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    • 1. 发明授权
    • Substrate spin treating apparatus
    • 底物旋转处理装置
    • US5916366A
    • 1999-06-29
    • US944229
    • 1997-10-06
    • Tsutomu UeyamaAkira IzumiHideki Adachi
    • Tsutomu UeyamaAkira IzumiHideki Adachi
    • B05C11/08B08B11/02G03F7/16H01L21/00H01L21/687B05C5/00
    • H01L21/68728B05C11/08B08B11/02G03F7/162H01L21/6715H01L21/68792Y10S134/902
    • A substrate treating apparatus for performing a predetermined treatment of a substrate in a spin, has a spin motor including a rotor having a hollow opening centrally thereof, and a stator disposed coaxially with the rotor and having a hollow opening centrally thereof. The rotor includes holders for supporting the substrate in three peripheral positions thereof. A support mechanism switches the holders between a position for supporting the substrate, and a position retracted therefrom. The opposite surfaces of the substrate supported by the holders are cleaned with a cleaning solution supplied through nozzles. The holders have a substrate supporting force derived from a weight and magnetism of the support mechanism, to support the substrate reliably. A guide is disposed in the hollow of the rotor, and connected to the rotor. The holders are arranged in a substrate treating space formed inwardly of the guide. The holders are arranged on the guide. Thus, the spin motor is protected from exposure to a treating solution atmosphere.
    • 一种用于在旋转中进行基板的预定处理的基板处理装置,具有包括其中心具有中空开口的转子的旋转马达和与该转子同轴配置并具有中心的中空开口的定子。 转子包括用于在其三个周边位置支撑基板的保持器。 支撑机构在支撑基板的位置和从其缩回的位置之间切换支架。 由保持器支撑的基板的相对表面用通过喷嘴提供的清洁溶液进行清洁。 保持器具有源自支撑机构的重量和磁力的基板支撑力,以可靠地支撑基板。 引导件设置在转子的中空中并连接到转子。 保持器布置在形成在引导件内部的基板处理空间中。 支架安置在导轨上。 因此,保护​​旋转马达免于暴露于处理溶液气氛中。
    • 6. 发明授权
    • Linear actuator
    • 线性执行机构
    • US4757223A
    • 1988-07-12
    • US004587
    • 1987-01-20
    • Tsutomu Ueyama
    • Tsutomu Ueyama
    • H02K41/06H01L41/09H02N2/00H02K7/06
    • H02N2/02
    • A linear actuator constructed so as to convert deformation movements of a plurality of electrostrictive elements to a reciprocating movement of an output shaft thereof. The linear actuator comprises a planetary driving unit adapted to be driven by a plurality of electrostrictive elements in a casing body thereof, a precessional driving unit adapted to be driven by a plurality of electrostrictive elements therein a contact ring connected interlockingly to both the planetary driving unit and the precessional driving unit therein and the output shaft engaged loosely to the interior surface of the contact ring and supported reciprocatively by the casing body. The voltages applied to the electrostrictive elements are controlled so as for the contact ring to be driven to perform a planetary movement with being pressed onto the output shaft and to be driven to perform a precessional movement by the precessional driving unit. The contact point between the contact ring and the output shaft results in being driven to perform a relative movement with describing a spiral path by those planetary and precessional movements.
    • 线性致动器,其被构造成将多个电致伸缩元件的变形运动转换成其输出轴的往复运动。 线性致动器包括适于由其壳体内的多个电致伸缩元件驱动的行星驱动单元,适于由多个电致伸缩元件驱动的进动驱动单元,该接触环与行星驱动单元互锁地连接 并且其中的进动驱动单元和输出轴松动地接合到接触环的内表面并且由壳体主体往复运动。 控制施加到电致伸缩元件的电压,使得接触环被驱动以通过被按压到输出轴上而进行行星运动,并被驱动以由进动驱动单元执行进动运动。 接触环和输出轴之间的接触点导致被驱动以通过这些行星和进动运动描述螺旋路径进行相对运动。
    • 8. 发明授权
    • Thin film forming apparatus and thin film forming method
    • 薄膜形成装置和薄膜形成方法
    • US06918421B2
    • 2005-07-19
    • US10263513
    • 2002-10-01
    • Tsutomu UeyamaIzuru Iseki
    • Tsutomu UeyamaIzuru Iseki
    • H01L21/31B32B38/10H01L21/20H01L21/316B23K37/00B32B31/04B32B31/20H01L21/28H01L21/46
    • B32B38/10B32B37/025B32B2457/14Y10T156/171Y10T156/1744Y10T156/19
    • With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.
    • 利用形成在石英板表面上的朝向绝缘膜的基板的薄膜承载面,基板和石英板彼此靠近移动,并且绝缘膜紧密地附着在薄膜承载表面上 (附着工序)。 然后选择性地剥离石英板,从而完成将绝缘膜转移到基板上(剥离过程)。 以这种方式,绝缘膜设置在基板的薄膜承载表面上,并且输送机构然后将基板容纳在基板盒中。 同时,在将石英板由输送机构输送到清洁单元并通过清洁单元进行清洁(清洗处理)之后,将石英板返回到板状构件盒中,并在该盒中等待直到重新使用。
    • 10. 发明授权
    • Apparatus for and method of heat treatment by light irradiation
    • 光照射加热处理装置及方法
    • US06859616B2
    • 2005-02-22
    • US10729460
    • 2003-12-05
    • Tatsufumi KusudaTsutomu Ueyama
    • Tatsufumi KusudaTsutomu Ueyama
    • H01L21/324H01L21/00H05B3/00F26B19/00
    • H01L21/67115H05B3/0047
    • A semiconductor wafer is held by support pins horizontally. A susceptor and a heating plate are moved upwardly so that the semiconductor wafer is transferred from the support pins to the susceptor. At this time, a gas layer is sandwiched between the upper surface of the susceptor and the lower surface of the semiconductor wafer to cause the semiconductor wafer to float over the upper surface of the susceptor for about seventy seconds immediately after the semiconductor wafer is mounted on the upper surface of the susceptor. Then, flash lamps are lit up to perform flash heating while the semiconductor wafer is floating over the upper surface of the susceptor. Even when flashlight irradiation causes rapid thermal expansion of the wafer surface, the semiconductor wafer does not suffer a great stress. This can prevent the semiconductor wafer from breaking.
    • 半导体晶片由支撑销水平地保持。 感受器和加热板向上移动,使得半导体晶片从支撑销转移到基座。 此时,气氛层被夹在基座的上表面和半导体晶片的下表面之间,以使半导体晶片在半导体晶片安装之后立即漂浮在基座的上表面上大约七十秒 感受器的上表面。 然后,闪光灯点亮以进行闪光加热,同时半导体晶片浮在基座的上表面上。 即使当手电筒照射导致晶片表面的快速热膨胀时,半导体晶片也不会承受很大的应力。 这可以防止半导体晶片破裂。