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    • 3. 发明申请
    • SCANNING ELECTRON MICROSCOPE
    • 扫描电子显微镜
    • US20120298865A1
    • 2012-11-29
    • US13522984
    • 2011-01-21
    • Seiko OmoriJunichi TanakaYoshinori NakayamaKeiichiro Hitomi
    • Seiko OmoriJunichi TanakaYoshinori NakayamaKeiichiro Hitomi
    • H01J37/26
    • G03F7/70625H01J37/222H01J37/28H01J2237/1536H01J2237/226H01J2237/24571H01J2237/2809H01J2237/2817
    • Disclosed is a scanning electron microscope provided with a calculation device (403) for measuring the dimension of a pattern on a sample (413), characterized in that the amount of change of a pattern shape, caused by electron beam irradiation, is calculated and stored, and a pattern shape contour (614; 815; 1512) before the sample is irradiated with an electron beam is restored from a pattern shape contour (613; 814; 1511) in a scanning electron microscope image (612; 813; 1510) after the sample is irradiated with an electron beam using the calculated amount and, then, the pattern shape contour (614; 815; 1512) is displayed. Thus, the shrinking of a resist and/or the effect of electrostatic charge caused when a sample is irradiated with an electron beam are eliminated, so that the shape contour of a two-dimensional pattern before irradiating an electron beam can be restored with a high degree of accuracy, and the dimension of a pattern can be measured with a high degree of accuracy, using the restored image.
    • 公开了一种具有用于测量样品(413)上的图案的尺寸的计算装置(403)的扫描电子显微镜,其特征在于,计算并存储由电子束照射引起的图案形状的变化量 在扫描电子显微镜图像(612; 813; 1510)中从扫描电子显微镜图像(612; 813; 1510)中的图案形状轮廓(613; 814; 1511)恢复在用电子束照射样品之前的图案形状轮廓(614; 815; 1512) 使用计算量用电子束照射样品,然后显示图案形状轮廓(614; 815; 1512)。 因此,消除了当用电子束照射样品时引起的抗蚀剂收缩和/或静电电荷的影响,从而能够以高的电压恢复照射电子束之前的二维图案的形状轮廓 使用恢复的图像,可以高精度地测量图案的精度和尺寸。
    • 6. 发明申请
    • Defect inspection method and its system
    • 缺陷检查方法及其系统
    • US20090206252A1
    • 2009-08-20
    • US12320574
    • 2009-01-29
    • Shinji OkazakiShoji HottaYasunari SohdaYoshinori Nakayama
    • Shinji OkazakiShoji HottaYasunari SohdaYoshinori Nakayama
    • G01N23/00
    • H01L22/12G06T7/0006G06T7/001G06T2207/10056G06T2207/30148H01L2924/0002H01L2924/00
    • A method for enabling management of fatal defects of semiconductor integrated patterns easily, the method enables storing of design data of each pattern designed by a semiconductor integrated circuit designer, as well as storing of design intent data having pattern importance levels ranked according to their design intents respectively. The method also enables anticipating of defects to be generated systematically due to the characteristics of the subject exposure system, etc. while each designed circuit pattern is exposed and delineated onto a wafer in a simulation carried out beforehand and storing those defects as hot spot information. Furthermore, the method also enables combining of the design intent data with hot spot information to limit inspection spots that might include systematic defects at high possibility with respect to the characteristics of the object semiconductor integrated circuit and shorten the defect inspection time significantly.
    • 一种能够容易地管理半导体集成图案的致命缺陷的方法,该方法能够存储由半导体集成电路设计者设计的每个图案的设计数据,以及存储具有根据其设计意图排列的图案重要性级别的设计意图数据 分别。 该方法还可以预测由于目标曝光系统等的特性而系统地产生的缺陷,同时在预先进行的模拟中将每个设计的电路图案暴露并描绘到晶片上,并将这些缺陷存储为热点信息。 此外,该方法还能够将设计意图数据与热点信息组合,以限制可能包括关于对象半导体集成电路的特性的高可能性的系统缺陷的检查点,并显着缩短缺陷检查时间。
    • 7. 发明申请
    • Standard component for calibration and electron-beam system using the same
    • 用于校准的标准组件和使用其的电子束系统
    • US20080251868A1
    • 2008-10-16
    • US12078516
    • 2008-04-01
    • Yoshinori NakayamaYasunari SohdaKeiichiro Hitomi
    • Yoshinori NakayamaYasunari SohdaKeiichiro Hitomi
    • H01L23/00H01L21/302H01L21/26G01N23/00
    • G01N23/225H01J37/28H01J2237/20H01J2237/2826H01L23/544H01L2223/54453H01L2924/0002H01L2924/00
    • The invention provides a standard component for calibration that enables a calibration position to be easily specified in order to calibrate accurately a scale factor in the electron-beam system, and provides an electron-beam system using it. High-accuracy metrology calibration capable of specifying a calibration position can be realized by forming a mark pattern or labeled material for identifying the calibration position in proximity of a superlattice pattern of the standard component for system calibration. The standard component for calibration is one that calibrates a scale factor of an electron-beam system based on a signal of secondary charged particles detected by irradiation of a primary electron beam emitted from the electron-beam system on a substrate having a cross section of a superlattice of a multi-layer structure in which different materials are deposited alternately. The substrate have linear patterns that are on the substrate surface parallel to the multi-layer and are arranged at a fixed interval in a direction crossing the cross section of the superlattice pattern, and is so configured that the cross sections of the linear patterns may exist on substantially the same plane of the superlattice cross section, so that the linear patterns enable a position of the superlattice pattern to be identified.
    • 本发明提供了一种用于校准的标准组件,其使得能够容易地指定校准位置,以便准确地校准电子束系统中的比例因子,并提供使用该电子束系统的电子束系统。 可以通过形成用于识别用于系统校准的标准组件的超晶格图案附近的校准位置的标记图案或标记材料来实现能够指定校准位置的高精度度量学校准。 用于校准的标准组件是基于通过照射从电子束系统发射的一次电子束检测的二次带电粒子的信号来校准电子束系统的比例因子的衬底上的横截面为 其中不同材料交替沉积的多层结构的超晶格。 衬底具有平行于多层的衬底表面上的线性图案,并且在与超晶格图案的横截面交叉的方向上以固定的间隔布置,并且被配置成可以存在线形图案的横截面 在超晶格截面的基本上相同的平面上,使得线状图案能够识别超晶格图案的位置。
    • 8. 发明授权
    • Standard reference for metrology and calibration method of electron-beam metrology system using the same
    • 电子束计量系统的计量和校准方法的标准参考
    • US07358495B2
    • 2008-04-15
    • US11481973
    • 2006-07-07
    • Yoshinori Nakayama
    • Yoshinori Nakayama
    • G21K7/00
    • H01J37/28G01B15/00G01B21/042H01J2237/2814H01J2237/2826
    • An electron-beam metrology system includes a specimen stage to mount a specimen on which a device pattern is formed, electron optics to radiate the device pattern with an electron-beam, a secondary electron detector to detect a secondary electron generated by the radiation of the electron-beam, and an information processing system to analyze a signal obtained from the secondary electron detector. A standard reference for metrology is held on the specimen stage, and the standard reference includes a first grating unit pattern including an array of gratings having pitch sizes which are verified by an optical method, and a second grating unit pattern including an array of gratings having pitch sizes which are smaller than the pitch sizes of the first grating unit pattern.
    • 电子束计量系统包括用于安装其上形成有器件图案的样本的样品台,用电子束辐射器件图案的电子光学器件,用于检测由电子束的辐射产生的二次电子的二次电子检测器 电子束和用于分析从二次电子检测器获得的信号的信息处理系统。 标准参考标准保持在标本台上,标准参考文献包括第一光栅单元图案,其包括具有通过光学方法验证的间距尺寸的光栅阵列,以及第二光栅单元图案,其包括具有 间距尺寸小于第一光栅单元图案的间距尺寸。