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1. 发明授权

US07438945B2 Method of producing multilayer interconnection board 失效
标题翻译：生产多层互连板的方法
公开(公告)号：US07438945B2
公开(公告)日：2008-10-21
申请号：US11033340
申请日：2005-01-11
申请人： Shigetsugu Muramatsu , Katsumi Yamazaki
发明人： Shigetsugu Muramatsu , Katsumi Yamazaki
IPC分类号： B05D5/12 , B05D3/00
CPC分类号： H05K3/005 , H05K3/107 , H05K3/4644 , H05K3/465 , H05K2203/0108 , H05K2203/0582 , H05K2203/1189 , H05K2203/308
摘要： A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hole. In the method of producing a multilayer interconnection board, a thermal setting resin, which has a setting temperature higher than that of the resin member, is applied on a via-connecting portion of the interconnection layer, the resin member is formed on the interconnection layer, an interconnection groove and a via hole are formed by imprinting press on the resin member by using a tool, and an un-cured portion of the high temperature setting resin is dissolved and removed by using a resin solvent. Thereby, residue of the resin member on the thermal setting resin is removed.
摘要翻译：公开了一种制造多层互连板的方法，其包括通过压印机在互连层上处理树脂部件的步骤，以及在形成通孔之后在通孔的底部除去树脂部件的残留物。在制造多层互连板的方法中，将具有比树脂构件的设定温度高的设定温度的热定型树脂施加在互连层的过孔连接部分上，树脂构件形成在互连层通过使用工具通过压印在树脂部件上形成互连槽和通孔，并且通过使用树脂溶剂将高温固化树脂的未固化部分溶解并除去。由此，除去热固化树脂上的树脂部件的残留物。

2. 发明授权

US07183196B2 Multilayer interconnection board and production method thereof 有权
标题翻译：多层互连板及其制作方法
公开(公告)号：US07183196B2
公开(公告)日：2007-02-27
申请号：US11026971
申请日：2004-12-30
申请人： Shigetsugu Muramatsu , Masato Tanaka , Katsumi Yamazaki
发明人： Shigetsugu Muramatsu , Masato Tanaka , Katsumi Yamazaki
IPC分类号： H01L21/4763 , H01L21/44 , H01L21/48 , H01L21/52 , H01L21/40
CPC分类号： H05K3/465 , H05K1/115 , H05K3/005 , H05K3/107 , H05K3/421 , H05K2201/09036 , H05K2201/09045 , H05K2203/0108 , H05K2203/0733 , H05K2203/1189
摘要： A multilayer interconnection board is disclosed that allows reliable electrical connection between an interconnection having a large width and a large area and a via provided in a via hole formed by pressing a tool against resin. A projecting portion for electrical connection is formed integrally with the insulating member and in a second interconnection groove having a width and an area greater than those of a first interconnection groove. While a first interconnection is being deposited in the first interconnection groove and a second interconnection is being deposited in the second interconnection groove, the projecting portion is formed in the second interconnection groove and a metal plating film is provided on the projecting portion at the same time, so as to electrically connect the second interconnection with the via.
摘要翻译：公开了一种多层互连板，其允许具有大宽度和大面积的互连之间的可靠电连接，以及设置在通过将工具压靠树脂而形成的通孔中的通孔。用于电连接的突出部分与绝缘构件一体地形成在具有大于第一互连槽的宽度和面积的第二互连槽中。当在第一互连槽中沉积第一互连件并且第二互连件被沉积在第二互连槽中时，突出部分形成在第二互连槽中，同时在突出部分上设置金属镀膜以便将第二互连电路与通孔电连接。

3. 发明申请

US20050146038A1 Multilayer interconnection board and production method thereof 有权
标题翻译：多层互连板及其制作方法
公开(公告)号：US20050146038A1
公开(公告)日：2005-07-07
申请号：US11026971
申请日：2004-12-30
申请人： Shigetsugu Muramatsu , Masato Tanaka , Katsumi Yamazaki
发明人： Shigetsugu Muramatsu , Masato Tanaka , Katsumi Yamazaki
IPC分类号： H01L21/4763 , H05K1/11 , H05K3/00 , H05K3/10 , H05K3/42 , H05K3/46
CPC分类号： H05K3/465 , H05K1/115 , H05K3/005 , H05K3/107 , H05K3/421 , H05K2201/09036 , H05K2201/09045 , H05K2203/0108 , H05K2203/0733 , H05K2203/1189
摘要： A multilayer interconnection board is disclosed that allows reliable electrical connection between an interconnection having a large width and a large area and a via provided in a via hole formed by pressing a tool against resin. A projecting portion for electrical connection is formed integrally with the insulating member and in a second interconnection groove having a width and an area greater than those of a first interconnection groove. While a first interconnection is being deposited in the first interconnection groove and a second interconnection is being deposited in the second interconnection groove, the projecting portion is formed in the second interconnection groove and a metal plating film is provided on the projecting portion at the same time, so as to electrically connect the second interconnection with the via.
摘要翻译：公开了一种多层互连板，其允许具有大宽度和大面积的互连之间的可靠电连接，以及设置在通过将工具压靠树脂而形成的通孔中的通孔。用于电连接的突出部分与绝缘构件一体地形成在具有大于第一互连槽的宽度和面积的第二互连槽中。当在第一互连槽中沉积第一互连件并且第二互连件被沉积在第二互连槽中时，突出部分形成在第二互连槽中，同时在突出部分上设置金属镀膜以便将第二互连电路与通孔电连接。

4. 发明申请

US20050158455A1 Method of producing multilayer interconnection board 失效
标题翻译：生产多层互连板的方法
公开(公告)号：US20050158455A1
公开(公告)日：2005-07-21
申请号：US11033340
申请日：2005-01-11
申请人： Shigetsugu Muramatsu , Katsumi Yamazaki
发明人： Shigetsugu Muramatsu , Katsumi Yamazaki
IPC分类号： H05K3/46 , B05D5/12 , H05K3/00 , H05K3/10
CPC分类号： H05K3/005 , H05K3/107 , H05K3/4644 , H05K3/465 , H05K2203/0108 , H05K2203/0582 , H05K2203/1189 , H05K2203/308
摘要： A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hole. In the method of producing a multilayer interconnection board, a thermal setting resin, which has a setting temperature higher than that of the resin member, is applied on a via-connecting portion of the interconnection layer, the resin member is formed on the interconnection layer, an interconnection groove and a via hole are formed by imprinting press on the resin member by using a tool, and an un-cured portion of the high temperature setting resin is dissolved and removed by using a resin solvent. Thereby, residue of the resin member on the thermal setting resin is removed.
摘要翻译：公开了一种制造多层互连板的方法，其包括通过压印机在互连层上处理树脂部件的步骤，以及在形成通孔之后在通孔的底部除去树脂部件的残留物。在制造多层互连板的方法中，将具有比树脂构件的设定温度高的设定温度的热定型树脂施加在互连层的过孔连接部分上，树脂构件形成在互连层通过使用工具通过压印在树脂部件上形成互连槽和通孔，并且通过使用树脂溶剂将高温固化树脂的未固化部分溶解并除去。由此，除去热固化树脂上的树脂部件的残留物。

5. 发明授权

US07286367B2 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board 有权
标题翻译：具有内置无源器件的印刷电路板，印刷电路板的制造方法和用于印刷电路板的元件板
公开(公告)号：US07286367B2
公开(公告)日：2007-10-23
申请号：US10339655
申请日：2003-01-10
申请人： Toshihiro Miyake , Satoshi Takeuchi , Koji Kondo , Toshikazu Harada , Masayuki Aoyama , Yoshitaro Yazaki , Kazuo Tada , Yoshihiko Shiraishi , Yosuke Ozaki , Katsumi Yamazaki , Seiji Konishi , Seiichi Shindou
发明人： Toshihiro Miyake , Satoshi Takeuchi , Koji Kondo , Toshikazu Harada , Masayuki Aoyama , Yoshitaro Yazaki , Kazuo Tada , Yoshihiko Shiraishi , Yosuke Ozaki , Katsumi Yamazaki , Seiji Konishi , Seiichi Shindou
IPC分类号： H05K1/16
CPC分类号： H05K3/4632 , H01L2924/0002 , H05K1/162 , H05K1/167 , H05K3/4069 , H05K3/4617 , H05K3/4688 , H05K2201/0129 , H05K2201/0355 , H05K2201/0394 , H05K2201/09672 , H05K2203/0361 , H01L2924/00
摘要： A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.
摘要翻译：具有内置电容器的多层印刷电路板包括多个树脂膜，每个树脂膜由热塑性树脂制成，并且在预定位置具有多个通孔，多个导电图案位于树脂上膜和多个导电图案互连构件，它们位于通孔中，以电连接由树脂膜电分离的导电图案。两个导电图案分别位于一个树脂膜上彼此相对的两个表面上，同时重叠。导电图案中的两个和树脂膜中的一个构成电容器。

6. 发明授权

US4984161A Method for controlling automatic transmissions 失效
标题翻译：控制自动变速箱的方法
公开(公告)号：US4984161A
公开(公告)日：1991-01-08
申请号：US171707
申请日：1988-03-22
申请人： Takeshi Nakazawa , Jun Hashimoto , Shinichi Nakamura , Katsumi Yamazaki , Yoshihiro Nakajima , Tsutomu Hayashi , Tetsuya Ichikawa , Nobuyuki Yakigaya , Kiyoshi Katahira , Yoshinobu Takeshima
发明人： Takeshi Nakazawa , Jun Hashimoto , Shinichi Nakamura , Katsumi Yamazaki , Yoshihiro Nakajima , Tsutomu Hayashi , Tetsuya Ichikawa , Nobuyuki Yakigaya , Kiyoshi Katahira , Yoshinobu Takeshima
IPC分类号： B62M19/00 , F16H61/421 , F16H61/46 , F16H61/462
CPC分类号： F16H61/46 , B62M19/00 , F16H61/462 , F16H61/421 , Y10T477/636
摘要： The present invention relates to a method for controlling an automatic transmission of a vehicle which is capable of continuously changing a transmission ratio (Rt) and transmission coefficient (Ct). The method is three fold, that is, an initial stage control procedure, a special stage control procedure and a normal stage control procedure having priority in operation in this order.At the initial stage control procedure, Rt and Ct are determined, according to a plurality of indices representing a state of the vehicle, so that the vehicle is accelerated effectively, in general.At the special stage control procedure, Rt and Ct are determined, when a propelling force transmitting path for transmitting propelling force from an engine to the ground is disconnected at least at one part, so that a shock due to a recovery of said propelling force transmitting path is minimized.At the normal stage control procedure, Rt and Ct are determined so that the vehicle responds to the operation of the driver swiftly.
摘要翻译：本发明涉及能够连续地变更传输比（Rt）和传输系数（Ct）的车辆的自动变速器的控制方法。该方法是按顺序操作优先级的三级，即初始级控制程序，专用级控制程序和正常级控制程序。在初始阶段控制程序中，根据代表车辆状态的多个指标来确定Rt和Ct，从而通常有效地加速车辆。在特殊阶段控制程序中，当用于将发动机的传动力从发动机传递到地面的推进力传递路径至少在一个部分被断开时，确定了Rt和Ct，使得由于所述推进力的传递而产生的冲击路径被最小化。在正常阶段控制程序中，确定了Rt和Ct，使车辆迅速响应司机的操作。

7. 发明授权

US4887557A Process for producing an intake manifold 失效
标题翻译：用于制造进气歧管的过程
公开(公告)号：US4887557A
公开(公告)日：1989-12-19
申请号：US271269
申请日：1988-11-15
申请人： Minobu Sukimoto , Katsumi Yamazaki , Naohisa Hirunuma , Seijiro Taguchi , Tadashi Usui , Yasushi Akiyoshi , Toyoichiro Nogami , Toyoji Kaneko
发明人： Minobu Sukimoto , Katsumi Yamazaki , Naohisa Hirunuma , Seijiro Taguchi , Tadashi Usui , Yasushi Akiyoshi , Toyoichiro Nogami , Toyoji Kaneko
IPC分类号： F02B1/04 , F02B75/22 , F02M35/10 , F02M35/104
CPC分类号： F02M35/112 , F02B75/22 , F02M35/10052 , F02M35/10072 , F02M35/10111 , F02M35/10144 , F02M35/10327 , F02M35/10347 , F02M35/1036 , F02B1/04 , F05C2225/08 , Y02T10/14 , Y10T29/49398
摘要： A process for producing an intake manifold having a main pipe made of wrought aluminum material and having an open end, a closed end opposite to the open end, a plurality of holes formed in its peripheral wall and outward tubular projections integral with the peripheral wall and each formed around each of the holes, and a plurality of branch pipes made of wrought aluminum material and each having one end fitting in and joined to each of the tubular projections. The manifold is smooth-surfaced in its interior, diminished in resistance to air and improved in air intake efficiency. The manifold requires no finishing procedure unlike those prepared by casting.

8. 发明授权

US07036214B2 Manufacturing method of rigid-flexible printed circuit board and structure thereof 有权
公开(公告)号：US07036214B2
公开(公告)日：2006-05-02
申请号：US10383227
申请日：2003-03-07
申请人： Koji Kondo , Satoshi Takeuchi , Tomohiro Yokochi , Katsumi Yamazaki , Masakazu Terada
发明人： Koji Kondo , Satoshi Takeuchi , Tomohiro Yokochi , Katsumi Yamazaki , Masakazu Terada
IPC分类号： H05K3/36
CPC分类号： H05K3/4691 , H05K1/118 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0909 , H05K2201/09109 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

9. 发明授权

US4829944A Intake manifold and process for producing same 失效
标题翻译：进气歧管和生产过程
公开(公告)号：US4829944A
公开(公告)日：1989-05-16
申请号：US65461
申请日：1987-06-23
申请人： Minobu Sukimoto , Katsumi Yamazaki , Naohisa Hirunuma , Seijiro Taguchi , Tadashi Usui , Yasushi Akiyoshi , Toyoichiro Nogami , Toyoji Kaneko
发明人： Minobu Sukimoto , Katsumi Yamazaki , Naohisa Hirunuma , Seijiro Taguchi , Tadashi Usui , Yasushi Akiyoshi , Toyoichiro Nogami , Toyoji Kaneko
IPC分类号： F02B1/04 , F02B75/22 , F02M35/10 , F02M35/104
CPC分类号： F02M35/112 , F02B75/22 , F02M35/10052 , F02M35/10072 , F02M35/10111 , F02M35/10144 , F02M35/10327 , F02M35/10347 , F02M35/1036 , F02B1/04 , F05C2225/08 , Y02T10/14 , Y10T29/49398
摘要： An intake manifold comprising a main pipe made of wrought aluminum material and having an open end, a closed end opposite to the open end, a plurality of holes formed in its peripheral wall and outward tubular projections integral with the peripheral wall and each formed around each of the holes, and a plurality of branch pipes made of wrought aluminum material and each having one end fitting in and joined to each of the tubular projections. The manifold is smooth-surfaced in its interior, diminished in resistance to air and improved in air intake efficiency. The manifold requires no finishing procedure unlike those prepared by casting.
摘要翻译：一种进气歧管，包括由锻铝材料制成的主管，具有开口端，与开口端相对的封闭端，在其周壁形成的多个孔和与周壁一体形成的每个形状的外部管状突起，的孔，以及由锻造铝材料制成的多个分支管，并且每个分支管具有一个端部装配并连接到每个管状突起。歧管在其内部光滑表面，抵抗空气减少，空气进入效率提高。歧管不需要通过铸造制备的整理程序。

10. 发明申请

US20070126108A1 EXTERNAL CONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于半导体封装的外部连接结构及其制造方法
公开(公告)号：US20070126108A1
公开(公告)日：2007-06-07
申请号：US11566436
申请日：2006-12-04
申请人： Katsumi Yamazaki , Masato Tanaka
发明人： Katsumi Yamazaki , Masato Tanaka
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L2924/0002 , H05K1/111 , H05K3/108 , H05K3/243 , H05K3/3452 , H05K3/4007 , H05K2201/0367 , H05K2201/0376 , H05K2203/025 , H05K2203/0574 , Y02P70/611 , H01L2924/00
摘要： Conductive posts to be connected with external connection terminals are formed on a conductive pattern formed on a substrate, and an insulating resin sheet is laminated on the conductive pattern having the conductive posts formed thereon, so as to be flush with the end faces of the conductive posts 3 exposed to the substrate surface.
摘要翻译：与外部连接端子连接的导电柱形成在形成在基板上的导电图案上，并且绝缘树脂片层压在其上形成有导电柱的导电图案上，以与导电的端面齐平柱3暴露于基底表面。

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