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    • 10. 发明申请
    • POLISHING HEAD IN CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
    • 化学机械抛光装置中的抛光头和包括其的化学机械抛光装置
    • US20140242886A1
    • 2014-08-28
    • US14183714
    • 2014-02-19
    • SAMSUNG ELECTRONICS., LTD.
    • Chang Gyu WOOSung Ho SHINJoo Yeop NAMKi Hong CHO
    • B24B37/10B24B41/047B24B37/32
    • B24B41/047B24B37/32
    • A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.
    • 化学机械抛光装置的抛光头包括上下移动的壳体,连接到壳体的底部以支撑壳体的底座组件,底座组件的底部上的膜和围绕膜的保持环,并连接 所述膜包括用于吸附和挤压基板的按压部分,所述按压部分上的第一隔板并且沿着所述高度方向从所述按压部分的边缘延伸;第一水平延伸部分,从所述基部组件的底部延伸, 所述第一分隔件的上端部朝向所述膜的中心,以及从所述第一隔板的上端部朝向所述膜的中心的第二水平延伸部,所述第二水平延伸部位于所述第一水平延伸部的上方, 通过气动压力膨胀的弯曲部分。