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1. 发明申请

US20180302991A1 WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD MANUFACTURING DEVICE 审中-公开
公开(公告)号：US20180302991A1
公开(公告)日：2018-10-18
申请号：US15524128
申请日：2014-11-14
申请人： FUJI MACHINE MFG, CO., LTD.
发明人： Kenji TSUKADA , Masatoshi FUJITA , Yoshitaka HASHIMOTO , Akihiro KAWAJIRI , Masato SUZUKI
IPC分类号： H05K3/12 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B29C64/124 , B29C64/393 , B41M3/00 , B41M7/00 , H05K3/00
CPC分类号： H05K3/1283 , B29C64/112 , B29C64/124 , B29C64/336 , B29C64/393 , B29K2995/0005 , B29L2031/3425 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B41M3/006 , B41M7/0081 , H01L2924/0002 , H05K1/097 , H05K3/0014 , H05K3/0055 , H05K3/0085 , H05K2203/0126 , H05K2203/013 , H05K2203/107 , H01L2924/00
摘要： A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

2. 发明授权

US09936585B2 Method and apparatus for automatically adjusting dispensing units of a dispenser 有权
公开(公告)号：US09936585B2
公开(公告)日：2018-04-03
申请号：US15628987
申请日：2017-06-21
申请人： Illinois Tool Works Inc.
发明人： Scott A. Reid , Hugh R. Read , Thomas C. Prentice
IPC分类号： B05C5/00 , H05K3/00 , H05K3/46 , H05K13/08 , H05K13/04 , B05C5/02 , B05C11/10
CPC分类号： H05K3/0085 , B05C5/0212 , B05C11/1021 , H05K3/4644 , H05K13/0469 , H05K13/08
摘要： A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

3. 发明授权

US09775250B2 Method and apparatus for automatically adjusting dispensing units of a dispenser 有权
公开(公告)号：US09775250B2
公开(公告)日：2017-09-26
申请号：US15165120
申请日：2016-05-26
申请人： Illinois Tool Works Inc.
发明人： Scott A. Reid , Hugh R. Read , Thomas C. Prentice
IPC分类号： H05K3/00 , H05K3/46 , H05K13/04 , H05K13/08 , B05C5/02 , B05C11/10
CPC分类号： H05K3/0085 , B05C5/0212 , B05C11/1021 , H05K3/4644 , H05K13/0469 , H05K13/08
摘要： A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

4. 发明授权

US09713265B2 Method, treatment station and assembly for treating a planar material to be treated 有权
公开(公告)号：US09713265B2
公开(公告)日：2017-07-18
申请号：US13320522
申请日：2010-05-12
申请人： Henry Kunze
发明人： Henry Kunze
IPC分类号： C25D17/00 , B05C3/09 , H05K3/00 , B05C11/06 , C25D7/06 , C25D21/10
CPC分类号： H05K3/0085 , B05C3/09 , B05C11/06 , C25D7/0621 , C25D7/0642 , C25D17/00 , C25D21/10 , H05K2203/0143 , H05K2203/0746 , H05K2203/1509 , H05K2203/1572
摘要： In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).

5. 发明授权

US09380708B2 Method, holding means, apparatus and system for transporting a flat material to be treated and loading or unloading apparatus 有权
标题翻译：用于运输待处理的扁平材料和装卸装置的方法，保持装置，装置和系统
公开(公告)号：US09380708B2
公开(公告)日：2016-06-28
申请号：US13265770
申请日：2010-04-22
申请人： Henry Kunze , Christian Thomas
发明人： Henry Kunze , Christian Thomas
IPC分类号： H05K3/00 , C23C16/54 , C23C16/44 , H01L21/67 , C23C14/56 , C25D17/06 , H05K13/00 , H05K1/03 , H05K3/06 , H05K3/24
CPC分类号： H05K3/0085 , C23C14/568 , C23C16/4401 , C23C16/4412 , C23C16/54 , C25D17/06 , H01L21/67017 , H05K1/0393 , H05K3/068 , H05K3/243 , H05K13/0061 , H05K2203/0165 , H05K2203/0271 , H05K2203/1509 , H05K2203/1545
摘要： In order to transport a flat material to be treated (21) in an installation for the chemical and/or electrochemical treatment of said material, within which the material to be treated (21) is transported within a plane of transport in a direction of transport (5), holding means (22, 25) are attached to said material to be treated (21). The holding means (22, 25) hold the material to be treated (21) at at least two points on an edge region of said material, which edge region is directed along the direction of transport (5) when said material to be treated (21) is being transported. The holding means (22, 25) are coupled in a detachable manner to a transporting device (41) which moves said holding means (22, 25) in the direction of transport in order to transport the material to be treated (21). At least during a portion of the transportation of the material to be treated (21), a force (6, 7) having a component which lies within the plane of transport and is directed transversely to the direction of transport (5), is exerted upon a region of the material to be treated (21), for example upon the longitudinal edge regions.
摘要翻译：为了在用于化学和/或电化学处理所述材料的设备中运输待处理的扁平材料（21），其中待处理材料（21）在运输方向内在运输方向上运输（5）中，将保持装置（22,25）安装在待处理材料（21）上。保持装置（22,25）在所述材料的边缘区域上的至少两个点处保持待处理材料（21），当所述待处理材料（5）的边缘区域沿着输送方向（5） 21）正在运输。保持装置（22,25）以可拆卸的方式联接到运送装置（41），该输送装置（41）沿着输送方向移动所述保持装置（22,25），以便输送待处理材料（21）。至少在待处理材料（21）的运输的一部分期间，施加具有位于运输平面内且横向于运输方向（5）的部件的力（6,7）在待处理材料（21）的区域上，例如在纵向边缘区域上。

6. 发明授权

US09358587B2 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US09358587B2
公开(公告)日：2016-06-07
申请号：US13785673
申请日：2013-03-05
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Yukio Tomifuji , Shigeki Minami , Kazuo Jodai , Norio Yoshikawa
IPC分类号： H01L21/02 , B08B3/02 , H05K3/00
CPC分类号： B08B3/022 , H05K3/0085 , H05K2203/104 , H05K2203/1509 , H05K2203/1545 , H05K2203/1572
摘要： A substrate treating apparatus includes a loading section 1, a treating tank 2, a rinsing tank 4, a drying tank 5, an unloading section 6, and a pair of endless belt members 7 for transporting substrates successively through the loading section 1, treating tank 2, rinsing tank 4, drying tank 5 and unloading section 6. The substrate treating apparatus further includes a fixing mechanism for fixing a pair of side edges of each substrate parallel to a transport direction of the substrate to the endless belt members 7. In the loading section 1, a plurality of substrates are fixed, each with the pair of edges thereof parallel to the transport direction fixed at constant intervals to the pair of endless belt members 7. The substrates having undergone the treatment are removed from the pair of endless belt members 7 in the unloading section 6.
摘要翻译：基板处理装置包括装载部1，处理槽2，漂洗槽4，干燥箱5，卸载部6，以及一对环状带部件7，用于依次通过装载部1输送基板，处理槽 2，洗涤槽4，干燥箱5和卸载部6.基板处理装置还包括固定机构，用于将平行于基板的输送方向的每个基板的一对侧边缘固定到环形带部件7上。装载部分1固定多个基板，每个基板的一对边缘平行于传送方向固定在一对环形带部件7上。已经经过处理的基板从一对环形带卸载部分6的成员7。

7. 发明申请

US20160083676A1 METHOD AND APPARATUS FOR HIGH EFFICIENCY POST CMP CLEAN USING ENGINEERED VISCOUS FLUID 审中-公开
标题翻译：使用工程粘度流体高效CMP后清洗的方法和装置
公开(公告)号：US20160083676A1
公开(公告)日：2016-03-24
申请号：US14840146
申请日：2015-08-31
申请人： Applied Materials, Inc.
发明人： Ekaterina MIKHAYLICHENKO , Brian J. BROWN , Fred C. REDEKER
IPC分类号： C11D17/00 , B08B1/00 , B08B3/12 , C11D3/04 , C11D1/14 , C11D3/20 , C11D3/37 , B08B3/04 , B08B3/02
CPC分类号： C11D1/146 , C11D3/3753 , C11D3/3773 , C11D11/0047 , C11D17/003 , H05K3/0085
摘要： Embodiments of the present apparatus and methods for post CMP clean. More particularly, embodiments provide apparatus and methods for removing nano sized particles. One embodiment provides a method for cleaning a substrate. The method includes exposing the substrate to a viscoelastic fluid to remove small particles from the substrate. The viscoelastic fluid comprising a viscosity adjustor and an aqueous base.
摘要翻译：本发明的CMP清洗装置和方法的实施例。更具体地，实施方案提供了用于去除纳米尺寸颗粒的装置和方法。一个实施例提供了一种清洁衬底的方法。该方法包括将基底暴露于粘弹性流体以从基底去除小颗粒。该粘弹性流体包括粘度调节剂和碱性水溶液。

8. 发明申请

US20160047741A1 METHOD AND APPARATUS FOR MONITORING AND CONTROLLING A CLEANING PROCESS 审中-公开
标题翻译：用于监测和控制清洁过程的方法和装置
公开(公告)号：US20160047741A1
公开(公告)日：2016-02-18
申请号：US14501552
申请日：2014-09-30
申请人： Kyzen Corporation
发明人： David T. Lober , Haley Nicole Jones , Jonathon Afugu , Kyle J. Doyel , Ram Wissel , Michael L. Bixenman
IPC分类号： G01N21/3577 , G05D11/13
CPC分类号： G01N21/3577 , G01N21/359 , G01N2021/3595 , G01N2201/129 , G05D11/138 , H05K3/0085 , H05K3/26 , H05K2203/0786 , H05K2203/163
摘要： A method of accurately measuring the concentration of at least one of an aqueous cleaning agent and soil in an aqueous cleaning process which includes providing a source of near infrared light emitting useful amounts of light with wavelengths between approximately 0.8 μm and 2.5 μm, transmitting the near infrared light from the light source to a probe, contacting the probe with a cleaning bath sample such that one of the absorption and the reflection of the light at one or more wavelengths can be measured, transmitting the light that has interacted with the sample to a detector, measuring the change in light intensity at one or more wavelengths in the near infrared region using a near infrared detector, generating an electronic signal that is representative of the change in intensity, applying chemometric techniques to quantitatively determine the concentration of the cleaning agent and or soil, and outputting the measured cleaning agent or soil concentration. The light source is connected to the probe via a fiber-optic cable and the probe is connected to the detector via a fiber-optic cable.
摘要翻译：一种在水性清洗过程中精确测量水性清洁剂和污垢中的至少一种的浓度的方法，该方法包括提供近红外光源，其发射波长在约0.8μm和2.5μm之间的有用量的光，透射近从光源到探头的红外光，使探针与清洗浴样品接触，使得能够测量在一个或多个波长处的光的吸收和反射之一，将与样品相互作用的光透射到检测器，使用近红外检测器测量近红外区域中的一个或多个波长处的光强度的变化，产生代表强度变化的电子信号，应用化学计量技术定量测定清洁剂的浓度，以及或土壤，并输出测量的清洁剂或土壤浓度。光源通过光纤电缆连接到探头，探头通过光纤电缆连接到检测器。

9. 发明申请

US20150053646A1 MACHINE AND METHOD TO CHEMICALLY ENGRAVE A PLATE OF STAINLESS STEEL 审中-公开
标题翻译：化学加工不锈钢板的机器和方法
公开(公告)号：US20150053646A1
公开(公告)日：2015-02-26
申请号：US14377820
申请日：2012-02-10
申请人： Franck Dupuy , Joël Harmand , Inocencio Marcos , François Lapeyre
发明人： Franck Dupuy , Joël Harmand , Inocencio Marcos , François Lapeyre
IPC分类号： C23F1/28 , C23F1/02 , C23F1/08
CPC分类号： C23F1/28 , C23F1/02 , C23F1/08 , H05K3/0085 , H05K3/068 , H05K2203/0108 , H05K2203/1518 , H05K2203/1572
摘要： A chemical engraving machine to engrave a plate of stainless steel moved along an horizontal direction, said machine comprising a base, an acid liquid circuit adapted to chemically attack said plate of stainless steel at locations where it is not protected by a protection mask, a lower guiding device, an upper guiding device, the lower and upper guiding devices being configured to maintain said plate of stainless steel substantially vertically, and a nozzle support bearing a plurality of spraying nozzles projecting horizontally the acid liquid toward the plate of stainless steel. A method chemically engraves a plate of stainless steel in a vertical position.
摘要翻译：一种用于雕刻沿水平方向移动的不锈钢板的化学雕刻机，所述机器包括底座，酸性液体回路，其适于在不受保护面罩保护的位置化学侵蚀不锈钢板，下部引导装置，上导向装置，下引导装置和上引导装置构造成基本上垂直地保持不锈钢板;以及喷嘴支撑件，其支承有多个喷嘴，其将酸性液体水平地朝向不锈钢板突出。一种在垂直位置化学雕刻不锈钢板的方法。

10. 发明授权

US08815072B2 Method for producing a surface roughened copper plate 有权
标题翻译：表面粗糙化铜板的制造方法
公开(公告)号：US08815072B2
公开(公告)日：2014-08-26
申请号：US12529560
申请日：2008-03-03
申请人： Hajime Watanabe , Sadao Ishihama , Kiyoteru Yamamoto , Takahiro Imai , Toshihiro Oyoshi
发明人： Hajime Watanabe , Sadao Ishihama , Kiyoteru Yamamoto , Takahiro Imai , Toshihiro Oyoshi
IPC分类号： C25D5/10 , C25D5/18 , C25D5/34 , C25D5/48 , C25D17/00
CPC分类号： C25D5/02 , C25D3/38 , C25D5/10 , C25D5/18 , C25D5/34 , C25D5/48 , C25D7/00 , C25D17/00 , C25F3/02 , H05K1/056 , H05K3/0085 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1572 , Y10S205/92 , Y10T428/12361
摘要： A process is provided for roughening both sides of a copper plate by forming protrusions with fine bump shapes on both sides of the copper plate in an electroplating solution for plating copper while reducing deterioration of the electroplating solution. Opposed pairs of negative electrodes (3c) and positive electrodes (3a) are provided in an electroplating copper solution (2), and a copper plate (4) is arranged between the pair of negative electrodes (3c). An anodic treatment for generating copper fine particles on both surfaces of the copper plate (4) is carried out by performing an electrolytic process for three to ten minutes with the copper plate (4) as a positive electrode between the negative electrodes (3c). Then a cathodic treatment is carried out by moving the copper plate (4) between positive electrodes (3a) and performing an electroplating of copper for three to ten minutes with the copper plate (4) as a negative electrode for fixing the copper fine particles onto the surfaces of the copper plate (4). The cycle of anodic and cathodic treatment may be performed more than one time.
摘要翻译：提供一种通过在电镀铜的电镀溶液中形成铜板两侧的微细凸起形状的突起，同时减少电镀液的劣化，来粗化铜板的两面的工艺。在电镀铜溶液（2）中设置相对的负极（3c）和正极（3a），在一对负极（3c）之间配置有铜板（4）。在铜板（4）的两个表面上产生铜微粒的阳极处理通过以铜板（4）为负极（3c）之间的正极进行3〜10分钟的电解处理来进行。然后通过使铜板（4）在正电极（3a）之间移动并执行铜电镀三至十分钟的铜板（4）作为用于将铜微粒固定的负极的铜板（4）进行阴极处理，铜板（4）的表面。阳极和阴极处理的循环可以进行一次以上。

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