会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明申请
    • Modified Resin Systems for Liquid Resin Infusion Applications & Process Methods Related Thereto
    • 液体树脂注射用改性树脂体系及其相关工艺方法
    • US20110151232A1
    • 2011-06-23
    • US12963823
    • 2010-12-09
    • Jonathan Edward MeeganRobert Blackburn
    • Jonathan Edward MeeganRobert Blackburn
    • B32B5/02C08L63/00B29C45/14
    • B29C70/025B29C70/48B29K2063/00B29K2105/165C08L63/00C08L2205/02Y10T428/249921C08L2666/14
    • Embodiments of the invention are directed to modified resin systems for use in liquid resin infusion (LRI) processes, variations of LRI processes and other suitable processes. In one embodiment, the modified resin system includes a novel combination of at least one base resin, an amount of particles within a predetermined range and an amount of thermoplastic material within a predetermined range wherein, when combined, the modified resin system has an average viscosity below a threshold average viscosity at a specific temperature and a high level of toughness. The modified resin system may additionally include a curing agent and other suitable components. The modified resin system has been experimentally shown to exhibit a unique, controllable and constant morphology which may be at least partially responsible for imparting a required toughness and damage resistance to a finished composite without adversely impacting properties such as viscosity, potlife, cure temperature, glass transition temperature or tensile modulus of the modified resin system.
    • 本发明的实施方案涉及用于液体树脂输注(LRI)方法的改性树脂体系,LRI方法的变化和其它合适的方法。 在一个实施方案中,改性树脂体系包括至少一种基础树脂,在预定范围内的一定量的颗粒和在预定范围内的热塑性材料的量的新组合,其中当组合时,改性树脂体系具有平均粘度 低于特定温度和高韧性水平的阈值平均粘度。 改性树脂体系可以另外包括固化剂和其它合适的组分。 改进的树脂体系已经被实验地显示出来,表现出独特的,可控的和恒定的形态,其可以至少部分地负责赋予成品复合材料所需的韧性和抗损性,而不会不利地影响诸如粘度,固化温度,固化温度,玻璃 改性树脂体系的转变温度或拉伸模量。
    • 8. 发明申请
    • POTTED ELECTRONIC COMPONENT AND METHOD FOR ITS MANUFACTURE
    • 电子电子元件及其制造方法
    • US20110114383A1
    • 2011-05-19
    • US12617752
    • 2009-11-13
    • Robertus W. Covers
    • Robertus W. Covers
    • H01L23/28B29C70/70
    • H01L21/54B29C39/006B29C39/10B29K2105/16B29K2105/165H01L21/56H01L2924/0002H01L2924/00
    • A method of manufacturing an electronic component assembly is disclosed comprising disposing an electronic component in a housing such that there is at least one void space between the component and the housing, disposing non-conductive microspheres in the void space to substantially fill the void space, and disposing a fluid potting material in the housing and hardening or curing the potting material to pot the component in the housing. An assembly is also disclosed comprising a housing, an electronic component disposed in the housing such that there is at least one space between the component and the housing and the space is substantially filled with non-conductive microspheres, and a material that potting the first electronic component in the housing. The invention enables an electronic component in a housing with a space left between the housing to be potted with reduced formation of bubbles in the hardened potting material.
    • 公开了一种制造电子部件组件的方法,包括将电子部件设置在壳体中,使得在部件和壳体之间存在至少一个空隙空间,将非导电微球体设置在空隙空间中以基本上填充空隙空间, 以及将流体灌封材料设置在所述壳体中并硬化或固化所述灌封材料以将所述构件中的所述部件浇注到所述壳体中。 还公开了一种组件,其包括壳体,设置在壳体中的电子部件,使得在部件和壳体之间存在至少一个空间,并且该空间基本上填充有非导电微球体,以及将第一电子 房屋中的部件。 本发明使得壳体中的电子部件能够在外壳之间留下空间以便在硬化的灌封材料中减少气泡的形成。