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1. 发明授权

US6000597A Molten solder dispensing system 失效
标题翻译：熔融焊料分配系统
公开(公告)号：US6000597A
公开(公告)日：1999-12-14
申请号：US14878
申请日：1998-01-28
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
摘要翻译：用于分配焊料的设备包括具有形成在其中的多个流动通道的喷嘴体。每个流动通道包括用于分配焊料的入口端和分配器端。喷嘴体形成围绕每个分配器端的乳头，并且喷嘴体还形成与每个分配器端连通的屏蔽室，用于保护相应的乳头，并且可选地提供惰性气体流和/或排除来自焊接区域的环境氧气。喷嘴体包括微加工硅。提供了各种流动通道构造以改善流动特性。

2. 发明授权

US5746368A Molten solder dispensing system 失效
公开(公告)号：US5746368A
公开(公告)日：1998-05-05
申请号：US649750
申请日：1996-05-15
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

3. 发明授权

US06303992B1 Interposer for mounting semiconductor dice on substrates 失效
标题翻译：用于将半导体裸片安装在基板上的插入器
公开(公告)号：US06303992B1
公开(公告)日：2001-10-16
申请号：US09347542
申请日：1999-07-06
申请人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
IPC分类号： H01L2348
CPC分类号： H01L23/473 , H01L2224/16225
摘要： An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20. The interposer 10 may also include: a sealed cooling channel 28 defined within the interposer body 12; a fluid medium 30 generally filling the cooling channel 28; and a piezoelectric element 26 attached to the interposer body such that the piezoelectric element communicates with the cooling channel 28 and the fluid medium 30, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits 22.
摘要翻译：一种用于将半导体管芯50电耦合到衬底70的插入器10，包括：由介电材料制成并具有接触表面14和相对的接合表面16的插入体本体12; 布置在接触表面14周围的多个接触垫18; 布置在接合表面16的整个区域的多个接合焊盘20; 以及大体上设置在插入体内部的多个导电管道22，使得每个导管22将相应的一个接触焊盘18与相应的一个接合焊盘20连接。插入器10还可以包括：密封的冷却通道 28; 通常填充冷却通道28的流体介质30; 以及压电元件26，其连接到中介体，使得压电元件与冷却通道28和流体介质30连通，压电元件可操作地耦合到至少两个导电导管22。

4. 发明授权

US06449839B1 Electrical circuit board and a method for making the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06449839B1
公开(公告)日：2002-09-17
申请号：US09655986
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Thomas Krautheim , Robert E. Belke, Jr. , Vivek Amir Jairazbhoy , Cuong V. Pham
发明人： Andrew Z. Glovatsky , Thomas Krautheim , Robert E. Belke, Jr. , Vivek Amir Jairazbhoy , Cuong V. Pham
IPC分类号： H05K302
CPC分类号： H05K3/4084 , H05K1/056 , H05K3/062 , H05K3/4092 , H05K3/44 , H05K3/445 , H05K2201/0305 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09554 , H05K2203/0195 , H05K2203/063 , Y10T29/49128 , Y10T29/49144 , Y10T29/49156
摘要： A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.
摘要翻译：一种用于在多层电子电路板10内形成连接的方法。在一个非限制性实施例中，该方法包括在电路板10的部分上选择性地形成空气桥，并用冶金接合工具选择性地折叠气桥，电路板10的互连层。

5. 发明授权

US06274407B1 Method and article for attaching high-operating-temperature electronic component 失效
标题翻译：安装高温电子元器件的方法和制品
公开(公告)号：US06274407B1
公开(公告)日：2001-08-14
申请号：US09619546
申请日：2000-07-19
申请人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
发明人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/48091 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83815 , H01L2224/83855 , H01L2224/8392 , H01L2224/83951 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2924/01048 , H01L2924/01083 , H01L2924/0132 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method and article for attaching an electronic component, such as a semiconductor die, to a substrate includes applying a relatively low-melting-temperature solder preform to the substrate; and applying a bead of a curable bonding material to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension. After placing the die atop the solder preform so as to at least partially overlie the bonding material, the method includes heating the solder preform and the bonding material so as to reflow the solder, whereupon the solder preform collapses to allow the bonding material to engage the underside of the die, and to subsequently cure the bonding material.
摘要翻译：用于将诸如半导体管芯的电子部件附接到基板的方法和制品包括将相对低熔点的焊料预制件施加到基板上; 以及在足以基本上容纳焊料材料的量的基础上将可固化粘合材料的珠粒施加到围绕焊料预制件周围的基底上，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和衬底之间的间隙尺寸。在将模具放置在焊料预制件顶部以至少部分地覆盖接合材料之后，该方法包括加热焊料预成型件和接合材料以便回流焊料，于是焊料预制件塌陷以允许接合材料接合并且随后固化粘结材料。

6. 发明授权

US06169253A Solder resist window configurations for solder paste overprinting 失效
标题翻译：焊膏套印的阻焊窗配置
公开(公告)号：US06169253A
公开(公告)日：2001-01-02
申请号：US09093079
申请日：1998-06-08
申请人： Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H05K118
CPC分类号： H05K3/3452 , H05K3/3442 , H05K3/3484 , H05K2201/0989 , H05K2201/10166 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49144
摘要： There is disclosed herein an electronic circuit assembly, such as a printed circuit board, having solder resist windows with one or more enlarged solder resist pullback zones, thereby facilitating solder paste overprinting.
摘要翻译：这里公开了一种电子电路组件，例如印刷电路板，其具有具有一个或多个扩大的阻焊剂回拉区的阻焊窗，从而便于焊膏叠印。

7. 发明授权

US6115262A Enhanced mounting pads for printed circuit boards 失效
公开(公告)号：US6115262A
公开(公告)日：2000-09-05
申请号：US93025
申请日：1998-06-08
申请人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H05K1/11 , H05K3/34 , H05K1/18 , H05K7/06
CPC分类号： H05K3/3442 , H05K1/111 , H05K2201/09381 , H05K2201/0939 , H05K2201/10636 , H05K2203/0465 , H05K3/3484 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

8. 发明申请

US20080266820A1 SYSTEM FOR SUPPORTING AND ELECTRICALLY GROUNDING A COVER OF AN ELECTRONIC CONTROL MODULE 审中-公开
标题翻译：用于支持和电接地电子控制模块的盖子的系统
公开(公告)号：US20080266820A1
公开(公告)日：2008-10-30
申请号：US11739881
申请日：2007-04-25
申请人： Vivek Amir Jairazbhoy , Diane Marie Jett , Bertrand Robert Mohr , Robert Edward Belke , Michael Timothy Dwyer
发明人： Vivek Amir Jairazbhoy , Diane Marie Jett , Bertrand Robert Mohr , Robert Edward Belke , Michael Timothy Dwyer
IPC分类号： H05K5/00
CPC分类号： H05K9/0016
摘要： A system for supporting and electrically grounding metallic covers for electronic control modules includes a housing having wall portions defining a cavity with an opening, a circuit board located within the cavity, the circuit board having a ground plane formed within the circuit board, the circuit board having a top surface substantially facing the opening and supports for proving structural support for the cover, the supports being located on the top surface of the circuit board. The system shields emissions radiating from the module.
摘要翻译：一种用于电子控制模块的用于支撑和电接地金属盖的系统包括具有限定具有开口的空腔的壁部的壳体，位于空腔内的电路板，所述电路板具有形成在所述电路板内的接地平面，所述电路板具有基本上面对开口的顶表面和用于证明盖的结构支撑的支撑件，支撑件位于电路板的顶表面上。该系统屏蔽从模块辐射的辐射。

9. 发明授权

US06316736B1 Anti-bridging solder ball collection zones 失效
标题翻译：抗桥接焊球收集区
公开(公告)号：US06316736B1
公开(公告)日：2001-11-13
申请号：US09092821
申请日：1998-06-08
申请人： Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H01R909
CPC分类号： H05K3/3442 , H01L2224/10175 , H01L2924/384 , H01L2924/3841 , H05K1/111 , H05K3/3452 , H05K2201/0939 , H05K2201/0989 , H05K2201/10636 , H05K2201/10689 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.
摘要翻译：这里公开了具有改进的抗焊料桥接和元件偏心/墓碑的电阻的印刷电路板（PCB）。印刷电路板（PCB）包括具有顶面12的基板10; 至少两个安装焊盘14，其配置在与电子部件24的端子26相匹配的顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘22o中。每个孔口18包括位于至少一个外部孔口边缘22o中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可以被引导并保持在其中。

10. 发明授权

US6073817A Pneumatically-actuated throttle valve for molten solder dispenser 失效
标题翻译：用于熔融焊料分配器的气动致动节流阀
公开(公告)号：US6073817A
公开(公告)日：2000-06-13
申请号：US148532
申请日：1998-09-04
申请人： Vivek Amir Jairazbhoy
发明人： Vivek Amir Jairazbhoy
IPC分类号： B22D39/02
CPC分类号： B22D39/02
摘要： A pneumatic actuator for use with a pump for dispensing molten solder on a surface, such as an integrated circuit substrate. The pump has a reservoir for containing molten solder, a nozzle for dispensing molten solder on the substrate, a diaphragm pump with a pump cavity situated in fluid communication with the reservoir and with a flow intake portion of the nozzle, and an adjustable throttle for controlling the flow of molten solder from the reservoir to the diaphragm pump. The throttle defines an annular throttle gap between the reservoir and the pump cavity to vary the effective throttle area. A spring-loaded diaphragm for adjusting the throttle defines in part a pneumatic chamber. A solenoid valve is situated in a compressed gas feed passage extending to the pneumatic chamber. The spring-loaded diaphragm is effective to control the throttle opening with a controlled delay following activation of the solenoid valve so that optimum throttle resistance can be achieved at the beginning of a solder-dispensing pulse, while providing optimum throttle resistance during the remainder of the pulse such that instantaneous cutoff of the flow through the nozzle is achieved without effecting a reverse flow of air through the nozzle into the pump chamber at the end of the solder dispensing pulse.
摘要翻译：一种气动致动器，用于与用于在诸如集成电路基板的表面上分配熔融焊料的泵。泵具有用于容纳熔融焊料的储存器，用于在衬底上分配熔融焊料的喷嘴，具有与储存器流体连通并具有喷嘴的流动进入部分的泵腔的隔膜泵，以及用于控制的可调节节气门熔融焊料从储存器流向隔膜泵。节气门限定了储存器和泵腔之间的环形节流间隙，以改变有效节流面积。用于调节节气门的弹簧加载隔膜部分地限定了气动室。电磁阀位于延伸到气动室的压缩气体供给通道中。弹簧加载的隔膜有效地在电磁阀激活之后以受控的延迟来控制节气门开度，使得在焊剂分配脉冲开始时可以实现最佳的节流阻力，同时在剩余的时间内提供最佳的节流阻力脉冲，使得通过喷嘴的流动的瞬时截止被实现，而不会在焊料分配脉冲的末端不影响通过喷嘴的反向空气流入泵室。

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