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11. 发明申请

WO2006113754A2 UNDERFILL DISPENSE AT SUBSTRATE APERTURE 审中-公开
标题翻译：在基板孔径下进行配置
公开(公告)号：WO2006113754A2
公开(公告)日：2006-10-26
申请号：PCT/US2006/014631
申请日：2006-04-19
申请人： TEXAS INSTRUMENTS INCORPORATED , ODEGARD, Charles, Anthony , COWENS, Marvin, Wayne , STIBOREK, Leon
发明人： ODEGARD, Charles, Anthony , COWENS, Marvin, Wayne , STIBOREK, Leon
IPC分类号： H01L21/00
CPC分类号： H01L23/13 , H01L21/563 , H01L24/28 , H01L2224/73203 , H01L2224/83102 , H01L2224/92125 , H01L2924/01033 , H01L2924/14
摘要： An IC assembly (10) having a die mounted on a substrate (16) with a gap therebetween, receives underfill material (12) through an aperture (32) provided in the substrate to fill the gap. This provides a favorable flow rate and improved underfilling, with less voiding. Embodiments of the invention are disclosed in which capillary action, a vacuum, or positive pressure, are used to assist the flow of underfill material.
摘要翻译：具有安装在其间具有间隙的衬底（16）上的管芯的IC组件（10）通过设置在衬底中的孔（32）接收底部填充材料（12）以填充间隙。这提供了有利的流速和改进的底部填充，孔隙少。公开了本发明的实施例，其中使用毛细管作用，真空或正压来辅助底部填充材料的流动。

12. 发明申请

WO2005055130A1 電子装置の製造方法审中-公开
标题翻译：电子设备制造方法
公开(公告)号：WO2005055130A1
公开(公告)日：2005-06-16
申请号：PCT/JP2004/017939
申请日：2004-12-02
申请人：日立化成工業株式会社 , 田崎耕司 , 石坂裕宣 , 渋谷正仁 , 田中耕輔 , 新沢正久
发明人：田崎耕司 , 石坂裕宣 , 渋谷正仁 , 田中耕輔 , 新沢正久
IPC分类号： G06K19/00
CPC分类号： H01Q1/2208 , G06K19/07749 , G06K19/0775 , H01L21/563 , H01L24/28 , H01L24/33 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2221/68354 , H01L2223/6677 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81203 , H01L2224/81801 , H01L2224/83102 , H01L2224/838 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01Q23/00 , H01L2924/00 , H01L2924/00015 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips (100), each having external electrodes formed on a pair of opposing surfaces. One (102) of the electrodes is arranged on an antenna circuit (201) in a transmission/reception antenna having a slit. Furthermore, a shortcircuit plate (300) is arranged for separately and electrically connecting the other external electrode (103) to a predetermined position of the corresponding antenna circuit (201). The method is characterized in that by positioning at least one of the IC chips (100) with the predetermined position on the corresponding antenna circuit (201) to be mounted, it is possible to arrange the remaining IC chips (100) at the predetermined positions on the antenna circuit (201) all at once.
摘要翻译：提供一种电子装置制造方法，能够以高生产率以低成本制造具有优选的通信特性的装置。该制造方法用于制造包括多个IC芯片（100）的电子设备，每个IC芯片具有形成在一对相对表面上的外部电极。电极中的一个（102）布置在具有狭缝的发送/接收天线中的天线电路（201）上。此外，短路电路板（300）被布置用于将另一个外部电极（103）分别电连接到相应的天线电路（201）的预定位置。该方法的特征在于，通过将IC芯片（100）中的至少一个与要安装的相应天线电路（201）上的预定位置进行定位，可以将剩余的IC芯片（100）布置在预定位置在天线电路（201）上。

13. 发明申请

WO2004084303A3 FLIP-CHIP ARRANGMENT ON A SUBSTRATE CARRIER 审中-公开
标题翻译：倒装芯片配置在衬底载体
公开(公告)号：WO2004084303A3
公开(公告)日：2004-12-23
申请号：PCT/DE2004000504
申请日：2004-03-12
申请人： INFINEON TECHNOLOGIES AG , HEINEMANN ERIK , PUESCHNER FRANK
发明人： HEINEMANN ERIK , PUESCHNER FRANK
IPC分类号： G06K19/077 , H01L21/56 , H01L23/485 , H01L23/498
CPC分类号： H01L24/10 , G06K19/07745 , G06K19/07747 , H01L21/563 , H01L23/49855 , H01L23/49866 , H01L24/13 , H01L24/28 , H01L24/45 , H01L24/48 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/0401 , H01L2924/00012
摘要： An arrangement with a substrate carrier (S) comprising a first surface (O1) on which outer contact elements (AK) are disposed, a second opposite surface (O2) on which chip contact elements are disposed, whereby the contact elements of the two surfaces are electrically interconnected (D) through the substrate (S), and a chip (IC), whereby the side (K) which is provided with contact points (B) faces the second surface and is electrically connected to the chip contact elements (CK) and whereby the thickness (D2) of the chip is greater than the thickness of the substrate (S). The contact points (B) of the chip (IC) are made of a metal which has a different degree of hardness than that of the chip contact elements (CK).
摘要翻译：装置，其包括具有第一表面（01）到外接触元件（AK）的衬底支撑件（S）被安装，在芯片接触元件（CK）的第二相对表面（O2）被安装，其特征在于，两个表面的接触元件（通过基片 S）被传递电连接到彼此（D）和其（与接触点B）面向所述第二表面设置侧（K）的芯片（IC），和（与芯片接触元件CK）被电连接，并且WOEI厚度（模具的D2）比基板（S）的厚度大。芯片（IC）的接触点（b）为具有具有不同程度的硬度的接触元件的芯片（CK）的金属形成。

14. 发明申请

WO2004105119A2 VERFAHREN ZUM HERSTELLEN EINER CHIPANORDNUNG UND LACK ZUR DURCHFÜHRUNG DES VERFAHRENS 审中-公开
标题翻译：一种用于生产芯片配置和油漆的执行方法
公开(公告)号：WO2004105119A2
公开(公告)日：2004-12-02
申请号：PCT/EP2004/004879
申请日：2004-05-07
申请人： MICRONAS HOLDING GMBH , KLAPPROTH, Holger
发明人： KLAPPROTH, Holger
IPC分类号： H01L21/58
CPC分类号： H01L24/83 , H01L24/28 , H01L24/31 , H01L25/0657 , H01L25/50 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01032 , H01L2924/01047 , H01L2924/01058 , H01L2924/01068 , H01L2924/01077 , H01L2924/0781
摘要： Bei einem Verfahren zum Herstellen einer Chipanordnung (1) werden mindestens zwei, jeweils wenigstens eine elektrische Kontaktstelle (3) aufweisende Halbleiterchips (2) bereitgestellt. Die Halbleiterchips (2) und eine Kontaktierungsschicht (6) werden derart angeordnet, dass die Halbleiterchips (2) mit ihren Kontaktstellen (3) einander zugewandt und die Kontaktstellen (3) über die Kontaktierungsschicht (6) miteinander verbunden sind. Die Kontaktierungsschicht (6) wird aus magnetisch leitfähigen Partikeln (4), einem ersten Isolierwerkstoff (5a) und einem zweiten Isolierwerkstoff (5b) hergestellt. Die Partikel (4) werden mit dem zweiten Isolierwerkstoff (5b) ummantelt und dann zusammen mit ihrer Ummantelung in dem zweiten Isolierwerkstoff (5b) angeordnet. Nach dem Beschichten der Kontaktstelle(n) werden die Isolierwerkstoffe (5a, 5b) durch eine Wärmebehandlung in einem zwischen den Kontaktstellen (3) befindlichen Bereich aufgeschmolzen und die Lage wenigstens eines Partikels (4) wird mit Hilfe eines Magnetfelds derart verändert, dass die Kontaktstellen (3) über den wenigstens einen Partikel (3) elektrisch miteinander verbunden sind. Danach werden die Isolierwerkstoffe (5a, 5b) durch Abhühlen verfestigt.
摘要翻译：在用于制造芯片装置（1），至少两个，在每种情况下（3），其具有所述半导体芯片的至少一个电接触点的方法（2）提供。半导体芯片（2）和接触层（6）被布置成使得（2），具有它们的接触点（3）彼此面对和接触层上的接触点（3）（6）相互连接的半导体芯片。所述接触层（6）由磁性导电粒子（4），第一绝缘材料（5a）和第二绝缘材料（5b）的。颗粒（4）覆盖有第二绝缘材料（5b）和然后用它们的壳中放置在一起的第二绝缘材料（5b）的。涂布后，接触点（一个或多个），绝缘材料（5A，5B）熔化位于通过热处理在所述接触之间的点（3）区域，和至少一个粒子（4）的位置是通过磁场的方式改变，使得在接触点（3）经由所述至少一个粒子电连接（3）。此后，将绝缘材料（5A，5B）由Abhühlen固化。

15. 发明申请

WO01043518A1 CHIP PACKAGE WITH MOLDED UNDERFILL 审中-公开
标题翻译：芯片包装与模制底漆
公开(公告)号：WO01043518A1
公开(公告)日：2001-06-14
申请号：PCT/US2000/032438
申请日：2000-12-07
IPC分类号： H01L21/56 , H01L23/31 , H05K7/06 , H01L23/12
CPC分类号： H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L24/28 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/83136 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , Y10T29/49146 , H01L2924/00
摘要： An integrated circuit chip package (10) includes a chip (12) mounted on a substrate (14) by solder bumps and a reflow process. At least one standoff is located between the chip (12) and the substrate (14) to maintain a distance between the chip (12) and the substrate (14) during the reflow process. A mold compound (16) is used for underfilling air gaps between the chip (12) and the substrate (14). The chip package (10) is formed by placing the chip (12) and substrate (14) within a mold cavity and pressing a transfer mold compound (16) into the cavity. Air spaces between the chip (12) and substrate (14) are underfilled by the mold compound (16) as it is pressed in between the chip (12), standoffs and substrate (14). Air is allowed to escape from between the chip (12) and substrate (14) during the underfilling through a vent (26) extending through the substrate (14). The underfilling material (16) may be used to encapsulate the chip (12) at the same time underfilling is performed.
摘要翻译：集成电路芯片封装（10）包括通过焊料凸块和回流工艺安装在基板（14）上的芯片（12）。至少一个间隔位于芯片（12）和衬底（14）之间，以在回流过程期间保持芯片（12）和衬底（14）之间的距离。模具化合物（16）用于在芯片（12）和基板（14）之间的空气填充中充填。芯片封装（10）通过将芯片（12）和基板（14）放置在模腔内并将转移模具化合物（16）压入空腔中而形成。芯片（12）和基板（14）之间的空气间隙被压在芯片（12），支座和基板（14）之间时由模具化合物（16）充满。在底部填充期间允许空气通过穿过基底（14）的通气孔（26）从芯片（12）和基底（14）之间逸出。底部填充材料（16）可以用于在进行填充的同时封装芯片（12）。

16. 发明申请

WO01020658A1 WAFER COATING METHOD FOR FLIP CHIPS 审中-公开
标题翻译：用于卷烟的波纹涂布方法
公开(公告)号：WO01020658A1
公开(公告)日：2001-03-22
申请号：PCT/US2000/025133
申请日：2000-09-14
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60
CPC分类号： H01L21/563 , H01L24/28 , H01L2224/1148 , H01L2224/16 , H01L2224/274 , H01L2224/73203 , H01L2224/83856 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043
摘要： A method for applying an underfill and edge coating to a flip chip is described. The method includes the steps of adhering a bumped wafer to an expandable carrier substrate, sawing the wafer to form individual chips, stretching the carrier substrate in a bidirectional manner to form channels between each of the individual chips, applying an underfill material to the bumped surfaces of the chips and around the edges of the chips, cutting the underfill material in the channels between the chips and removing the individual, underfill coated chips from the carrier.
摘要翻译：描述了将底部填充和边缘涂层施加到倒装芯片的方法。该方法包括以下步骤：将凸起的晶片粘附到可扩展的载体基板上，锯切晶片以形成单独的芯片，以双向方式拉伸载体基板，以在各个芯片之间形成通道，将底部填充材料施加到凸起的表面的芯片和芯片的边缘周围，切割芯片之间的通道中的底部填充材料，并从载体上去除单独的，未填充的涂覆的芯片。

17. 发明申请

WO1998029261A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：WO1998029261A1
公开(公告)日：1998-07-09
申请号：PCT/JP1996003815
申请日：1996-12-26
申请人： HITACHI, LTD. , USAMI, Mitsuo
发明人： HITACHI, LTD.
IPC分类号： B42D15/10
CPC分类号： H01L21/4846 , G06K19/0723 , G06K19/07743 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L23/5388 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/28 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/05599 , H01L2224/1147 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/81903 , H01L2224/8319 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/05042 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/1305 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2924/3512 , H01L2224/85399
摘要： The techniques for providing an IC ship with a plurality of second bonding pads electrically connected to a plurality of first bonding pads having a predetermined small pitch and provided on the IC chip. Owing to the techniques, the second pads can be provided in desired positions, so that the wires for connecting the second pads and a plurality of electrodes, which are provided on a substrate, together can be formed by low-precision printing. When the second pads and the electrodes formed on the substrate by printing are aligned with each other, the second pads and the electrodes on the substrate can be connected together electrically in an opposed state.
摘要翻译：提供具有电连接到具有预定小间距并且设置在IC芯片上的多个第一接合焊盘的多个第二接合焊盘的IC船的技术。由于这些技术，可以将第二焊盘设置在期望的位置，使得用于将第二焊盘和设置在基板上的多个电极连接在一起的电线可以通过低精度打印形成。当通过印刷形成在基板上的第二焊盘和电极彼此对准时，第二焊盘和衬底上的电极可以以相反的状态电连接在一起。

18. 发明申请

WO1995004786A2 ADHESIVE PASTE CONTAINING POLYMERIC RESIN 审中-公开
标题翻译：含粘合剂的聚合树脂
公开(公告)号：WO1995004786A2
公开(公告)日：1995-02-16
申请号：PCT/US1994008680
申请日：1994-07-28
申请人： DIEMAT, INC.
发明人： DIEMAT, INC. , DIETZ, Raymond, Louis , PECK, David, Martin
IPC分类号： C09J00/00
CPC分类号： H01L24/28 , C08L2666/14 , C09J9/02 , C09J201/00 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01076 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12033 , H01L2924/14 , H01L2924/19043 , H05K1/092 , H01L2924/00
摘要： Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
摘要翻译：有机聚合物树脂的粘合剂浆料，无机填料和流体液体可用于管芯附着应用。

19. 发明申请

WO1993017059A1 RAPIDLY CURING ADHESIVE AND METHOD 审中-公开
标题翻译：快速固化粘合剂和方法
公开(公告)号：WO1993017059A1
公开(公告)日：1993-09-02
申请号：PCT/US1993002217
申请日：1993-02-25
申请人： JOHNSON MATTHEY INC.
发明人： JOHNSON MATTHEY INC. , NGUYEN, Mr., N.
IPC分类号： C08G59/68
CPC分类号： H01L24/83 , C08G73/0661 , C09J179/08 , H01B1/22 , H01L24/28 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/8319 , H01L2224/83855 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/0132 , H01L2924/0665 , H01L2924/07802 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： Described is a rapidly curing adhesive formulation and a method of reducing the curing time of an adhesive formulation containing cyanate ester.
摘要翻译：描述了快速固化的粘合剂制剂和减少含氰酸酯的粘合剂制剂的固化时间的方法。

20. 发明申请

WO1992017905A1 METHOD FOR PRODUCING COAXIAL CONNECTIONS FOR ELECTRONIC COMPONENTS, AND COMPONENT CASING CONTAINING SUCH CONNECTIONS 审中-公开
标题翻译：用于生产电子部件的同轴连接的方法以及包含这种连接的组件盒
公开(公告)号：WO1992017905A1
公开(公告)日：1992-10-15
申请号：PCT/FR1992000241
申请日：1992-03-17
申请人： THOMSON-CSF , VAL, Christian
发明人： THOMSON-CSF
IPC分类号： H01L23/498
CPC分类号： H01L23/66 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2223/6611 , H01L2223/6622 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01058 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/157 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/167 , H01L2924/1679 , H01L2924/19051 , H01L2924/20752 , H01L2924/3011 , H05K1/0243 , H05K3/3421 , H05K2201/09809 , H05K2201/10689 , Y10T29/49123 , Y10T29/49144 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A method for producing coaxial connections for the input/output links of the component and/or the casing in which it is encapsulated. Specifically, the component is placed in a casing (B) and connected thereto in a conventional manner via wires, whereafter the wires are covered with a first insulating layer (21) followed by a second, conductive layer (24), so that said second layer is connected to the casing's earth contacts (PE1). The layers (21, 24) thereby form collectively produced coaxial structures with the connecting wires (F). A similar process is used for the casing's own input/output connections (P).
摘要翻译： PCT No.PCT / FR92 / 00241 Sec。 371日期：1992年11月10日 102（e）日期1992年11月10日PCT 1991年3月17日PCT公布。出版物WO92 / 17905 日期为1992年10月15日。本发明的一个目的是生产用于封装该部件和/或壳体的输入/输出链路的同轴连接。更准确地说，放置在包装（B）中的部件通常通过电线连接到其包装; 导线接下来被第一绝缘层（21）覆盖，然后由第二导电层（24）覆盖，使得该第二层连接到封装的接地焊盘（PE1）。因此，层（21,24）与连接线（F）形成共同生产的同轴结构。类似的过程用于包装本身的输入/输出连接（P）。

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