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1. 发明申请

US20050263713A1 Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权
标题翻译：偏转器，偏转器制造方法和带电粒子束曝光装置
公开(公告)号：US20050263713A1
公开(公告)日：2005-12-01
申请号：US11196262
申请日：2005-08-04
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/147 , H01J3/14
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.
摘要翻译：偏转带电粒子束的偏转器包括具有带电粒子束应穿过的开口的基板和设置在开口中以偏转带电粒子束的偏转电极，并具有第一导电部件和第二导电部件，通过电镀形成。第二导电构件形成在第一导电构件的表面上，并且基本上由比第一导电构件更难氧化的材料制成。

2. 发明授权

US06953938B2 Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权
标题翻译：偏转器，偏转器制造方法和带电粒子束曝光装置
公开(公告)号：US06953938B2
公开(公告)日：2005-10-11
申请号：US10670328
申请日：2003-09-26
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/147 , H01J37/304
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.
摘要翻译：使带电粒子束偏转的偏转器包括具有带电粒子束应通过的开口的基板和布置在开口中以偏转带电粒子束并具有第一导电构件和第二导电构件的偏转电极，它们通过电镀形成。第二导电构件形成在第一导电构件的表面上，并且由比第一导电构件更难氧化的材料制成。第一导电部件由残留应力小于第二导电部件的材料制成。

3. 发明授权

US07276707B2 Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权
标题翻译：偏转器，偏转器制造方法和带电粒子束曝光装置
公开(公告)号：US07276707B2
公开(公告)日：2007-10-02
申请号：US11196262
申请日：2005-08-04
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/30
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.
摘要翻译：偏转带电粒子束的偏转器包括具有带电粒子束应穿过的开口的基板和设置在开口中以偏转带电粒子束的偏转电极，并具有第一导电部件和第二导电部件，通过电镀形成。第二导电构件形成在第一导电构件的表面上，并且基本上由比第一导电构件更难氧化的材料制成。

4. 发明申请

US20050035300A1 Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权
公开(公告)号：US20050035300A1
公开(公告)日：2005-02-17
申请号：US10670328
申请日：2003-09-26
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/147
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.

5. 发明授权

US06818911B2 Array structure and method of manufacturing the same, charged particle beam exposure apparatus, and device manufacturing method 有权
标题翻译：阵列结构及其制造方法，带电粒子束曝光装置及器件制造方法
公开(公告)号：US06818911B2
公开(公告)日：2004-11-16
申请号：US10406274
申请日：2003-04-04
申请人： Kenji Tamamori , Masato Muraki , Yuichi Iwasaki , Yoshinori Nakayama , Kouji Asano , Yoshiaki Moro , Masayoshi Esashi
发明人： Kenji Tamamori , Masato Muraki , Yuichi Iwasaki , Yoshinori Nakayama , Kouji Asano , Yoshiaki Moro , Masayoshi Esashi
IPC分类号： G21G500
CPC分类号： B82Y10/00 , B82Y40/00 , H01J37/045 , H01J37/3177 , H01J2237/0435
摘要： This invention provides a reliable blanking aperture array. An insulating layer and conductive layer are sequentially formed on the lower surface of a substrate. Then, a plurality of pairs of opposing trenches are formed in the substrate, and an insulating layer is formed on each of the side surfaces of the trenches by thermal oxidation. The conductive layer is exposed by etching the bottom of each trench. A conductive member is selectively grown in each trench using the conductive layer as a plating electrode to form a blanking electrode. An opening is formed between the opposing blanking electrodes.
摘要翻译：本发明提供了可靠的消隐孔径阵列。绝缘层和导电层依次形成在基板的下表面上。然后，在衬底中形成多对相对的沟槽，并且通过热氧化在沟槽的每个侧表面上形成绝缘层。通过蚀刻每个沟槽的底部来暴露导电层。使用导电层作为电镀电极，在每个沟槽中选择性地生长导电构件以形成消隐电极。在相对的消隐电极之间形成开口。

6. 发明授权

US08481248B2 Method for fabricating micromachine component of resin 失效
标题翻译：制造树脂微机械部件的方法
公开(公告)号：US08481248B2
公开(公告)日：2013-07-09
申请号：US11922529
申请日：2006-06-15
申请人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
发明人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
IPC分类号： G03F7/22
CPC分类号： F04D29/281 , B29C64/106 , B29C64/124 , B29L2031/7496 , B81C99/008 , F04D29/023 , F05D2230/31 , F05D2300/44
摘要： A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge portion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.
摘要翻译：一种用于制造树脂微机械部件的方法，包括在基板上形成牺牲层的步骤（a），在牺牲层上依次形成至少两个感光性树脂组合物层的步骤（b），并对各感光性树脂组合物进行光刻形成限定微机械部件的周缘部的气隙部和构成微机械部件的内部结构的气隙部，形成多层结构，在多层结构体上设置干膜抗蚀剂的工序（c）并进行干膜抗蚀剂层的光刻，形成固化的干膜抗蚀剂层，其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙形成，并且步骤（d）用于分离具有多层的微机械部件通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层结构。

7. 发明申请

US20120217638A1 WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE 有权
标题翻译：接线方法和功能设备
公开(公告)号：US20120217638A1
公开(公告)日：2012-08-30
申请号：US13393577
申请日：2010-09-01
申请人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
发明人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
IPC分类号： H01L23/48 , H01L21/762
CPC分类号： H01L24/16 , B81B2203/04 , B81C3/001 , B81C2203/031 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/16503 , H01L2224/81192 , H01L2224/8181 , H01L2224/81893 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01R43/0214 , H01L2224/81 , H01L2924/00
摘要： By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
摘要翻译：通过在第一基板10的连接电极12和第二基板15的连接电极17中的至少一个上形成金属层14，将第一基板10和第二基板15放置在一起，以使连接电极12和连接电极17通过金属层14彼此面对，提高温度直到阳极接合温度，并且在保持该温度的同时在第一基板10和第二基板15之间施加直流电压，第一基板10和第二基板 15被阳极结合，同时通过熔化金属层14，连接电极12和连接电极17电连接。该方法以高产率实现了基板的阳极接合，同时建立了线路连接，对包装有效。

8. 发明授权

US07405506B2 Driving mechanism and micro-mirror device provided with the same 失效
标题翻译：驱动机构和微镜装置相同
公开(公告)号：US07405506B2
公开(公告)日：2008-07-29
申请号：US11201316
申请日：2005-08-11
申请人： Masayoshi Esashi , Naoki Kikuchi , Rogerio Jun Mizuno , Masanori Maeda , Satoshi Karasawa
发明人： Masayoshi Esashi , Naoki Kikuchi , Rogerio Jun Mizuno , Masanori Maeda , Satoshi Karasawa
IPC分类号： H02N1/00 , G02B26/08
CPC分类号： H02N1/008 , G02B26/0841 , H02K2201/18
摘要： A driving mechanism configured to turn a plate member with respect to a frame member around a predetermined turning axis includes a pair of supporting members supporting the plate member, a pair of actuators provided on both sides with respect to the turning axis and on the same surface side of the plate member. Each of the actuators includes a fixed electrode unit fixed to the frame member and a movable electrode unit fixed to the plate member. The fixed electrode unit includes a substrate, a pair of fixed comb electrodes provided on both surface sides of the substrate. The movable electrode unit includes a pair of movable comb electrodes, each of which engages with the corresponding fixed comb electrode with a gap therebetween. Both pairs of the fixed comb electrode and the corresponding movable comb electrode are configured such that a voltage can be applied therebetween independently.
摘要翻译：相对于框架构件围绕预定转动轴线转动板状构件的驱动机构包括支撑板构件的一对支撑构件，设置在相对于转动轴线的两侧和相同表面上的一对致动器侧板。每个致动器包括固定到框架构件的固定电极单元和固定到板构件的可动电极单元。固定电极单元包括基板，设置在基板的两个表面侧上的一对固定梳电极。可动电极单元包括一对可动梳状电极，每一个可动梳状电极与对应的固定梳状电极接合，并在其间具有间隙。固定梳状电极和对应的可动梳状电极的两对被配置成可以独立地施加电压。

9. 发明授权

US07223329B2 Active slender tubes and method of making the same 有权
标题翻译：活动细长管及其制作方法
公开(公告)号：US07223329B2
公开(公告)日：2007-05-29
申请号：US10703445
申请日：2003-11-10
申请人： Masayoshi Esashi , Yoichi Haga
发明人： Masayoshi Esashi , Yoichi Haga
IPC分类号： C25D5/02 , A61M29/00 , A61M5/00
CPC分类号： A61M25/0138 , A61B1/005 , A61B1/0058 , A61M25/0158 , Y10S138/08
摘要： A method of making an active slender tube as implemented as a catheter, guide wire, or any other medical or non-medical micro-mechanical or -system or system's active micro-component is disclosed, comprising preparing an actuator made from a shape memory alloy (SMA) and forming at least a portion of a tubular body; disposing outside of SMA made actuator an elastically deformable outer skeleton coaxially therewith; and fastening together SMA made actuator and outer skeleton wire adjacent to non-insulated portions, step of fastening includes a step of passing an electric current through a lead wire while in an electroplating liquid to deposit a metal on lead wire and non-insulated portions from said liquid and thereby to electrically join SMA made actuator and outer skeleton together at corresponding areas.
摘要翻译：公开了一种制造活动细长管作为导管，导丝或任何其它医疗或非医疗微机械或系统或系统的活性微组件的方法，包括制备由形状记忆合金制成的致动器（SMA）并且形成管状体的至少一部分; 在SMA制造的致动器外面与其同轴地设置可弹性变形的外骨架; 并且将SMA制造的致动器和外骨架线紧固在非绝缘部分附近，紧固步骤包括在电镀液中使电流通过引线的步骤，以将金属沉积在引线和非绝缘部分上从而将SMA制造的致动器和外骨架在相应的区域电连接在一起。

10. 发明申请

US20060130527A1 Method of fabricating mold for glass press 审中-公开
标题翻译：制造玻璃压制模具的方法
公开(公告)号：US20060130527A1
公开(公告)日：2006-06-22
申请号：US10557843
申请日：2004-03-22
申请人： Shuji Tanaka , Masayoshi Esashi
发明人： Shuji Tanaka , Masayoshi Esashi
IPC分类号： C03B11/08 , B28B7/38 , B05D1/36
CPC分类号： B32B18/00 , B81C99/009 , B81C2201/034 , C03B11/082 , C03B11/086 , C03B2215/22 , C03B2215/32 , C03B2215/412 , C04B35/565 , C04B37/001 , C04B37/006 , C04B2235/656 , C04B2235/6567 , C04B2235/963 , C04B2237/083 , C04B2237/123 , C04B2237/365 , C04B2237/568 , C04B2237/64 , C04B2237/704 , C04B2237/708
摘要： A method of fabricating a mold for glass press, characterized in that silicon carbide is deposited on the surface of a silicon mold, subsequently the deposited silicon carbide is bonded to a silicon carbide substrate, and thereafter the silicon mold is removed by etching. In this method of fabricating a mold for glass press, the bonding between the silicon carbide deposited on the silicon mold surface and the silicon carbide substrate can be strengthened by interposing a metal thin film.
摘要翻译：一种制造玻璃压制模具的方法，其特征在于，碳化硅沉积在硅模的表面上，随后将沉积的碳化硅结合到碳化硅衬底上，然后通过蚀刻去除硅模。在这种制造玻璃压模的方法中，通过插入金属薄膜，可以加强沉积在硅模表面上的碳化硅与碳化硅衬底之间的结合。

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