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    • 1. 发明授权
    • Substrate processing apparatus
    • 基板加工装置
    • US06896466B2
    • 2005-05-24
    • US10096691
    • 2002-03-12
    • Joichi NishimuraMasami OhtaniYasuhiko Hashimoto
    • Joichi NishimuraMasami OhtaniYasuhiko Hashimoto
    • B65G49/07B25J18/02B25J18/04H01L21/677H01L21/687
    • B25J18/025B25J18/04H01L21/68707Y10S414/139
    • A substrate processing apparatus includes a transport robot (TR1) formed with a telescopic vertical movement mechanism of a so-called telescopially nestable multi-tier construction. A drive mechanism (D1) is initially driven to move a support member (48) upwardly to simultaneously elevate a vertical movement member (42d). As the vertical movement member (42d) rises, a pulley (47c) simultaneously moves upwardly. As the pulley (47c) moves upwardly, a vertical movement member (42c) is lifted upwardly by a belt (L1). Similar actions elevate a pair of transport arms (31a, 31b) provided on the top of a vertical movement member (42a). The increase in the number of tiers of the nestable multi-tier structure precludes the increase in height of the transport robot (TR1) in its retracted position. The substrate processing apparatus, if having an increased height, is capable of transporting a substrate to and from processing portions and eliminates the need to reassemble and adjust the transport robot (TR1) for transportation of the apparatus.
    • 基板处理装置包括形成有所谓的可伸缩的多层结构的伸缩式垂直运动机构的输送机器人(TR1)。 驱动机构(D 1)最初被驱动以向上移动支撑构件(48)以同时升高垂直运动构件(42d)。 当垂直运动构件(42d)升高时,滑轮(47c)同时向上移动。 当滑轮(47c)向上移动时,垂直运动件(42c)被带(L1)向上提升。 类似的动作提升设置在垂直运动件(42,4a)顶部上的一对传送臂(31a,31b)。 可嵌套多层结构的层数的增加排除了运输机器人(TR 1)在缩回位置的高度增加。 基板处理装置如果具有增加的高度,则能够将基板输送到处理部分和从处理部分输送基板处理装置,并且不需要重新组装和调整运输机器人(TR 1)以便运送装置。
    • 2. 发明授权
    • Robot
    • 机器人
    • US06688189B2
    • 2004-02-10
    • US09837109
    • 2001-04-18
    • Yasuhiko HashimotoMasami OhtaniJoichi Nishimura
    • Yasuhiko HashimotoMasami OhtaniJoichi Nishimura
    • B25J1700
    • B25J18/025F16M11/08F16M11/18F16M11/2014F16M11/28Y10S414/135Y10T74/18848Y10T74/20323
    • Provided is a robot comprising a telescopic-drive mechanism which does not contaminate works in a purified environment such as a clean room, is easy to handle, and requires no cover for covering the telescopic-drive mechanism. A robot comprises: an up-down axis in which a plurality of hollow axis sectional elements telescopically continue; and a telescopic-drive mechanism for driving the up-down axis to be vertically extended or retracted between an extended state in which a tip end of the up-down axis extends with respect to a base end thereof and a retracted state in which the tip end is moved close to the base end, wherein the telescopic-drive mechanism is integrated on one side of the up-down axis without being exposed from the up-down axis.
    • 本发明提供一种机器人,其包括不会在诸如洁净室的净化环境中污染工作的伸缩驱动机构,易于处理,并且不需要用于覆盖伸缩驱动机构的盖。 机器人包括:上下轴线,多个中空轴线部分可伸缩地延伸在其中; 以及伸缩驱动机构,用于驱动上下轴线在上下轴线的前端相对于其基端部延伸的伸出状态和垂直延伸状态之间垂直延伸或缩回,在该状态下, 端部移动靠近基端,其中伸缩驱动机构集成在上下轴线的一侧,而不会暴露于上下轴线。
    • 3. 发明授权
    • Substrate processing apparatus
    • 基板加工装置
    • US06371713B1
    • 2002-04-16
    • US09143027
    • 1998-08-28
    • Joichi NishimuraMasami OhtaniYasuhiko Hashimoto
    • Joichi NishimuraMasami OhtaniYasuhiko Hashimoto
    • B65G4907
    • B25J18/025B25J18/04H01L21/68707Y10S414/139
    • A substrate processing apparatus includes a transport robot (TR1) formed with a telescopic vertical movement mechanism of a so-called telescopically nestable multi-tier construction. A drive mechanism (D1) is initially driven to move a support member (48) upwardly to simultaneously elevate a vertical movement member (42d). As the vertical movement member (42d) rises, a pulley (47c) simultaneously moves upwardly. As the pulley (47c) moves upwardly, a vertical movement member (42c) is lifted upwardly by a belt (L1). Similar actions elevate a pair of transport arms (31a, 31b) provided on the top of a vertical movement member (42a). The increase in the number of tiers of the nestable multi-tier structure precludes the increase in height of the transport robot (TR1) in its retracted position. The substrate processing apparatus, if having an increased height, is capable of transporting a substrate to and from processing portions and eliminates the need to reassemble and adjust the transport robot (TR1) for transportation of the apparatus.
    • 基板处理装置包括形成有所谓的可伸缩的多层结构的伸缩式垂直运动机构的输送机器人(TR1)。 驱动机构(D1)最初被驱动以向上移动支撑构件(48)以同时升高垂直运动构件(42d)。 当垂直运动构件(42d)升高时,滑轮(47c)同时向上移动。 当滑轮(47c)向上移动时,垂直运动构件(42c)被带(L1)向上提升。 类似的动作提升了设置在垂直运动件(42a)的顶部上的一对传送臂(31a,31b)。 可嵌套多层结构的层数的增加排除了运输机器人(TR1)处于缩回位置的高度增加。 基板处理装置如果具有增加的高度,则能够将基板输送到处理部分和从处理部分输送基板处理装置,并且不需要重新组装和调整运输机器人(TR1)以便运送装置。
    • 5. 发明授权
    • Substrate cleaning apparatus and method
    • 基板清洗装置及方法
    • US06286525B1
    • 2001-09-11
    • US09071683
    • 1998-05-01
    • Joichi NishimuraAkihiko MoritaMasami Ohtani
    • Joichi NishimuraAkihiko MoritaMasami Ohtani
    • B08B300
    • H01L21/67051B08B1/04B08B3/00H01L21/67046Y10S134/902
    • A plurality of cleaning devices of the same type are attached to one support arm. The cleaning devices are simultaneously moved over a surface to be cleaned of a substrate supported and spun by a substrate supporting and spinning mechanism. Thus, the same type of cleaning devices share the task of cleaning the entire surface of the substrate, thereby to improve cleaning efficiency and shorten cleaning time. Different types of cleaning devices may be attached to the support arm for simultaneous cleaning of the entire surface of the substrate. Where different types of cleaning brushes are attached to the support arm, a cleaning operation may be carried out by simultaneously using cleaning brushes of optimal hardness for different regions on the substrate surface.
    • 多个相同类型的清洁装置连接到一个支撑臂。 清洁装置同时移动到由基板支撑和旋转机构支撑和纺出的基板的待清洁表面上。 因此,相同类型的清洁装置共享清洁基板的整个表面的任务,从而提高清洁效率并缩短清洁时间。 可以将不同类型的清洁装置连接到支撑臂上,以同时清洁基板的整个表面。 在不同类型的清洁刷附接到支撑臂的情况下,清洁操作可以通过同时使用基板表面上不同区域的最佳硬度的清洁刷进行。
    • 6. 发明授权
    • Substrate treating apparatus
    • 底物处理装置
    • US6159291A
    • 2000-12-12
    • US131558
    • 1998-08-10
    • Akihiko MoritaJoichi NishimuraMasami Ohtani
    • Akihiko MoritaJoichi NishimuraMasami Ohtani
    • B05B15/02B05B15/10B05C11/08B05B13/02
    • B05B15/10B05C11/08B05B12/1472B05B15/02
    • A substrate treating apparatus for treating a substrate in a predetermined substrate treating region. Each holder arm is supported in a proximal end portion thereof by an arm support to be swingable about a pivotal axis. In time of substrate treatment, the arm support is raised by an air cylinder. With the ascent of the arm support, a cam follower attached to a proximal end of the holder arm is guided by a cam groove. The holder arm, while being raised, turns from a vertical standby posture to a horizontal posture for treating the substrate. As a result, a treating device attached to a distal end of the holder arm moves to a treating position. In the treating position, the treating device treats the substrate. The holder arms are maintained in the vertical standby posture when out of use in substrate treatment. Thus, the holder arms require a reduced standby space.
    • 一种用于处理预定基板处理区域中的基板的基板处理装置。 每个保持臂通过臂支撑件在其近端部分中支撑以围绕枢转轴线摆动。 在基板处理的时候,臂支撑件被气缸升高。 随着臂支撑件的上升,附接到保持器臂的近端的凸轮从动件由凸轮槽引导。 保持臂同时被升起,从垂直待机姿态变为水平姿势,用于处理基板。 结果,附接到保持臂的远端的处理装置移动到处理位置。 在处理位置,处理装置处理基板。 当基板处理不用时,保持臂保持在垂直待机姿态。 因此,支架臂需要减少的待机空间。
    • 7. 发明授权
    • Method of and apparatus for cleaning substrate
    • 清洗基材的方法和设备
    • US6151744A
    • 2000-11-28
    • US839470
    • 1997-04-14
    • Masami OhtaniMasahide IkedaMitsuhiro FujitaJoichi Nishimura
    • Masami OhtaniMasahide IkedaMitsuhiro FujitaJoichi Nishimura
    • B08B1/04B08B3/12H01L21/00H01L21/304A46B13/02
    • H01L21/67051H01L21/67046
    • A method of and apparatus for cleaning a substrate which require shorter processing time with high processing efficiency are disclosed. A cleaning brush pivots about a pivot axis between two positions. An ultrasonic cleaning nozzle pivots about a pivot axis between two positions. To perform a cleaning process, the cleaning brush and the ultrasonic cleaning nozzle are driven in accordance with a processing pattern previously produced by an operator. The processing pattern is produced so that the movement of the cleaning brush between two positions and the movement of the ultrasonic cleaning nozzle between two positions are not caused simultaneously. Any processing pattern desired by the operator may be produced if this requirement is satisfied. Execution of the cleaning process in accordance with the processing pattern allows cleaning of a substrate using the cleaning brush and the ultrasonic cleaning nozzle at the same time.
    • 公开了一种用于清洗需要较短处理时间并具有高处理效率的基板的方法和设备。 清洁刷绕两个位置之间的枢转轴线枢转。 超声波清洗喷嘴绕两个位置之间的枢转轴线枢转。 为了执行清洁处理,清洁刷和超声波清洗喷嘴根据操作者先前生产的处理模式被驱动。 产生处理图案,使得清洁刷在两个位置之间的移动和超声波清洗喷嘴在两个位置之间的运动不会同时产生。 如果满足该要求,则可以产生操作者期望的任何处理模式。 根据处理模式执行清洁处理允许使用清洁刷和超声波清洗喷嘴同时清洗基板。
    • 9. 发明授权
    • Substrate processing apparatus, substrate inspection method and substrate processing system
    • 基板加工装置,基板检查方法及基板处理系统
    • US06790287B2
    • 2004-09-14
    • US09942153
    • 2001-08-29
    • Masayoshi ShigaKenji HashinokiMasami OhtaniJoichi Nishimura
    • Masayoshi ShigaKenji HashinokiMasami OhtaniJoichi Nishimura
    • C23C1600
    • H01L21/67207H01L21/67253
    • An inspection unit is provided in a substrate processing apparatus performing resist coating processing and development processing on a substrate. In the inspection unit, a film thickness measuring device, a line width measuring device, an overlay measuring device and a macro defect inspection device are successively stacked and arranged from below. The inspection unit is provided on an intermediate portion of a substrate transport path formed in the substrate processing apparatus. The substrate processed in the substrate processing apparatus is selectively introduced into each inspection part. Therefore, the apparatus can properly inspect the substrate at need while suppressing reduction of the throughput. Thus provided are a substrate processing apparatus and a substrate inspection method capable of properly inspecting a substrate while suppressing reduction of the throughput.
    • 在基板上进行抗蚀剂涂布处理和显影处理的基板处理装置中设置有检查单元。 在检查单元中,从下方依次堆叠并布置膜厚测量装置,线宽测量装置,覆盖测量装置和宏观缺陷检查装置。 检查单元设置在形成在基板处理装置中的基板输送路径的中间部。 将在基板处理装置中处理的基板选择性地导入各检查部。 因此,能够在抑制生产量的降低的同时适当地检查需要的基板。 这样提供了能够在抑制生产量降低的同时适当地检查基板的基板处理装置和基板检查方法。