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    • 21. 发明申请
    • METHOD FOR PREVENTING AND TREATING ALZHEIMER´S DISEASE
    • 预防和治疗阿尔茨海默病的方法
    • WO2006005707A2
    • 2006-01-19
    • PCT/EP2005053225
    • 2005-07-06
    • MATTNER FRANKSCHMIDT WALTER
    • MATTNER FRANKSCHMIDT WALTER
    • A61K39/00A61K38/08A61P25/28G01N33/68
    • G01N33/6896A61K39/0007G01N2800/2821
    • The invention relates to the use of a compound comprising the following amino acid sequence X 1 X 2 X 3 X 4 X 5 X 6 X 7 , wherein X1 is an amino acid, except of C, X 2 is an amino acid, except of C, X 3 is an amino acid, except of C, X 4 is an amino acid, except of C, X 5 is an amino acid, except of C, X 6 is not present or any amino acid, X 7 is not present or any amino acid, and wherein X 1 X 2 X 3 X 4 X 5 X 6 is not DAEFRH, said compound having a binding capacity to an antibody being specific for the natural N-terminal Aß42 sequence DAEFRH, and 5-mers thereof having a binding capacity to said antibody being specific for the natural N-terminal Aß42 sequence DAEFRH, for the preparation of a vac- cine for Alzheimer's disease.
    • 本发明涉及包含以下氨基酸序列X 1,X 2,X 3,X 4,N 2的化合物的用途 其中X 1是除C以外的氨基酸,X 2是(C 1 -C 6) 除了C,X 3 N以外的氨基酸是氨基酸,除了C以外,X 4是氨基酸,除了C,X 5, / SUB>是除C以外的氨基酸,不存在X 6或不存在任何氨基酸,X 7不存在或任何氨基酸,并且其中X < SUB> 1 X 2 X 3 X 4 X 5 X 6 不是DAEFRH,所述化合物具有对天然N端Aβ42序列DAEFRH特异性的抗体的结合能力,并且具有对所述抗体的结合能力的5聚体对于天然N-末端Aβ42序列DAEFRH是特异性的 ,用于制备阿尔茨海默病疫苗。
    • 27. 发明申请
    • STRUCTURED PRINTED CIRCUIT BOARDS AND FILMS AND PROCESS FOR PRODUCING THEM
    • 结构化板及薄膜电路板和方法及其
    • WO1995002312A1
    • 1995-01-19
    • PCT/CH1994000134
    • 1994-06-24
    • DYCONEX PATENTE AGMARTINELLI, MarcoSCHMIDT, Walter
    • DYCONEX PATENTE AG
    • H05K03/00
    • H05K3/428H05K1/0393H05K3/0041H05K3/28H05K2203/0554H05K2203/0557H05K2203/0574Y10T29/49126Y10T29/49156Y10T29/49165
    • The invention relates to multi-layer printed circuit boards, film printed circuit boards and semi-finished products for printed circuit films and a process for their production, with through-plating (12) structured in insulator layers (2), structured apertures (4, 4') in cover layers (A, A') of the surfaces (O, O'), current tracks (SP) structured in conductive layers and contact points (K, K'). To reduce the number of photochemical structuration operations required, the through-plating (12) and the cover apertures (4, 4') are mechanically structured in that pre-formed through-plating apertures (10, 10') are etched in insulating layers (2) in accordance with through-plating structures (8, 8') of masking films (7, 7'), electrically conductive substances are deposited in the through-plating apertures (10, 10') to form contact layers (11) in said through-plating apertures (10) and apertures (4, 4') are etched in accordance with contact structures (3, 3') of masking films (7, 7') in cover layers (A, A') in such a way that the apertures (4, 4') form cover-material-free regions on the printed circuit boards and film printed circuit boards and on the semi-finished products for such printed circuit boards and the apertures (4, 4') are freely shaped so as to be cylindrical, round, oval, square, rectangular or polygonal.
    • 本发明涉及多层印刷电路板,金属箔的电路板和半成品为箔的电路板和用于生产其的方法,具有结构化在绝缘体层(2)的界面连接(12),在覆盖层的表面的(A,A“)的结构覆盖开口(4,4”)( O,O“),在导体层构成的电流路径(SP),(与接触点K,K”),由此减少所需的光化学结构的数目的界面连接(12)和所述覆盖开口(4,4“)在机械结构 通过在绝缘体层(2) '根据Durchplattierungsstrukturen(8,8掩模箔)(7,7')预处理Durchplattierungsöffnungen(10,10) '被蚀刻,即在Durchplattierungsöffnungen(10,10')的导电Abscheidesubstanzen以形成 在Durchplattierungsöffnungen接触层(11)(10)通过并在覆盖层(A,A ')覆盖的开口(4,4')中分离 根据“(以这样的方式被蚀刻掩模箔7,7)的接触结构(3,3)”的是,覆盖开口(4,4“)上的电路板,箔电路板和在半成品这种箔的电路板形式abdeckmaterialfreie区域和覆盖开口(4, 包括4“)的工作自由形成的,圆筒形,圆形,椭圆形和正方形,矩形,多边形的直径。