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    • 9. 发明申请
    • Thermally Activatable Insulating Packaging
    • 可热活化绝缘包装
    • US20160264339A1
    • 2016-09-15
    • US15160035
    • 2016-05-20
    • LBP Manufacturing, LLC
    • Thomas Z. FuMatthew R. Cook
    • B65D81/38A47G19/22B31B1/74A47J41/00
    • B65D81/3823A47G19/2205A47J41/0055A47J41/0072B31B50/74B65D3/22B65D81/3869B65D81/3874B65D81/3886
    • A method of making a container includes applying an insulating material in an inactive form to form a layer on a first substrate. The applied insulating material includes expandable microspheres. The method further includes joining a second substrate to the first substrate to adhere the first substrate to the second substrate and to create at least a portion of a multi-layer composite having at least one air gap between the first substrate and the second substrate. The method further includes heating the applied insulating material to activate expandable microspheres thereof to form expanded microspheres. The method further includes increasing the thickness of the applied insulating material layer to thereby increase the volume of the air gap between the first substrate and the second substrate of the multi-layer composite by the heating of the applied insulating material. The method further includes forming the multi-layer composite into a container having expanded microspheres.
    • 制造容器的方法包括以非活性形式施加绝缘材料以在第一衬底上形成层。 应用的绝缘材料包括可膨胀微球。 该方法还包括将第二衬底接合到第一衬底以将第一衬底粘附到第二衬底并且产生在第一衬底和第二衬底之间具有至少一个气隙的多层复合材料的至少一部分。 该方法还包括加热施加的绝缘材料以活化其可膨胀的微球体以形成膨胀的微球体。 该方法还包括增加施加的绝缘材料层的厚度,从而通过加热所施加的绝缘材料来增加多层复合材料的第一基板和第二基板之间的空气间隙的体积。 该方法还包括将多层复合材料形成为具有膨胀的微球的容器。