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1. 发明申请

WO2005015104A3 TOWER HEAT SINK WITH SINTERED GROOVED WICK 审中-公开
公开(公告)号：WO2005015104A3
公开(公告)日：2005-02-17
申请号：PCT/US2004/018039
申请日：2004-06-04
申请人： THERMAL CORP. , GARNER, Scott, D. , LINDEMUTH, James, E. , TOTH, Jerome, E. , ROSENFELD, John, H. , MINNERLY, Kenneth, G.
发明人： GARNER, Scott, D. , LINDEMUTH, James, E. , TOTH, Jerome, E. , ROSENFELD, John, H. , MINNERLY, Kenneth, G.
IPC分类号： H05K07/20
摘要： A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.

2. 发明申请

WO1998017089A1 COLD PLATE HAVING UNIFORM PRESSURE DROP AND UNIFORM FLOW RATE 审中-公开
标题翻译：具有均匀压力下降和均匀流量的冷板
公开(公告)号：WO1998017089A1
公开(公告)日：1998-04-23
申请号：PCT/US1997018506
申请日：1997-10-14
申请人： BRAZONICS, INC.
发明人： BRAZONICS, INC. , HOU, Kai
IPC分类号： H05K07/20
CPC分类号： H05K7/20254 , F28F3/027 , F28F3/12 , F28F9/26
摘要： A system for cooling electronic components includes a cold plate having a channel through which a fluid coolant is transported, a plurality of bosses each receiving an electronic, optical, or other heat-generating component, and a plurality of fin structures, at least three of which are adjacently disposed in a sequential order on the cold plate. Each fin structure contacts a boss, and has a fin inlet and a fin outlet in fluid communication with a section of the channel for supplying the area around the boss with coolant and cooling the component seated on the boss. A portion of the channel defines a serpentine path for transporting the fluid coolant to the at least three sequential fin structures in a non-sequential order. Sections of the channel in the serpentine path further transport the coolant in opposite directions, thus enhancing heat transfer and temperature equilibration across the cold plate. The system can further include a plurality of such cooling plates disposed in a vertical stack, and a manifold delivering coolant to the cooling plates. When the cooling plates are stacked, the flow rate and pressure drop across each plate is substantially uniform, thus providing a cold plate having a substantially isothermal surface across a portion of the cold plate.
摘要翻译：用于冷却电子部件的系统包括具有流体冷却剂被输送的通道的冷板，每个都接收电子，光学或其它发热部件的多个凸台，以及多个翅片结构，至少三个其在冷板上以相继的顺序相邻地布置。每个翅片结构接触凸台，并且具有与通道的一部分流体连通的翅片入口和翅片出口，用于将冷却剂供应到凸台周围的区域并冷却坐在凸台上的部件。通道的一部分限定了蛇形路径，用于以非顺序的顺序将流体冷却剂输送到至少三个连续的翅片结构。蛇形通道中的通道的部分进一步沿相反的方向输送冷却剂，从而增强冷板的热传递和温度平衡。该系统还可以包括设置在垂直堆叠中的多个这样的冷却板和将冷却剂输送到冷却板的歧管。当冷却板堆叠时，每个板上的流速和压降基本上是均匀的，因此提供了一个在冷板的一部分上具有基本等温表面的冷板。

3. 发明申请

WO1998010630A1 AN INTEGRATED CIRCUIT PACKAGE 审中-公开
标题翻译：集成电路封装
公开(公告)号：WO1998010630A1
公开(公告)日：1998-03-12
申请号：PCT/US1997011277
申请日：1997-06-27
申请人： INTEL CORPORATION
发明人： INTEL CORPORATION , BANERJEE, Koushik , CHRONEOS, Robert, J., Jr. , MOZDZEN, Tom
IPC分类号： H05K07/20
CPC分类号： H01L23/642 , H01L23/13 , H01L23/49827 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2224/85444 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package (10). The package includes a substrate (12) that has a first internal conductive bus (72) and a second internal conductive bus (74) that are located on a common layer of the substrate and dedicated to different power voltage levels. The busses are coupled to external lands located on a first surface (14) of the package by vias (32) that extend through the substrate. The first and second busses are located on a common layer of the substrate. The package contains an integrated circuit (18) which is mounted to a heat slug (22) that is attached to a second surface of the package. The integrated circuit is coupled to bond fingers located on a shelf of the substrate. Some of the bond fingers (40) are connected to the internal busses by conductive strips (68) that wrap around the edges of the shelf. Some of the vias are connected to a whole group of external lands. Grouping the lands (34g) to a single via reduces the number of vias on the second surface of the package. The reduction in vias allows additional capacitors (28) to be mounted to the second surface of the package.
摘要翻译：集成电路封装（10）。封装包括具有位于衬底的公共层上并专用于不同功率电压电平的第一内部导电总线（72）和第二内部导电总线（74）的衬底（12）。总线通过延伸穿过衬底的通孔（32）耦合到位于封装的第一表面（14）上的外部焊盘。第一和第二总线位于基板的公共层上。该封装包含集成电路（18），该集成电路安装到附接到封装的第二表面上的散热块（22）。集成电路耦合到位于基板的架子上的键指。一些接合指状物（40）通过围绕搁板边缘的导电条（68）连接到内部总线上。一些通道连接到一整套外部土地。将焊盘（34g）分组到单个通孔减少了封装的第二表面上的通孔数量。通孔的减小允许将额外的电容器（28）安装到封装的第二表面。

4. 发明申请

WO1998001015A1 SPRAY-COOLING CIRCUIT BOARD APPARATUS 审中-公开
标题翻译：喷雾冷却电路板装置
公开(公告)号：WO1998001015A1
公开(公告)日：1998-01-08
申请号：PCT/US1997005341
申请日：1997-03-27
申请人： MOTOROLA INC.
发明人： MOTOROLA INC. , BEISE, Thomas, R.
IPC分类号： H05K07/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H05K7/20345 , H01L2924/00
摘要： The circuit board apparatus (10) includes a first layer (12, 14), a second layer (12, 14) and an inner plate (19) disposed between the first layer (12, 14) and the second layer (12, 14). A fluid distributing conduit (38) is disposed in the inner plate (19). The fluid distributing conduit (38) has a first end (22), a central portion (24) defining a chamber, and a second end (26). A first electronic component (28) is disposed within the chamber (24). A nozzle (60) is disposed in the fluid distributing conduit (38). The nozzle (60) receives a fluid, atomizes the fluid and discharges the atomized fluid (70) into the chamber (24).
摘要翻译：电路板装置（10）包括设置在第一层（12,14）和第二层（12,14）之间的第一层（12,14），第二层（12,14）和内板（19））。流体分配管道（38）设置在内板（19）中。流体分配管道（38）具有第一端部（22），限定腔室的中心部分（24）和第二端部（26）。第一电子部件（28）设置在腔室（24）内。喷嘴（60）设置在流体分配管道（38）中。喷嘴（60）接收流体，雾化流体并将雾化的流体（70）排放到室（24）中。

5. 发明申请

WO1997046068A1 COOLING SYSTEM FOR THIN PROFILE ELECTRONIC AND COMPUTER DEVICES 审中-公开
标题翻译：薄型电子和计算机设备冷却系统
公开(公告)号：WO1997046068A1
公开(公告)日：1997-12-04
申请号：PCT/US1997007788
申请日：1997-05-06
申请人： INTEL CORPORATION , O'CONNOR, Michael , HALEY, Kevin , BHATIA, Rakesh , ADAMS, Daniel, Thomas , KAST, Michael, Andrew
发明人： INTEL CORPORATION
IPC分类号： H05K07/20
CPC分类号： G06F1/203
摘要： An apparatus and method for removing heat from a heat generating component located within a thin profile consumer electronic or computer system enclosure is disclosed. In one embodiment, the cooling system of the present invention includes an air duct comprising a thermally conductive housing (10) having internal fins dispersed along the internal walls of the duct. An air flow generator (16) produces an air flow that is directed from an inlet port (13) located at or near the center of the air duct to first and second exit ports (18, 20) located at opposite ends of the duct. A low resistance thermal path, such as a heat pipe, transfers heat from the heat generating component to the air duct housing.
摘要翻译：公开了一种用于从位于薄型消费电子或计算机系统外壳内的发热部件移除热量的装置和方法。在一个实施例中，本发明的冷却系统包括一个空气管道，它包括一个导热壳体（10），该导热壳体具有沿导管内壁分散的内部散热片。气流发生器（16）产生从位于空气管道中心或附近的入口（13）引导到位于管道相对端的第一和第二出口（18,20）的空气流。诸如热管的低电阻热路径将热量从发热部件传递到风管壳体。

6. 发明申请

WO1997046067A1 COOLING SYSTEM FOR THIN PROFILE COMPUTER ELECTRONICS 审中-公开
标题翻译：薄型电脑电子冷却系统
公开(公告)号：WO1997046067A1
公开(公告)日：1997-12-04
申请号：PCT/US1996018075
申请日：1996-11-14
申请人： INTEL CORPORATION , O'CONNOR, Michael , HALEY, Kevin , BHATIA, Rakesh , ADAMS, Daniel, T. , KAST, Michael, A.
发明人： INTEL CORPORATION
IPC分类号： H05K07/20
CPC分类号： G06F1/203
摘要： An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure (120) is disclosed. In one embodiment the cooling system of the present invention includes an air duct (11) comprising a thermally conductive housing (12, 14) having internal fins (50, 52) dispersed along the internal walls of the duct. An air flow generator (16) produces an air flow that is directed from an inlet port (13) located at or near the center of the air duct to first and second exit ports (18, 20) located at opposite ends of the duct. A low resistance thermal path, such as a heat pipe, transfers heat from the heat generating component (80) to the air duct housing.
摘要翻译：公开了一种用于从位于薄型消费电子或计算机系统外壳（120）内的发热部件移除热量的装置和方法。在一个实施例中，本发明的冷却系统包括一个包括导热壳体（12,14）的空气管道（11），该导热壳体具有沿导管内壁分散的内部翅片（50,52）。气流发生器（16）产生从位于空气管道中心或附近的入口（13）引导到位于管道相对端的第一和第二出口（18,20）的空气流。诸如热管的低电阻热路径将热量从发热部件（80）传递到风管壳体。

7. 发明申请

WO1997026781A1 MULTIPLE INTAKE DUCT MICROPROCESSOR COOLING SYSTEM 审中-公开
标题翻译：多功能冰箱微处理器冷却系统
公开(公告)号：WO1997026781A1
公开(公告)日：1997-07-24
申请号：PCT/US1996020611
申请日：1996-12-24
申请人： INTEL CORPORATION , NELSON, Daryl, J.
发明人： INTEL CORPORATION
IPC分类号： H05K07/20
CPC分类号： G06F1/20
摘要： An apparatus for cooling the components within an enclosed computer system. The apparatus includes a first compartment (11) containing a power supply (17) and a fan (12), a second compartment (25) containing a variety of electrical components and an air duct (13) containing the computer system microprocessor (14). The air duct directs an air flow from the exterior of the computer system enclosure across the microprocessor to an inlet opening (29) of the first compartment. Holes are provided within the air duct at points downstream of the microprocessor to permit an air flow from the second compartment into the air duct. The fan generates an air stream through the cooling system and exhausts to the exterior of the computer system enclosure.
摘要翻译：一种用于冷却封闭式计算机系统内的部件的装置。该装置包括容纳电源（17）和风扇（12）的第一隔间（11），包含各种电气部件的第二隔间（25）和包含计算机系统微处理器（14）的空气管道（13）。空气管道将空气流从计算机系统外壳的外部跨过微处理器引导到第一隔室的入口开口（29）。在微处理器下游的点处在空气管道内设置孔，以允许空气从第二隔室进入空气管道。风扇通过冷却系统产生空气流并排放到计算机系统外壳的外部。

8. 发明申请

WO1996036205A1 ENHANCED HEAT SINK 审中-公开
标题翻译：增强散热
公开(公告)号：WO1996036205A1
公开(公告)日：1996-11-14
申请号：PCT/US1996006696
申请日：1996-05-10
申请人： INTERNATIONAL ELECTRONIC RESEARCH CORPORATION
发明人： INTERNATIONAL ELECTRONIC RESEARCH CORPORATION , CHOW, Peter, S.
IPC分类号： H05K07/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An enhanced fluid cooled finned heat sink (10) is provided wherein slots (22, 24, 26, 28) are formed in the leading edges of fins (12, 14) to disrupt and delay the formation of a thermally insulating fluid boundary layer (34) at the surface of the fins (12, 14).
摘要翻译：提供了一种增强的流体冷却翅片散热器（10），其中在散热片（12,14）的前缘中形成有槽（22,24,26,28），以破坏和延迟隔热流体边界层（14）的表面。

9. 发明申请

WO1996017506A1 HOUSING WITH EQUIPMENT HEAT-LIBERATING 审中-公开
标题翻译：用设备热休息
公开(公告)号：WO1996017506A1
公开(公告)日：1996-06-06
申请号：PCT/IB1995001015
申请日：1995-11-16
申请人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB
发明人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB , LAVIOLETTE, Kerry, D. , UHL, Robert, F. , VINKENVLEUGEL, Lucias, T.
IPC分类号： H05K07/20
CPC分类号： H05K7/20545
摘要： A rack of electronic equipment is convection cooled. Each unit in the rack has oblique cooling fins oriented in a same direction, to cause heated air to flow to a hot air pathway by a chimney effect, and to draw surrounding air along a cool air pathway to each of the units. A preferred unit has two housing sections thermally insulated from each other. Each housing section has its cooling fins on a side surface, some of the fins being aligned with fins on the other section, so that cooling air flows first over the cooler section and then over the hotter section. The cooler section is arranged for enhanced heat transfer from a heat sensitive element, and heat liberating units are heat sinked to the hotter section.
摘要翻译：电子设备架是对流冷却的。机架中的每个单元具有朝向相同方向的倾斜冷却片，以使热空气通过烟囱效应流到热空气通道，并且沿着冷空气通道将周围的空气抽吸到每个单元。优选的单元具有彼此热绝缘的两个壳体部分。每个壳体部分在侧面具有其散热片，其中一些翅片与另一部分上的翅片对准，使得冷却空气首先流过冷却器部分，然后在较热部分上方流动。冷却器部分设置用于增强从热敏元件的热传递，并且放热单元被散热到较热部分。

10. 发明申请

WO1995026125A1 TWO-PHASE THERMAL BAG COMPONENT 审中-公开
标题翻译：两相热袋组件
公开(公告)号：WO1995026125A1
公开(公告)日：1995-09-28
申请号：PCT/US1995003651
申请日：1995-03-22
申请人： AAVID LABORATORIES, INC.
发明人： AAVID LABORATORIES, INC. , LARSON, Ralph, I. , PHILLIPS, Richard, L.
IPC分类号： H05K07/20
CPC分类号： H01L23/433 , F28D15/0241 , F28D15/0266 , F28F3/12 , F28F21/065 , F28F2265/12 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A two-phase liquid cooling system for an electronic component comprised of flexible sealed bag which is partially filled with a liquid coolant. Sufficient residual non-condensing gas is maintained in the bag so that some of the gas dissolves in the liquid coolant when the device is not operating and at ambient temperature. During warm-up, the residual gas comes out of solution and creates nucleation sites that assist in initiating boiling. The bag is air and fluid-impermeable, and has sufficient flexibility such that as coolant vaporizes, the bag expands to maintain the internal bag pressure substantially the same as the ambient environmental pressure. The bag may also be provided with a metal heat spreader plate which passes through a wall of the bag and assists with transferring heat from the component to the coolant. The heat spreader plate may be specially treated to allow the flexible bag material to be directly heat sealed to the plate and to provide nucleation sites to enhance coolant boiling.
摘要翻译：一种用于电子部件的两相液体冷却系统，包括部分填充有液体冷却剂的柔性密封袋。足够的残余非冷凝气体保持在袋中，使得当装置不工作并且在环境温度时，一些气体溶解在液体冷却剂中。在预热期间，残余气体从溶液中排出，并产生有助于开始沸腾的成核位点。该袋是空气和流体不可渗透的，并具有足够的柔性，使得当冷却剂蒸发时，袋膨胀以保持内袋压力基本上与周围环境压力相同。该袋还可以设置有穿过袋的壁的金属散热板，并有助于将热量从部件传递到冷却剂。可以特别处理散热板以使柔性袋材料直接热封在板上并提供成核位置以增加冷却剂沸腾。

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