, Matthew , MAAS, Gerhard , PLANK, Christian , SCHAFFNER, Gotthold , SCHMIDT, Walter , WAGNER, Ernst , ZATLOUKAL, Kurt
发明人： GENENTECH, INC. , BOEHRINGER INGELHEIM INTERNATIONAL GMBH
IPC分类号： C12N15/87
CPC分类号： C12N7/00 , A61K38/00 , A61K39/0011 , A61K47/50 , A61K48/00 , C07K14/005 , C07K14/485 , C07K14/535 , C07K14/55 , C07K14/57 , C07K14/705 , C12N15/87 , C12N2710/10343 , C12N2710/10361 , C12N2760/20122 , C12Q1/701
摘要： Cancer vaccines are prepared by treating tumor cells or fibroblasts with a complex of immunostimulating polypeptide-coding DNA and of DNA-binding substance, for example polylysine, preferably conjugated with transferrine. The complex further contains a conjugate of DNA-binding substance and of an endosomolytic peptide or an adenovirus having at least one E4 defect or one E1a defect associated with other genetic defects.

48. 发明申请

WO1993026146A1 THERMAL LAYOUT OF THERMOCONDUCTORS 审中-公开
标题翻译：与THERMOKONDUKTOREN THERMO-LAYOUT
公开(公告)号：WO1993026146A1
公开(公告)日：1993-12-23
申请号：PCT/CH1993000148
申请日：1993-06-10
申请人： DYCONEX PATENTE AG , SCHMIDT, Walter , MARTINELLI, Marco
发明人： DYCONEX PATENTE AG
IPC分类号： H05K07/20
CPC分类号： H05K7/205 , H05K1/0206 , H05K1/0287 , H05K1/0289 , H05K1/0393 , H05K1/05 , H05K1/115 , H05K3/0041 , H05K3/0061 , H05K3/0064 , H05K3/0097 , H05K3/386 , H05K3/427 , H05K3/429 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/0394 , H05K2201/0397 , H05K2201/066 , H05K2201/0909 , H05K2201/09327 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09572 , H05K2201/09609 , H05K2201/09627 , H05K2201/09781 , H05K2201/09836 , H05K2201/09945 , H05K2201/10666 , H05K2203/0554 , H05K2203/0746 , H05K2203/1184 , H05K2203/1545 , H05K2203/1572
摘要： According to a process for producing a thermal layout, not only massive heat sinks are provided for absorbing heat, but also an optimized number of thermoconductive strips which distribute the heat over the printed circuit board. In the collecting zones are arranged higher capacity sinks into which the heat is transmitted. The thermoconductive strips may be thermoconductors (TL) provided for that purpose and more massive than the conductive strips for the electric connections, or conductive strips for electric connections, the electroconductors (EL), may also be used for heat transfer. An optimum design interconnects the TL'S and EL's into a functional whole, a thermal management network. With a certain technique, which could be called pocket groove technique, "cooling channels" of a type may be created. Such thermoconductors may be included in the electric layout, so that a thermal layout is superimposed on the connection layout (TL/EL network). Heat distribution and transfer may thus be calculated and optimized by a computer in the same way as the electric distribution by the conductive strips, i.e. the known electric layout, which is produced by a computer-assisted process.

49. 发明申请

WO1985002602A1 POST MIX DISPENSING MACHINE 审中-公开
标题翻译：后混合分配机
公开(公告)号：WO1985002602A1
公开(公告)日：1985-06-20
申请号：PCT/US1984001979
申请日：1984-12-04
申请人： SCHMIDT, Richard, J. , SCHMIDT, Ronald, R. , SCHMIDT, Walter, E. , SCHMIDT, Patrick, J.
IPC分类号： B67D05/62
CPC分类号： B67D1/1286 , B67D1/0021 , B67D1/0047 , B67D2210/00034 , B67D2210/00104 , B67D2210/00152
摘要： A machine (10) for dispensing a freshly mixed cup of juice or other beverage made from concentrate mixed with water immediately prior to the dispensing, comprising a generally U-shaped water reservoir (32), the water in which is kept at an essentially constant level by means of a proximity switch (40) interacting with a solenoid valve (98) located in the principal water supply. Coils (62) of a refrigerant unit (60) are disposed in the reservoir (32) to chill the water to a temperature above the freezing point, and one or more concentrate tanks (34) are located between the arms of the U-shaped reservoir (32), so that concentrate will be chilled to, and maintained at, a desired temperature. Modular pump units (44) are utilized for pumping concentrate into a mixing chamber (78), with a power driven impeller (80) utilized in the mixing chamber (78) to effect a mixing of concentrate with a suitable quantity of water from the reservoir (32). Down time of the machine is minimized by the modular pump units (44) being quickly replaceable in case of malfunction, with the refrigeration unit (60) used in the machine likewise being modularized to permit rapid replacement.

50. 发明申请

WO2012059573A1 IMMUNOGENES PEPTID 审中-公开
标题翻译：免疫原性肽
公开(公告)号：WO2012059573A1
公开(公告)日：2012-05-10
申请号：PCT/EP2011/069403
申请日：2011-11-04
申请人： AFFIRIS AG , BRUNNER, Sylvia , GALABOVA, Gergana , SCHMIDT, Walter , WANKO, Bettina , WINSAUER, Gabriele
发明人： BRUNNER, Sylvia , GALABOVA, Gergana , SCHMIDT, Walter , WANKO, Bettina , WINSAUER, Gabriele
IPC分类号： C07K16/40 , C12N9/64 , A61K47/48
CPC分类号： A61K39/0005 , A61K47/643 , A61K47/646 , A61K2039/55505 , A61K2039/6081 , C07K16/40 , C12N9/6424
摘要： Die vorliegende Erfindung betrifft ein Peptid, welches aus 10 bis 30 Aminosäureresten besteht und von der Aminosäuresequenz SIPWNLERITPPRYRADEYQPPDGGSLVEV (SEQ ID Nr. 1) abgeleitet ist, wobei das Peptid die Aminosäuresequenz SIPWNLERIT umfasst, und ein Vakzin umfassend dieses Peptid.
摘要翻译：本发明涉及一种由10〜30个氨基酸残基和氨基酸序列SIPWNLERITPPRYRADEYQPPDGGSLVEV（SEQ ID NO。1）的肽，其中所述肽包含氨基酸序列SIPWNLERIT和疫苗，其包含该肽。

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