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1. 发明授权

US09156125B2 Polishing pad with light-stable light-transmitting region 有权
标题翻译：抛光垫具有光稳定的透光区域
公开(公告)号：US09156125B2
公开(公告)日：2015-10-13
申请号：US13444620
申请日：2012-04-11
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24B37/24 , B24B37/20
CPC分类号： B24B37/205 , B24B37/24
摘要： The invention provides a polishing pad that contains at least one light-transmitting region and optionally a polishing pad body. The light-transmitting region is composed of a material comprising (a) a polymeric resin and (b) at least one light-absorbing compound, and the light-transmitting region has a total light transmittance of about 25% or more at one or more wavelengths in a range of 250 nm to 395 nm.
摘要翻译：本发明提供了一种抛光垫，其包含至少一个透光区域和任选的抛光垫体。透光区由包含（a）聚合物树脂和（b）至少一种光吸收化合物的材料构成，并且透光区域在一个或多个处具有约25％以上的总透光率波长在250nm至395nm的范围内。

2. 发明申请

US20060052040A1 Method for manufacturing microporous CMP materials having controlled pore size 有权
标题翻译：具有可控孔径的微孔CMP材料的制造方法
公开(公告)号：US20060052040A1
公开(公告)日：2006-03-09
申请号：US11265607
申请日：2005-11-02
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/32 , B24D11/001
摘要： A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase in which the polymer-depleted phase constitutes about 20 to about 90 percent of the combined volume of the phases; (c) solidifying the continuous polymer-rich phase to form a porous polymer sheet; (d) removing at least a portion of the polymer-depleted phase from the porous polymer sheet; and (e) forming a CMP pad therefrom. The method provides for microporous CMP pads having a porosity and pore size that can be readily controlled by selecting the concentration polymer resin in the polymer solution, selecting the solvent based on the solubility parameters of the polymer in the solvent polarity of solvent, selecting the conditions for phase separation, and the like.
摘要翻译：一种制造化学机械抛光（CMP）垫的方法包括以下步骤：（a）形成聚合物树脂液体溶液层（即溶解在溶剂中的聚合物树脂）; （b）在聚合物溶液层中诱导相分离以产生互穿聚合物网络，其包含富含连续聚合物的相连续的聚合物贫化相，其中聚合物贫化相构成约20至约90％相的组合体积; （c）固化连续富聚合物相以形成多孔聚合物片; （d）从所述多孔聚合物片中除去所述聚合物贫化相的至少一部分; 和（e）从其形成CMP垫。该方法提供具有孔隙率和孔径的微孔CMP垫，其可以通过选择聚合物溶液中的聚合物树脂浓度来容易地控制，基于聚合物在溶剂的溶剂极性中的溶解度参数选择溶剂，选择条件用于相分离等。

3. 发明授权

US06998166B2 Polishing pad with oriented pore structure 有权
标题翻译：具有取向孔结构的抛光垫
公开(公告)号：US06998166B2
公开(公告)日：2006-02-14
申请号：US10463730
申请日：2003-06-17
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B32B27/00 , D06N7/04 , B24D11/00 , B24D3/00
CPC分类号： B24B37/24 , B24D3/26 , B24D3/32 , Y10T428/24273 , Y10T428/24355 , Y10T428/24446 , Y10T428/249953 , Y10T428/268 , Y10T428/31551 , Y10T428/31591
摘要： The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.
摘要翻译：本发明提供了一种用于化学机械抛光的抛光垫，其包括主体，抛光表面和多个细长孔，其中约10％或更多的细长孔具有约3:1或更大的纵横比，并且基本上在与抛光表面共面的方向上取向。本发明还提供一种抛光衬底的方法。

4. 发明申请

US20050276967A1 Surface textured microporous polishing pads 审中-公开
标题翻译：表面纹理微孔抛光垫
公开(公告)号：US20050276967A1
公开(公告)日：2005-12-15
申请号：US11207964
申请日：2005-08-19
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24D3/32 , B24D13/14 , B29C44/34 , B29C44/56 , B32B3/26
CPC分类号： B24D18/0063 , B24B37/24 , B24D3/32 , B29C44/348 , B29C44/5627 , Y10T428/24479 , Y10T428/24496 , Y10T428/24512 , Y10T428/249976 , Y10T428/249977
摘要： A surface-textured polishing pad suitable for chemical-mechanical polishing comprises a porous polymeric foam having an average pore cell size in the range of about 60 μm or less. At least about 75% of the pores in the foam have a pore cell size within about 30 μm of the average pore cell size. The pad has at least one textured surface that includes divots having a depth in the range of about 25 μm to about 1150 μm, a width in the range of about 0.25 μm to about 380 μm, and a length-to-width aspect ratio of about 1 to about 1000. In addition, the at least one textured surface of the pad includes at least about 10 divots per square centimeter of surface area, and has an average surface roughness of at least about 5 μm. Preferably, at least one textured surface has at least one pattern of spaced, parallel grooves imprinted thereon.
摘要翻译：适用于化学机械抛光的表面纹理抛光垫包括平均孔隙尺寸在约60μm或更小范围内的多孔聚合物泡沫。泡沫中至少约75％的孔具有在平均孔隙尺寸的约30μm范围内的孔隙尺寸。衬垫具有至少一个纹理表面，其包括深度在约25μm至约1150μm之间的深度，宽度在约0.25μm至约380μm的范围内，并且长宽比纵横比约1至约1000.此外，垫的至少一个织构表面包括每平方厘米表面积至少约10个切片，并且具有至少约5μm的平均表面粗糙度。优选地，至少一个有纹理的表面具有至少一个间隔开的平行凹槽的图案。

5. 发明授权

US07686994B2 Method of preparing a conductive film 失效
标题翻译：制备导电膜的方法
公开(公告)号：US07686994B2
公开(公告)日：2010-03-30
申请号：US11070695
申请日：2005-03-02
申请人： Abaneshwar Prasad , Ronald E. Myers
发明人： Abaneshwar Prasad , Ronald E. Myers
IPC分类号： B28B3/00 , B29C43/02
CPC分类号： H01J1/304 , H01J2201/30446 , Y10T428/268
摘要： The invention provides a method for producing a conductive film that generates an electric current via field emission of electrons, which method comprises incorporating an electrically conductive material into a thermoplastic polymer. The invention also provides a conductive film and a method for generating an electric current via field emission of electrons.
摘要翻译：本发明提供一种制造通过电子场发射产生电流的导电膜的方法，该方法包括将导电材料结合到热塑性聚合物中。本发明还提供一种导电膜和通过电子场发射产生电流的方法。

6. 发明授权

US07435165B2 Transparent microporous materials for CMP 有权
标题翻译：透明微孔材料用于CMP
公开(公告)号：US07435165B2
公开(公告)日：2008-10-14
申请号：US10282489
申请日：2002-10-28
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24D11/00 , B24D5/00 , B24B1/00
CPC分类号： B24B37/24
摘要： The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wavelength of about 200 nm to about 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.
摘要翻译：本发明涉及包含平均孔径为约0.01微米至约1微米的多孔材料的化学机械抛光垫基材。抛光垫基板在约200nm至约35,000nm的至少一个波长处具有约10％以上的透光率。本发明还涉及包括抛光垫基板的抛光垫，包括使用抛光垫基板的抛光方法以及包括抛光垫基板的化学机械装置。

7. 发明授权

US07311862B2 Method for manufacturing microporous CMP materials having controlled pore size 有权
标题翻译：具有可控孔径的微孔CMP材料的制造方法
公开(公告)号：US07311862B2
公开(公告)日：2007-12-25
申请号：US11265607
申请日：2005-11-02
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： C08J9/28
CPC分类号： B24B37/24 , B24D3/32 , B24D11/001
摘要： A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase in which the polymer-depleted phase constitutes about 20 to about 90 percent of the combined volume of the phases; (c) solidifying the continuous polymer-rich phase to form a porous polymer sheet; (d) removing at least a portion of the polymer-depleted phase from the porous polymer sheet; and (e) forming a CMP pad therefrom. The method provides for microporous CMP pads having a porosity and pore size that can be readily controlled by selecting the concentration polymer resin in the polymer solution, selecting the solvent based on the solubility parameters of the polymer in the solvent polarity of solvent, selecting the conditions for phase separation, and the like.
摘要翻译：一种制造化学机械抛光（CMP）垫的方法包括以下步骤：（a）形成聚合物树脂液体溶液层（即溶解在溶剂中的聚合物树脂）; （b）在聚合物溶液层中诱导相分离以产生互穿聚合物网络，其包含富含连续聚合物的相连续的聚合物贫化相，其中聚合物贫化相构成约20至约90％相的组合体积; （c）固化连续富聚合物相以形成多孔聚合物片; （d）从所述多孔聚合物片中除去所述聚合物贫化相的至少一部分; 和（e）从其形成CMP垫。该方法提供具有孔隙率和孔径的微孔CMP垫，其可以通过选择聚合物溶液中的聚合物树脂浓度来容易地控制，基于聚合物在溶剂的溶剂极性中的溶解度参数选择溶剂，选择条件用于相分离等。

8. 发明授权

US07204742B2 Polishing pad comprising hydrophobic region and endpoint detection port 有权
标题翻译：抛光垫包括疏水区域和端点检测端口
公开(公告)号：US07204742B2
公开(公告)日：2007-04-17
申请号：US10808827
申请日：2004-03-25
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24D11/00
CPC分类号： B24B37/20 , B24D7/14
摘要： The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrophobic region comprises a polymeric material having a surface energy of 34 mN/m or less and a polymeric material having a surface energy of more than 34 mN/m. The invention further provides a method of polishing a substrate comprising the use of the polishing pad.
摘要翻译：本发明提供了一种化学机械抛光垫，其包括包含疏水区域，亲水区域和端点检测端口的抛光层。疏水区基本上与端点检测端口相邻。疏水区域包括表面能为34mN / m以下的聚合物材料和具有大于34mN / m的表面能的聚合材料。本发明还提供一种抛光包括使用抛光垫的衬底的方法。

9. 发明申请

US20060046622A1 Polishing pad with microporous regions 有权
标题翻译：具有微孔区域的抛光垫
公开(公告)号：US20060046622A1
公开(公告)日：2006-03-02
申请号：US10931908
申请日：2004-09-01
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24B1/00
CPC分类号： B24B37/26
摘要： The invention provides a polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions, wherein the regions have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary. In a first embodiment, a first region and a second adjacent region have a first and second non-zero void volume, respectively, wherein the first void volume is less than the second void volume. In a second embodiment, a first non-porous region is adjacent to a second adjacent porous region, wherein the second region has an average pore size of about 50 μm or less. In a third embodiment, at least two of an optically transmissive region, a first porous region, and an optional second porous region, are adjacent. The invention further provides methods of polishing a substrate comprising the use of the polishing pads and a method of producing the polishing pads.
摘要翻译：本发明提供了一种用于化学机械抛光的抛光垫，其包括包含两个或更多个相邻区域的聚合物材料，其中所述区域具有相同的聚合物配方，并且所述区域之间的转变不包括结构上不同的边界。在第一实施例中，第一区域和第二相邻区域分别具有第一和第二非零空隙体积，其中第一空隙体积小于第二空隙体积。在第二实施方案中，第一非多孔区域与第二相邻的多孔区域相邻，其中第二区域的平均孔径为约50μm或更小。在第三实施例中，光学透射区域，第一多孔区域和任选的第二多孔区域中的至少两个相邻。本发明还提供了抛光包括使用抛光垫的衬底的方法以及制造抛光垫的方法。

10. 发明申请

US20050277371A1 Transparent microporous materials for CMP 有权
标题翻译：透明微孔材料用于CMP
公开(公告)号：US20050277371A1
公开(公告)日：2005-12-15
申请号：US11158694
申请日：2005-06-22
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24B1/00 , B24B29/00 , B24B49/12 , B24D7/12 , H01L21/304
CPC分类号： B24B37/24 , B24D3/32
摘要： The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of about 0.01 microns to about 10 microns. The polishing pad is produced by foaming a solid polymer sheet with a supercritical gas under an elevated temperature and pressure until the sheet is saturated with gas. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.
摘要翻译：本发明涉及包含微孔闭孔泡沫的化学 - 机械抛光垫基材，其特征在于在约0.01微米至约10微米范围内的窄孔径分布。抛光垫通过在高温和高压下用超临界气体发泡固体聚合物片而制成，直到片材被气体饱和为止。本发明还涉及包括抛光垫基板的抛光垫，包括使用抛光垫基板的抛光方法以及包括抛光垫基板的化学机械装置。

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