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1. 发明授权

US06274407B1 Method and article for attaching high-operating-temperature electronic component 失效
标题翻译：安装高温电子元器件的方法和制品
公开(公告)号：US06274407B1
公开(公告)日：2001-08-14
申请号：US09619546
申请日：2000-07-19
申请人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
发明人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/48091 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83815 , H01L2224/83855 , H01L2224/8392 , H01L2224/83951 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2924/01048 , H01L2924/01083 , H01L2924/0132 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method and article for attaching an electronic component, such as a semiconductor die, to a substrate includes applying a relatively low-melting-temperature solder preform to the substrate; and applying a bead of a curable bonding material to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension. After placing the die atop the solder preform so as to at least partially overlie the bonding material, the method includes heating the solder preform and the bonding material so as to reflow the solder, whereupon the solder preform collapses to allow the bonding material to engage the underside of the die, and to subsequently cure the bonding material.
摘要翻译：用于将诸如半导体管芯的电子部件附接到基板的方法和制品包括将相对低熔点的焊料预制件施加到基板上; 以及在足以基本上容纳焊料材料的量的基础上将可固化粘合材料的珠粒施加到围绕焊料预制件周围的基底上，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和衬底之间的间隙尺寸。在将模具放置在焊料预制件顶部以至少部分地覆盖接合材料之后，该方法包括加热焊料预成型件和接合材料以便回流焊料，于是焊料预制件塌陷以允许接合材料接合并且随后固化粘结材料。

2. 发明授权

US06144104A High-operating-temperature electronic component 失效
标题翻译：高工作温度电子元件
公开(公告)号：US06144104A
公开(公告)日：2000-11-07
申请号：US275129
申请日：1999-03-24
申请人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
发明人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
IPC分类号： H01L21/58 , H01L23/373 , H01K23/48 , H01K23/52
CPC分类号： H01L24/83 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L2224/05599 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/48091 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83815 , H01L2224/83855 , H01L2224/8392 , H01L2224/83951 , H01L2224/85399 , H01L2224/92247 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351
摘要： A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension.
摘要翻译：将用于将诸如半导体管芯的电子部件附接到基板的产品包括施加到基板的相对低熔点温度的焊料预制件; 以及可焊接材料的珠粒，其以足以基本上容纳焊料材料的量施加到围绕焊料预制件的周边的基底，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和基板之间的间隙尺寸。

3. 发明授权

US5669813A Apparatus for storing and cooling electronic devices and/or modules in a vehicle 失效
标题翻译：用于在车辆中存储和冷却电子设备和/或模块的装置
公开(公告)号：US5669813A
公开(公告)日：1997-09-23
申请号：US642725
申请日：1996-05-03
申请人： Vivek Amir Jairazbhoy , Prathap Amerwai Reddy , John Trublowski , Jay DeAvis Baker , Lawrence Leroy Kneisel
发明人： Vivek Amir Jairazbhoy , Prathap Amerwai Reddy , John Trublowski , Jay DeAvis Baker , Lawrence Leroy Kneisel
IPC分类号： B60H1/00 , B60H1/26
CPC分类号： B60H1/00271 , B60H2001/003 , B60H2001/00614
摘要： An apparatus for cooling electronic devices/modules in a vehicle comprises a main ventilation duct mounted in the vehicle, and includes a blower for forcing air through the main duct. A bypass duct is provided in selective fluid communication with the main ventilation duct, and is adapted to carry electronic devices/modules to be cooled by air forced through the bypass duct. Inlet and outlet valves are provided for selectively varying the amount of air which passes through the bypass duct. The electronic devices may be positioned outside of the bypass duct, or inside the bypass duct if sealed.
摘要翻译：一种用于冷却车辆中的电子设备/模块的装置，包括安装在车辆中的主通风管道，并且包括用于迫使空气通过主管道的鼓风机。提供与主通风管道选择性流体连通的旁通管道，并且适于携带被强制通过旁通管道的空气冷却的电子设备/模块。提供入口和出口阀，用于选择性地改变通过旁路管道的空气量。如果密封，电子设备可以位于旁路管道的外部，或旁路管道内部。

4. 发明授权

US06601753B2 Void-free die attachment method with low melting metal 失效
公开(公告)号：US06601753B2
公开(公告)日：2003-08-05
申请号：US09859553
申请日：2001-05-17
申请人： Jay DeAvis Baker , Lawrence Leroy Kneisel , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
发明人： Jay DeAvis Baker , Lawrence Leroy Kneisel , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
IPC分类号： B23K3538
CPC分类号： H01L24/90 , B23K35/264 , H01L23/10 , H01L23/44 , H01L24/32 , H01L24/48 , H01L24/72 , H01L24/73 , H01L24/83 , H01L2224/05599 , H01L2224/2919 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/73251 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/16195 , H01L2924/351 , H01L2924/00 , H01L2924/01031 , H01L2924/01083 , H01L2924/3512 , H01L2224/32 , H01L2224/72 , H01L2224/45015 , H01L2924/207
摘要： A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

5. 发明授权

US06381837B1 Method for making an electronic circuit assembly 失效
标题翻译：制造电子电路组件的方法
公开(公告)号：US06381837B1
公开(公告)日：2002-05-07
申请号：US09148061
申请日：1998-09-04
申请人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
发明人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
IPC分类号： H05K334
CPC分类号： H05K3/4685 , H05K1/111 , H05K3/062 , H05K3/303 , H05K3/328 , H05K3/3442 , H05K3/4007 , H05K2201/0361 , H05K2201/0367 , H05K2201/0373 , H05K2201/09781 , H05K2201/10636 , H05K2201/2036 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156
摘要： A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
摘要翻译：从蚀刻的三金属层结构制造电子电路组件（例如，电路板）的方法，其提供空气桥交叉和从三金属层结构的中间层蚀刻的特殊设计的凸起。凸起形成在特定的电路位置，以提供用于（1）重引线键合，（2）细线接合或（3）直接芯片附接的互连。或者提供（4）用于确保最小焊点间隙高度的提升器，或（5）阻止焊点裂纹扩展的障碍物。

6. 发明授权

US06826829B2 Method for attaching a die with a low melting metal 失效
标题翻译：用低熔点金属附着模具的方法
公开(公告)号：US06826829B2
公开(公告)日：2004-12-07
申请号：US10093153
申请日：2002-03-07
申请人： Cuong Van Pham , Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
IPC分类号： H05K334
CPC分类号： H01L23/42 , H01L21/54 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01057 , H01L2924/01068 , H01L2924/10253 , H01L2924/14 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49171 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.
摘要翻译：公开了一种将电子管芯附接到基板的方法。优选地，该方法包括将管芯固定到衬底上，将电子管芯与衬底上的至少一个焊盘相互连接以形成电连接，用电绝缘涂层涂覆互连件和电子管芯，并覆盖电子管芯具有低温熔融金属。因此，本发明的方法提高了电子管芯的可靠性。

7. 发明授权

US5986884A Method for cooling electronic components 失效
标题翻译：冷却电子部件的方法
公开(公告)号：US5986884A
公开(公告)日：1999-11-16
申请号：US114315
申请日：1998-07-13
申请人： Vivek Amir Jairazbhoy , Michael George Todd , Prathap Amerwai Reddy
发明人： Vivek Amir Jairazbhoy , Michael George Todd , Prathap Amerwai Reddy
IPC分类号： H05K1/02 , H05K7/20
CPC分类号： H05K7/205 , H05K1/0272 , H05K2201/064
摘要： There is disclosed herein a printed circuit board, one embodiment of which comprises: a dielectric substrate 10; a solid metallic heat sink 16 attached to or embedded within the substrate; a cavity 18 formed generally in the substrate, wherein at least one wall 20 of the cavity is defined by a surface 17 of the heat sink 16; a component mounting pad 14 disposed on the substrate proximate the cavity; a predetermined volume of electrically insulative liquid 22 contained within the cavity; and a thermally conductive member 24 embedded within the substrate, the member 24 being in direct thermal contact with each of the mounting pad 14 and the liquid 22.
摘要翻译：这里公开了印刷电路板，其一个实施例包括：电介质基板10; 固定的金属散热器16，附着到或嵌入在基片内; 通常形成在基板中的空腔18，其中空腔的至少一个壁20由散热器16的表面17限定; 配置在靠近空腔的基板上的部件安装焊盘14; 包含在腔内的预定体积的电绝缘液体22; 以及嵌入基板内的导热构件24，构件24与安装垫14和液体22中的每一个直接热接触。

8. 发明授权

US6059020A Apparatus for acoustic cooling automotive electronics 失效
标题翻译：汽车电子声学冷却装置
公开(公告)号：US6059020A
公开(公告)日：2000-05-09
申请号：US784883
申请日：1997-01-16
申请人： Vivek Amir Jairazbhoy , Prathap Amerwai Reddy , George Mozurkewich, Jr.
发明人： Vivek Amir Jairazbhoy , Prathap Amerwai Reddy , George Mozurkewich, Jr.
IPC分类号： F25D9/00 , F25B9/00 , F25B9/14 , F28F13/10 , H05K7/20 , F28D11/06
CPC分类号： F25B9/145 , F28F13/10 , F02G2243/52 , F25B2309/1404 , F25B2309/1416 , F25B2309/1419
摘要： An apparatus for acoustically cooling automotive electronics in which an acoustic driver and acoustic reflector are disposed within a hollow member, such as a cross-car-beam of a vehicle. The frequency of the acoustic driver and the distance between the acoustic driver and the acoustic reflector are selected to generate a standing acoustic wave within the hollow member. The standing acoustic wave will generate a fluid flow providing forced air convection cooling of a base or its extension on which
摘要翻译：一种用于声学冷却汽车电子设备，其中声学驱动器和声反射器设置在诸如车辆的交叉车梁的中空构件内。选择声学驱动器的频率和声学驱动器与声学反射器之间的距离以在中空构件内产生驻声波。立体声波将产生流体流动，从而为基座或其延伸部提供强制空气对流冷却

9. 发明授权

US5792677A Embedded metal planes for thermal management 失效
标题翻译：用于热管理的嵌入式金属飞机
公开(公告)号：US5792677A
公开(公告)日：1998-08-11
申请号：US784701
申请日：1997-01-16
申请人： Prathap Amerwai Reddy , Vivek Amir Jairazbhoy , Robert Edward Belke, Jr.
发明人： Prathap Amerwai Reddy , Vivek Amir Jairazbhoy , Robert Edward Belke, Jr.
IPC分类号： H01L23/367 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/3677 , H01L2924/0002
摘要： In order to dissipate heat from an electronic device, there is disclosed a method whereby with the use of metal planes embedded in an insulating substrate, heat generated by the electronic device can be transported and dissipated to a remote, more desirable location.
摘要翻译：为了散发来自电子设备的热量，公开了一种方法，通过使用嵌入在绝缘基板中的金属平面，可以将由电子设备产生的热量输送并散发到远程，更理想的位置。

10. 发明授权

US06303992B1 Interposer for mounting semiconductor dice on substrates 失效
标题翻译：用于将半导体裸片安装在基板上的插入器
公开(公告)号：US06303992B1
公开(公告)日：2001-10-16
申请号：US09347542
申请日：1999-07-06
申请人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
IPC分类号： H01L2348
CPC分类号： H01L23/473 , H01L2224/16225
摘要： An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20. The interposer 10 may also include: a sealed cooling channel 28 defined within the interposer body 12; a fluid medium 30 generally filling the cooling channel 28; and a piezoelectric element 26 attached to the interposer body such that the piezoelectric element communicates with the cooling channel 28 and the fluid medium 30, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits 22.
摘要翻译：一种用于将半导体管芯50电耦合到衬底70的插入器10，包括：由介电材料制成并具有接触表面14和相对的接合表面16的插入体本体12; 布置在接触表面14周围的多个接触垫18; 布置在接合表面16的整个区域的多个接合焊盘20; 以及大体上设置在插入体内部的多个导电管道22，使得每个导管22将相应的一个接触焊盘18与相应的一个接合焊盘20连接。插入器10还可以包括：密封的冷却通道 28; 通常填充冷却通道28的流体介质30; 以及压电元件26，其连接到中介体，使得压电元件与冷却通道28和流体介质30连通，压电元件可操作地耦合到至少两个导电导管22。

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