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1. 发明授权

US06653189B1 Source side boron implant and drain side MDD implant for deep sub 0.18 micron flash memory 有权
标题翻译：源极硼注入和漏极侧MDD植入物用于深亚0.18微米闪存
公开(公告)号：US06653189B1
公开(公告)日：2003-11-25
申请号：US09699711
申请日：2000-10-30
申请人： Sameer Haddad , Yue-song He , Timothy Thurgate , Chi Chang , Mark W. Randolph , Ngaching Wong
发明人： Sameer Haddad , Yue-song He , Timothy Thurgate , Chi Chang , Mark W. Randolph , Ngaching Wong
IPC分类号： H01L21336
CPC分类号： H01L29/66825 , H01L29/66833
摘要： One aspect of the present invention relates to a method of making a flash memory cell, involving the steps of providing a substrate having a flash memory cell thereon; forming a self-aligned source mask over the substrate, the self aligned source mask having openings corresponding to source lines; implanting a source dopant of a first type in the substrate through the openings in the self-aligned source mask corresponding to source lines; removing the self-aligned source mask from the substrate; forming a MDD mask over the substrate, the MDD mask covering the source lines and having openings corresponding to drain lines; and implanting a medium dosage drain implant of a second type to form a drain region in the substrate adjacent the flash memory cell.
摘要翻译：本发明的一个方面涉及一种制造闪存单元的方法，包括以下步骤：在其上提供闪存单元; 在衬底上形成自对准源掩模，所述自对准源掩模具有对应于源极线的开口; 通过对应于源极线的自对准源掩模中的开口将衬底中的第一类型源掺杂剂注入到衬底中; 从衬底去除自对准源掩模; 在衬底上形成MDD掩模，MDD掩模覆盖源极线并具有对应于漏极线的开口; 以及植入第二类型的介质剂量漏极注入，以在与所述闪存单元相邻的所述衬底中形成漏极区域。

2. 发明授权

US06524914B1 Source side boron implanting and diffusing device architecture for deep sub 0.18 micron flash memory 有权
标题翻译：源极硼注入和扩散器件架构，用于深亚0.18微米闪存
公开(公告)号：US06524914B1
公开(公告)日：2003-02-25
申请号：US09699972
申请日：2000-10-30
申请人： Yue-song He , Sameer Haddad , Timothy Thurgate , Chi Chang
发明人： Yue-song He , Sameer Haddad , Timothy Thurgate , Chi Chang
IPC分类号： H01L218247
CPC分类号： H01L29/66825 , H01L29/66833
摘要： One aspect of the present invention relates to a method of making a flash memory cell involving the steps of providing a substrate having a flash memory cell thereon; forming a self-aligned source mask over the substrate, the self aligned source mask having openings corresponding to source lines; implanting a source dopant of a first type in the substrate through the openings in the self-aligned source mask corresponding to source lines; removing the self-aligned source mask from the substrate; cleaning the substrate; and implanting a medium dosage drain implant of a second type to form a source region and a drain region in the substrate adjacent the flash memory cell.
摘要翻译：本发明的一个方面涉及一种制造闪存单元的方法，所述闪存单元包括以下步骤：提供其上具有闪存单元的基板; 在衬底上形成自对准源掩模，所述自对准源掩模具有对应于源极线的开口; 通过对应于源极线的自对准源掩模中的开口将衬底中的第一类型源掺杂剂注入到衬底中; 从衬底去除自对准源掩模; 清洗基材; 以及植入第二类型的介质剂量漏极注入以在所述衬底中邻近所述闪存单元形成源极区域和漏极区域。

3. 发明授权

US06773990B1 Method for reducing short channel effects in memory cells and related structure 有权
标题翻译：减少存储单元短路效应的方法及相关结构
公开(公告)号：US06773990B1
公开(公告)日：2004-08-10
申请号：US10429150
申请日：2003-05-03
申请人： Richard Fastow , Yue-Song He , Kazuhiro Mizutani , Timothy Thurgate
发明人： Richard Fastow , Yue-Song He , Kazuhiro Mizutani , Timothy Thurgate
IPC分类号： H10L21336
CPC分类号： H01L27/11521 , H01L27/115
摘要： According to one exemplary embodiment, a method for fabricating a floating gate memory array comprises a step of removing a dielectric material from an isolation region situated in a substrate to expose a trench, where the trench is situated between a first source region and a second source region, where the trench defines sidewalls in the substrate. The method further comprises implanting an N type dopant in the first source region, the second source region, and the sidewalls of the trench, where the N type dopant forms an N+ type region. The method further comprises implanting a P type dopant in the first source region, the second source region, and the sidewalls of the trench, where the P type dopant forms a P type region, and where the P type region is situated underneath the N+ type region.
摘要翻译：根据一个示例性实施例，一种用于制造浮动栅极存储器阵列的方法包括从位于衬底中的隔离区域去除介电材料以暴露沟槽的步骤，其中沟槽位于第一源区域和第二源极之间区域，其中沟槽限定衬底中的侧壁。该方法还包括在第一源极区域，第二源极区域和沟槽的侧壁中注入N型掺杂剂，其中N型掺杂剂形成N +型区域。该方法还包括在第一源极区域，第二源极区域和沟槽的侧壁中注入P型掺杂剂，其中P型掺杂剂形成P型区域，并且其中P型区域位于N +型下方地区。

4. 发明授权

US06963106B1 Memory array with memory cells having reduced short channel effects 有权
标题翻译：具有存储单元的存储器阵列具有减少的短通道效应
公开(公告)号：US06963106B1
公开(公告)日：2005-11-08
申请号：US10839626
申请日：2004-05-04
申请人： Richard Fastow , Yue-Song He , Kazuhiro Mizutani , Timothy Thurgate
发明人： Richard Fastow , Yue-Song He , Kazuhiro Mizutani , Timothy Thurgate
IPC分类号： H01L21/8247 , H01L27/115 , H01L21/788
CPC分类号： H01L27/11521 , H01L27/115
摘要： According to one exemplary embodiment, a method for fabricating a floating gate memory array comprises a step of removing a dielectric material from an isolation region situated in a substrate to expose a trench, where the trench is situated between a first source region and a second source region, where the trench defines sidewalls in the substrate. The method further comprises implanting an N type dopant in the first source region, the second source region, and the sidewalls of the trench, where the N type dopant forms an N+ type region. The method further comprises implanting a P type dopant in the first source region, the second source region, and the sidewalls of the trench, where the P type dopant forms a P type region, and where the P type region is situated underneath the N+ type region.
摘要翻译：根据一个示例性实施例，一种用于制造浮动栅极存储器阵列的方法包括从位于衬底中的隔离区域去除介电材料以暴露沟槽的步骤，其中沟槽位于第一源区域和第二源极之间区域，其中沟槽限定衬底中的侧壁。该方法还包括在第一源极区域，第二源极区域和沟槽的侧壁中注入N型掺杂剂，其中N型掺杂剂形成N +型区域。该方法还包括在第一源极区域，第二源极区域和沟槽的侧壁中注入P型掺杂剂，其中P型掺杂剂形成P型区域，并且其中P型区域位于N +型下方地区。

5. 发明申请

US20050077567A1 Memory cell array with staggered local inter-connect structure 失效
标题翻译：具有交错局部互连结构的存储单元阵列
公开(公告)号：US20050077567A1
公开(公告)日：2005-04-14
申请号：US10685044
申请日：2003-10-14
申请人： Mark Randolph , Sameer Haddad , Timothy Thurgate , Richard Fastow
发明人： Mark Randolph , Sameer Haddad , Timothy Thurgate , Richard Fastow
IPC分类号： G11C16/04 , H01L21/8246 , H01L21/8247 , H01L27/115 , H01L29/788
CPC分类号： H01L27/11568 , G11C16/0483 , H01L27/115 , H01L27/11521
摘要： A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.
摘要翻译：存储单元阵列包括在半导体衬底上制造的存储器单元的二维阵列。存储单元布置成多行和多列。每列存储单元包括多个交替沟道区和源极/漏极区。导电互连位于每个源极/漏极区域上方并且仅耦合到另一个源极/漏极区域。另一个源/漏区位于与该列相邻的第二列中。导电互连被定位成使得每隔一个导电布线连接到列的右侧的相邻列，并且每隔一个导电布线连接到列的左侧的相邻列。多个源极/漏极控制线在相邻列的存储器单元之间延伸，并且电耦合到在相邻列之间耦合的每个导电互连。

6. 发明授权

US06911704B2 Memory cell array with staggered local inter-connect structure 失效
公开(公告)号：US06911704B2
公开(公告)日：2005-06-28
申请号：US10685044
申请日：2003-10-14
申请人： Mark W. Randolph , Sameer S. Haddad , Timothy Thurgate , Richard Fastow
发明人： Mark W. Randolph , Sameer S. Haddad , Timothy Thurgate , Richard Fastow
IPC分类号： G11C16/04 , H01L21/8246 , H01L21/8247 , H01L27/115 , H01L27/082
CPC分类号： H01L27/11568 , G11C16/0483 , H01L27/115 , H01L27/11521
摘要： A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.

7. 发明授权

US07785965B2 Dual storage node memory devices and methods for fabricating the same 有权
标题翻译：双存储节点存储器件及其制造方法
公开(公告)号：US07785965B2
公开(公告)日：2010-08-31
申请号：US11530145
申请日：2006-09-08
申请人： Unsoon Kim , Kyunghoon Min , Ning Cheng , Hiroyuki Kinoshita , Sugino Rinji , Timothy Thurgate , Angela Hui , Jihwan Choi , Chi Chang
发明人： Unsoon Kim , Kyunghoon Min , Ning Cheng , Hiroyuki Kinoshita , Sugino Rinji , Timothy Thurgate , Angela Hui , Jihwan Choi , Chi Chang
IPC分类号： H01L21/336
CPC分类号： H01L27/115 , H01L27/11568 , H01L29/42352 , H01L29/7923
摘要： Dual storage node memory devices and methods for fabricating dual storage node memory devices have been provided. In accordance with an exemplary embodiment, a method includes the steps of etching a plurality of trenches in a semiconductor substrate and forming a layered structure within the trenches. The layered structure includes a tunnel dielectric layer and a charge storage layer. Bit lines are formed within the semiconductor substrate and a layer of conductive material is deposited overlying the layered structure.
摘要翻译：已经提供了双存储节点存储器件和用于制造双存储节点存储器件的方法。根据示例性实施例，一种方法包括以下步骤：蚀刻半导体衬底中的多个沟槽并在沟槽内形成分层结构。层状结构包括隧道介电层和电荷存储层。位线形成在半导体衬底内，并且一层导电材料沉积在层叠结构之上。

8. 发明申请

US20080064165A1 DUAL STORAGE NODE MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME 有权
标题翻译：双存储节点存储器件及其制造方法
公开(公告)号：US20080064165A1
公开(公告)日：2008-03-13
申请号：US11530145
申请日：2006-09-08
申请人： Unsoon Kim , Kyunghoon Min , Ning Cheng , Hiroyuki Kinoshita , Sugino Rinji , Timothy Thurgate , Angela Hui , Jihwan Choi , Chi Chang
发明人： Unsoon Kim , Kyunghoon Min , Ning Cheng , Hiroyuki Kinoshita , Sugino Rinji , Timothy Thurgate , Angela Hui , Jihwan Choi , Chi Chang
IPC分类号： H01L21/336
CPC分类号： H01L27/115 , H01L27/11568 , H01L29/42352 , H01L29/7923
摘要： Dual storage node memory devices and methods for fabricating dual storage node memory devices have been provided. In accordance with an exemplary embodiment, a method includes the steps of etching a plurality of trenches in a semiconductor substrate and forming a layered structure within the trenches. The layered structure includes a tunnel dielectric layer and a charge storage layer. Bit lines are formed within the semiconductor substrate and a layer of conductive material is deposited overlying the layered structure.
摘要翻译：已经提供了双存储节点存储器件和用于制造双存储节点存储器件的方法。根据示例性实施例，一种方法包括以下步骤：蚀刻半导体衬底中的多个沟槽并在沟槽内形成分层结构。层状结构包括隧道介电层和电荷存储层。位线形成在半导体衬底内，并且一层导电材料沉积在层叠结构之上。

9. 发明授权

US08076712B2 Semiconductor memory comprising dual charge storage nodes and methods for its fabrication 有权
标题翻译：半导体存储器包括双电荷存储节点及其制造方法
公开(公告)号：US08076712B2
公开(公告)日：2011-12-13
申请号：US12840165
申请日：2010-07-20
申请人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
发明人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
IPC分类号： H01L29/788
CPC分类号： H01L29/42332 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： A dual charge storage node memory device and methods for its fabrication are provided. In one embodiment a dielectric plug is formed comprising a first portion recessed into a semiconductor substrate and a second portion extending above the substrate. A layer of semiconductor material is formed overlying the second portion. A first layered structure is formed overlying a first side of the second portion of the dielectric plug, and a second layered structure is formed overlying a second side, each of the layered structures overlying the layer of semiconductor material and comprising a charge storage layer between first and second dielectric layers. Ions are implanted into the substrate to form a first bit line and second bit line, and a layer of conductive material is deposited and patterned to form a control gate overlying the dielectric plug and the first and second layered structures.
摘要翻译：提供了双电荷存储节点存储器件及其制造方法。在一个实施例中，形成包括凹入半导体衬底的第一部分和在衬底上延伸的第二部分的电介质插塞。在第二部分上形成一层半导体材料。第一层状结构形成在电介质塞的第二部分的第一侧上，并且第二层结构形成在第二侧上，每个层叠结构覆盖在半导体材料层上，并且包括第一和第二层之间的电荷存储层和第二电介质层。将离子注入到衬底中以形成第一位线和第二位线，并且沉积和图案化导电材料层以形成覆盖在电介质插塞和第一和第二分层结构上的控制栅极。

10. 发明授权

US07767517B2 Semiconductor memory comprising dual charge storage nodes and methods for its fabrication 有权
标题翻译：半导体存储器包括双电荷存储节点及其制造方法
公开(公告)号：US07767517B2
公开(公告)日：2010-08-03
申请号：US11613513
申请日：2006-12-20
申请人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
发明人： Chungho Lee , Ashot Melik-Martirosian , Wei Zheng , Timothy Thurgate , Chi Chang , Hiroyuki Kinoshita , Kuo-Tung Chang , Unsoon Kim
IPC分类号： H01L21/8242
CPC分类号： H01L29/42332 , H01L27/115 , H01L27/11521 , H01L27/11568 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： A dual charge storage node memory device and methods for its fabrication are provided. In one embodiment a dielectric plug is formed comprising a first portion recessed into a semiconductor substrate and a second portion extending above the substrate. A layer of semiconductor material is formed overlying the second portion. A first layered structure is formed overlying a first side of the second portion of the dielectric plug, and a second layered structure is formed overlying a second side, each of the layered structures overlying the layer of semiconductor material and comprising a charge storage layer between first and second dielectric layers. Ions are implanted into the substrate to form a first bit line and second bit line, and a layer of conductive material is deposited and patterned to form a control gate overlying the dielectric plug and the first and second layered structures.
摘要翻译：提供了双电荷存储节点存储器件及其制造方法。在一个实施例中，形成包括凹入半导体衬底的第一部分和在衬底上延伸的第二部分的电介质插塞。在第二部分上形成一层半导体材料。第一层状结构形成在电介质塞的第二部分的第一侧上，并且形成在第二侧上的第二层状结构，每个层叠结构覆盖在半导体材料层上，并且包括第一和第二层之间的电荷存储层和第二电介质层。将离子注入到衬底中以形成第一位线和第二位线，并且沉积和图案化导电材料层以形成覆盖在电介质插塞和第一和第二分层结构上的控制栅极。

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