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    • 1. 发明授权
    • Method and device for the electrochemical treatment with treatment
liquid of an item to be treated
    • 用于处理物品的处理液进行电化学处理的方法和装置
    • US06071400A
    • 2000-06-06
    • US162659
    • 1998-09-29
    • Rolf SchroderReinhard SchneiderLorenz KoppThomas RydlewskiHorst Steffen
    • Rolf SchroderReinhard SchneiderLorenz KoppThomas RydlewskiHorst Steffen
    • H05K3/06C25D5/02C25D5/06C25D17/10C25F7/00H05K3/07H05K3/24B23H5/00
    • H05K3/07C25D17/005C25D17/008C25D5/02C25F7/00H05K3/241
    • The invention relates to a method and device for the electrochemical treatment of electrically mutually insulated, electrically conductive areas on an item to be treated by means of a treatment liquid. Insulated, for example etched structures on circuit boards cannot be treated electrochemically with known methods since there exists no electrical connection to the bath current source from individual areas. According to the invention, this connection is produced by brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. A large number of brushes which are arranged transversely to the direction of transportation take care of the fact that all the electrically conductive areas on the item to be treated which are arranged in an insulated manner from one another are contacted electrically at least one after another and that the achieved contact time is sufficiently long. Counter-electrodes, which may be also designed as movable brushes, are situated preferably between the brush electrodes. In electrochemical processes, in which metal is deposited, the brushes are deplated cyclically. For this purpose, various possible solutions are proposed.
    • PCT No.PCT / EP97 / 01544 Sec。 371日期1997年7月16日 102(e)日期1997年7月16日PCT 1997年3月26日PCT公布。 出版物WO97 / 37062 日期1997年10月9日本发明涉及一种用于通过处理液体处理的物品上的电相互绝缘的导电区域的电化学处理的方法和装置。 绝缘的,例如电路板上的蚀刻结构不能用已知的方法进行电化学处理,因为不存在来自各个区域的电泳电源的电连接。 根据本发明,这种连接是通过用它们的导电和细纤维接触要处理的结构化表面的刷产生的。 横向于运输方向布置的大量刷子涉及以下事实:待处理物品上彼此绝缘地布置的所有导电区域电连接至少一个接一个, 实现的接触时间足够长。 也可以设计为可动刷的对电极优选位于刷电极之间。 在其中沉积金属的电化学工艺中,电刷循环地脱落。 为此,提出了各种可能的解决方案。
    • 2. 发明授权
    • Device for electrolytic treatment of printed circuit boards and conductive films
    • 用于电解处理印刷电路板和导电膜的装置
    • US06238529B1
    • 2001-05-29
    • US09403657
    • 1999-11-22
    • Jens GeisslerThomas RydlewskiLorenz KoppRalf-Peter WächterReinhard Schneider
    • Jens GeisslerThomas RydlewskiLorenz KoppRalf-Peter WächterReinhard Schneider
    • C25D1700
    • H05K3/241C25D5/08C25D17/00
    • The apparatus for electrolytically treating printed circuit boards 3, through which apparatus the printed circuit boards are continuously guidable in a plane of conveyance in a substantially horizontal direction of conveyance, has the following features: Counter-electrodes 1,2 are disposed opposite the plane of conveyance and substantially parallel thereto on at least one side, so that electrolytic chambers 4,5 are formed between counter-electrodes, which are situated opposite one another, or between the counter-electrodes and the plane of conveyance, the counter-electrodes forming respective substantially continuous electrode faces. Guide elements 7,8 for the printed circuit boards are disposed in the electrolytic chamber. Contact elements 11 are provided for the electrical contacting of the printed circuit boards. Electrolyte spraying arrangements 13 are also provided for conveying the electrolytic fluid towards the surfaces of the printed circuit boards. Openings are provided in the counter-electrodes. The electrolyte spraying arrangements are disposed on the sides of the counter-electrodes remote from the plane of conveyance in such a manner that electrolytic fluid, emerging from the arrangements, can pass the counter-electrodes substantially unhindered at the locations of the openings and can pass to the surfaces of the printed circuit boards.
    • 用于电解处理印刷电路板3的装置,其中印刷电路板在输送的大致水平方向上连续引导的装置具有以下特征:对置电极1,2与 在至少一个侧面上大致平行地输送电解室4,5,使电解室4,5形成在相对电极之间或相对电极和输送平面之间的相对电极之间,对电极形成相应的电极 基本连续的电极面。 用于印刷电路板的引导元件7,8设置在电解室中。 接触元件11被设置用于印刷电路板的电接触。 还提供电解质喷涂装置13用于将电解液输送到印刷电路板的表面。 开口设置在对置电极中。 电解液喷射装置设置在远离输送平面的对置电极的侧面上,使得从布置出来的电解液可以在开口的位置上基本上不受阻碍地通过对电极并且可以通过 到印刷电路板的表面。
    • 3. 发明授权
    • Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
    • 在要处理的物品上的电接点上的金属层厚度的设备和方法
    • US06319383B1
    • 2001-11-20
    • US09485785
    • 2000-03-27
    • Lorenz KoppPeter LangheinrichReinhard Schneider
    • Lorenz KoppPeter LangheinrichReinhard Schneider
    • C25D500
    • C25D17/06C25D7/123C25D17/001C25D17/004C25D17/005H05K3/241
    • The invention relates to a device and a method for evening out the thickness of metal layers on electrical contact points on flat items to be treated 7, such as conductor foil and printed circuit boards, during the electrolytic treatment of the items to be treated, guided in a horizontal plane of conveyance in a continuous electroplating plant. The device has counter-electrodes 2, 3 located opposite the plane of conveyance and clamps 4, secured to a continuously revolving means of conveyance 5, for contacting the items to be treated 7. The clamps 4 have a lower portion 14 and an upper portion 13 which are electrically conductive, have a surface consisting of metal, are moveable in relation to one another and respectively have at least one contact point 6 for the items to be treated 7. In addition, at least one current source is provided to produce a flow of current between the counter-electrodes and the items to be treated. To avoid the pirate cathode effect of the contact clamps 4 during electrolytic metallisation, there are disposed between the anodes 2, 3 and the clamps 4 upper and lower shields 15, 16 for the electrical field, which extend so close to the plane of conveyance that the items to be treated, guided in the plane of conveyance, and the clamp portions 13, 14 do not quite come into contact with the shields.
    • 本发明涉及一种在待处理物品的电解处理过程中,在待处理的平面物品(例如导体箔和印刷电路板)上的电接触点上的金属层厚度的装置和方法, 在连续电镀厂的水平输送平面内。 该装置具有与传送平面相对的对置电极2,3,固定在连续旋转的传送装置5上,用于接触待处理物品7。夹具4具有下部14和上部 13具有导电性,具有由金属组成的表面,可以相对于彼此移动,并且分别具有用于待处理物品7的至少一个接触点6.另外,提供至少一个电流源以产生 在对电极和待处理物品之间的电流流动。为了避免在电解金属化期间接触夹具4的海盗阴极效应,设置在阳极2,3和夹具4上和下屏蔽件15,16之间 对于电场,其延伸得如此靠近传送平面,使待处理的物品在传送平面中被引导,并且夹持部分13,14不完全与屏蔽件接触。
    • 6. 发明授权
    • Procedure and device for the chemical and electrolytic treatment of
printed circuit boards and conductor films
    • 用于化学和电解处理印刷电路板和导体膜的步骤和装置
    • US6077359A
    • 2000-06-20
    • US11190
    • 1998-05-18
    • David T. BaronReinhard Schneider
    • David T. BaronReinhard Schneider
    • B08B3/02B01J19/00B05D1/18C23G3/02C25D21/10C25F7/00G03F7/30G03F7/42H05K3/00H05K3/26B08B1/02B08B3/04
    • C23F1/08B01J19/008C25D21/10G03F7/3042G03F7/42H05K3/0085H05K3/0088Y10S134/902
    • A method of treatment of printed circuit boards or conductor films with a chemical, electrolytic, or rinsing treatment liquid, and to a device for carrying out the method, where the printed circuit boards or conductor films are transported in a horizontal direction by transport means, In order to accelerate these processes, the surfaces of the printed circuit boards or conductor films must be exposed to a macroflow in order to apply active treatment liquid. Furthermore, the micromaterial exchange into the diffusion layer must be reinforced. This exchange is brought about by the use of hydrodynamically acting cavitation generators, which form cavitation bubbles in the liquid jets. The treatment liquid is set into an eddy current movement in the generators because the treatment liquid is applied at high pressure in a circuit through the nozzles generating the cavitation bubbles, and is conveyed to the surface in a large quantity. The use of the method is particularly effective in processing fine conductor printed circuit boards with fine bores and blind holes.
    • PCT No.PCT / EP96 / 03032 Sec。 371日期1998年5月18日 102(e)日期1998年5月18日PCT提交1996年7月5日PCT公布。 出版物WO97 / 02724 日期1997年1月23日一种用化学,电解或冲洗处理液处理印刷电路板或导体膜的方法以及用于执行该方法的装置,其中印刷电路板或导体膜在水平方向上传输 为了加速这些过程,印刷电路板或导体膜的表面必须暴露于大流量以便施加活性处理液体。 此外,必须加强到扩散层中的微材料交换。 这种交换是通过使用在液体射流中形成气蚀气泡的流体动力学作用的空化发生器引起的。 由于处理液通过产生气蚀气泡的喷嘴在电路中以高压施加,所以处理液被置于发电机中的涡流运动中,并且被大量输送到表面。 该方法的使用在处理具有细孔和盲孔的细导体印刷电路板方面特别有效。
    • 7. 发明申请
    • Method for Producing Sodium Dithionite
    • 生产连二亚硫酸钠的方法
    • US20080187484A1
    • 2008-08-07
    • US11666973
    • 2005-11-03
    • Armin DiefenbacherHartwig VossReinhard Schneider
    • Armin DiefenbacherHartwig VossReinhard Schneider
    • C01B17/66
    • C01B17/66
    • The invention relates to a process for the preparation of sodium dithionite, comprising the steps (a) provision of a synthesis batch comprising sodium formate, sulfur dioxide and an alkaline sodium compound in aqueous methanolic solution with formation of a sodium dithionite mother liquor, (b) isolation of sodium dithionite from the sodium dithionite mother liquor, a residual mother liquor being obtained, (c) separation of methanol from the residual mother liquor, (d) separation of the residual mother liquor into a thiosulfate-rich first part-stream and a thiosulfate-poor, formate-containing second part-stream by means of nanofiltration, (e) concentration of sodium formate in the second part-stream and (f) recycling of the concentrated second part-stream to process step (a).
    • 本发明涉及一种制备连二亚硫酸钠的方法,包括以下步骤:(a)在形成连二亚硫酸钠母液的水溶液中提供包含甲酸钠,二氧化硫和碱性钠化合物的合成批料,(b )从连二亚硫酸钠母液中分离连二亚硫酸钠,得到残余母液,(c)从残余母液中分离甲醇,(d)将残余母液分离成富含硫代硫酸氢盐的第一部分流, (e)在第二部分流中浓缩甲酸钠,和(f)将浓缩的第二部分物流再循环到工艺步骤(a)中,通过纳滤法生产含有硫代硫酸盐的富含甲酸的第二部分物流。
    • 8. 发明申请
    • Method for the production of precipitated calcium carbonate with a high degree of brightness
    • 生产具有高亮度的沉淀碳酸钙的方法
    • US20050158226A1
    • 2005-07-21
    • US10507608
    • 2003-03-11
    • Andrea MisskeReinhard Schneider
    • Andrea MisskeReinhard Schneider
    • C01F11/18C09C1/02
    • C01F11/183C01F11/185C01P2006/60C09C1/021
    • Calcium carbonate with high brightness is prepared by treating calcium carbonate and/or the milk of lime used for its preparation by reacting milk of lime with carbon dioxide and/or at least one of the calcium-containing preliminary products used for the preparation of the milk of lime before, during and/or after this reaction with a bleaching agent which comprises at least one compound of the formula (I): A[(CR1R2)SOpM(1/q)]r  (I) where the variables have the following meanings: A is NR3R4, NR3, N or OH; R1, R2, R3, R4 independently of one another, are hydrogen or an organic radical; M is ammonium or metal p is 2 or 3; q is the valency of M; and r is 1 when A=OH or NR3R4, is 2 when A=NR3 and is 3 when A=N; and where variables, if a mixture of compounds is used and/or r=2 or 3, are chosen independently of one another for each individual compound and/or for each [(CR1R2)SOpM(1/q)] group.
    • 高亮度碳酸钙通过使石灰乳与二氧化碳反应和/或用于制备牛奶的至少一种含钙初步产物来处理碳酸钙和/或用于其制备的石灰乳制备 在与含有至少一种式(I)的化合物的漂白剂反应之前,期间和/或之后的石灰:<?in-line-formula description =“In-line Formulas”end =“lead” A [(CR 1)2)SO 2(1)q(R 1) (I)<?in-line-formula description =“In-line Formulas”end =“tail”?>其中变量具有以下含义:A是NR <3> R
    • 9. 发明授权
    • Method and device for continuous uniform electrolytic metallizing or
etching
    • 用于连续均匀电解金属化或蚀刻的方法和装置
    • US5804052A
    • 1998-09-08
    • US750314
    • 1996-11-26
    • Reinhard Schneider
    • Reinhard Schneider
    • C25D5/22C25D5/00C25D7/00C25F3/02C25F7/00H01L21/3063H05K3/07H05K3/24C25D5/02
    • H05K3/07C25D21/00C25D7/0657C25F3/02C25F7/00H05K3/241Y10S204/07
    • The invention relates to a method for continuous uniform electrolytic metallizing or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the metal surface being treated passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-shaped intermediate electrodes, which roll without short circuit at a very close effective distance above the metal surface being treated, or which contact the surface in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current, thus serving as bipolar electrodes, and are located between the surface being treated and a suitable counter-electrode.
    • PCT No.PCT / DE95 / 00706 Sec。 371日期1996年11月26日 102(e)日期1996年11月26日PCT提交1995年5月26日PCT公布。 WO95 / 33086 PCT出版物 日期1995年12月7日本发明涉及金属表面的连续均匀电解金属化或蚀刻的方法以及适用于实施该方法的装置。 本发明特别适用于处理经过水平处理的金属表面的设备中的印刷电路板和导电膜。 为了避免不同厚度的金属涂层沉积在印刷电路板的狭窄和宽的导体条上,根据本发明,操作是可移动的,优选旋转的辊状中间电极,它们以非常接近的有效的方式滚动而没有短路 在正在处理的金属表面之上的距离,或者以擦拭方式接触表面。 这些中间电极不与电流源电连接,因此用作双极电极,并且位于待处理的表面和合适的对电极之间。