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    • 3. 发明授权
    • Chemical pump and method of discharging chemical solution
    • 化学泵和排放化学溶液的方法
    • US07048801B2
    • 2006-05-23
    • US10680322
    • 2003-10-07
    • Akihiko Morita
    • Akihiko Morita
    • B05C11/08B05C11/10
    • F04B13/02F04B53/06H01L21/67017H01L21/6715Y10T137/7838
    • A chemical pump includes a pressure chamber, a partition member for dividing the pressure chamber into a cleaning pressure chamber and a discharging pressure chamber, a filter part disposed on the primary side of the discharging pressure chamber, and a single drive mechanism. A pair of openings with respective check valves mounted therein are provided in each of the cleaning and discharging pressure chambers, and are positioned so as to cause a resist solution to flow only in the +Z direction. The drive mechanism moves the partition member in the −X direction to cause the resist solution to be sucked into the cleaning pressure chamber and to cause the resist solution to be discharged from the discharging pressure chamber. The drive mechanism moves the partition member in the +X direction to cause the resist solution to be sucked from the filter part into the discharging pressure chamber and to cause the resist solution to be supplied from the cleaning pressure chamber to the filter part so that the sucked resist solution is equal in amount to the supplied resist solution. This prevents vapor lock and micro-bubble phenomena during the discharge of the resist solution.
    • 化学泵包括压力室,用于将压力室分隔成清洁压力室和排出压力室的分隔构件,设置在排出压力室的初级侧的过滤器部分和单个驱动机构。 安装有各自的止回阀的一对开口设置在每个清洁和排出压力室中,并且被定位成使得抗蚀剂溶液仅在+ Z方向流动。 驱动机构使分隔构件向-X方向移动,使得抗蚀剂溶液被吸入清洗压力室,并使抗蚀剂溶液从排出压力室排出。 驱动机构使分隔构件沿+ X方向移动,使得抗蚀剂溶液从过滤器部分吸入排出压力室,并使抗蚀剂溶液从清洁压力室供应到过滤器部分,使得 吸附抗蚀剂溶液的量与供给的抗蚀剂溶液相等。 这防止了在抗蚀剂溶液的放电过程中的气泡锁定和微气泡现象。
    • 4. 发明授权
    • Substrate cleaning apparatus and method
    • 基板清洗装置及方法
    • US06286525B1
    • 2001-09-11
    • US09071683
    • 1998-05-01
    • Joichi NishimuraAkihiko MoritaMasami Ohtani
    • Joichi NishimuraAkihiko MoritaMasami Ohtani
    • B08B300
    • H01L21/67051B08B1/04B08B3/00H01L21/67046Y10S134/902
    • A plurality of cleaning devices of the same type are attached to one support arm. The cleaning devices are simultaneously moved over a surface to be cleaned of a substrate supported and spun by a substrate supporting and spinning mechanism. Thus, the same type of cleaning devices share the task of cleaning the entire surface of the substrate, thereby to improve cleaning efficiency and shorten cleaning time. Different types of cleaning devices may be attached to the support arm for simultaneous cleaning of the entire surface of the substrate. Where different types of cleaning brushes are attached to the support arm, a cleaning operation may be carried out by simultaneously using cleaning brushes of optimal hardness for different regions on the substrate surface.
    • 多个相同类型的清洁装置连接到一个支撑臂。 清洁装置同时移动到由基板支撑和旋转机构支撑和纺出的基板的待清洁表面上。 因此,相同类型的清洁装置共享清洁基板的整个表面的任务,从而提高清洁效率并缩短清洁时间。 可以将不同类型的清洁装置连接到支撑臂上,以同时清洁基板的整个表面。 在不同类型的清洁刷附接到支撑臂的情况下,清洁操作可以通过同时使用基板表面上不同区域的最佳硬度的清洁刷进行。
    • 7. 发明授权
    • Substrate heat treatment apparatus
    • 基板热处理装置
    • US08608885B2
    • 2013-12-17
    • US11566442
    • 2006-12-04
    • Shigehiro GotoKeiji MatsuchikaAkihiko Morita
    • Shigehiro GotoKeiji MatsuchikaAkihiko Morita
    • B29C65/02
    • F27D5/0037H01L21/6875H01L21/68757
    • A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.
    • 基板热处理装置包括具有平坦的上表面的热处理板,用于接触和支撑基板的耐热树脂形成的支撑装置,环形地设置用于气密地形成在基板和加热基板之间的空间的密封装置, 处理板和用于从空间排出气体的排气孔。 支撑装置由树脂形成,并且热处理板的上表面平坦,从而在基板表面的接触部分和非接触部分之间发生减少的传热速率差异。 因此,在抑制基板表面的热历史变化的同时,有效地对基板进行热处理。
    • 10. 发明申请
    • SUBSTRATE HEAT TREATMENT APPARATUS
    • 基材热处理设备
    • US20070128570A1
    • 2007-06-07
    • US11566442
    • 2006-12-04
    • Shigehiro GotoKeiji MatsuchikaAkihiko Morita
    • Shigehiro GotoKeiji MatsuchikaAkihiko Morita
    • F27D5/00
    • F27D5/0037H01L21/6875H01L21/68757
    • A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.
    • 基板热处理装置包括具有平坦的上表面的热处理板,用于接触和支撑基板的耐热树脂形成的支撑装置,环形地设置用于气密地形成在基板和加热基板之间的空间的密封装置, 处理板和用于从空间排出气体的排气孔。 支撑装置由树脂形成,并且热处理板的上表面平坦,从而在基板表面的接触部分和非接触部分之间发生减少的传热速率差异。 因此,在抑制基板表面的热历史变化的同时,有效地对基板进行热处理。