专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080266820A1 SYSTEM FOR SUPPORTING AND ELECTRICALLY GROUNDING A COVER OF AN ELECTRONIC CONTROL MODULE 审中-公开
标题翻译：用于支持和电接地电子控制模块的盖子的系统
公开(公告)号：US20080266820A1
公开(公告)日：2008-10-30
申请号：US11739881
申请日：2007-04-25
申请人： Vivek Amir Jairazbhoy , Diane Marie Jett , Bertrand Robert Mohr , Robert Edward Belke , Michael Timothy Dwyer
发明人： Vivek Amir Jairazbhoy , Diane Marie Jett , Bertrand Robert Mohr , Robert Edward Belke , Michael Timothy Dwyer
IPC分类号： H05K5/00
CPC分类号： H05K9/0016
摘要： A system for supporting and electrically grounding metallic covers for electronic control modules includes a housing having wall portions defining a cavity with an opening, a circuit board located within the cavity, the circuit board having a ground plane formed within the circuit board, the circuit board having a top surface substantially facing the opening and supports for proving structural support for the cover, the supports being located on the top surface of the circuit board. The system shields emissions radiating from the module.
摘要翻译：一种用于电子控制模块的用于支撑和电接地金属盖的系统包括具有限定具有开口的空腔的壁部的壳体，位于空腔内的电路板，所述电路板具有形成在所述电路板内的接地平面，所述电路板具有基本上面对开口的顶表面和用于证明盖的结构支撑的支撑件，支撑件位于电路板的顶表面上。该系统屏蔽从模块辐射的辐射。

2. 发明授权

US06584682B2 Method for making circuit board 失效
标题翻译：电路板制作方法
公开(公告)号：US06584682B2
公开(公告)日：2003-07-01
申请号：US09812345
申请日：2001-03-20
申请人： Robert Edward Belke , Thomas Bernd Krautheim , Vivek Amir Jairazbhoy , Delin Li
发明人： Robert Edward Belke , Thomas Bernd Krautheim , Vivek Amir Jairazbhoy , Delin Li
IPC分类号： H05K320
CPC分类号： H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A method 10 for making multi-layer electronic circuit boards 148, 248 having aperture 146, 246 which may be selectively connected to an electrical ground potential.
摘要翻译：一种用于制造具有孔146,246的多层电子电路板148,248的方法10，其可选择性地连接到电接地电位。

3. 发明授权

US06381837B1 Method for making an electronic circuit assembly 失效
标题翻译：制造电子电路组件的方法
公开(公告)号：US06381837B1
公开(公告)日：2002-05-07
申请号：US09148061
申请日：1998-09-04
申请人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
发明人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
IPC分类号： H05K334
CPC分类号： H05K3/4685 , H05K1/111 , H05K3/062 , H05K3/303 , H05K3/328 , H05K3/3442 , H05K3/4007 , H05K2201/0361 , H05K2201/0367 , H05K2201/0373 , H05K2201/09781 , H05K2201/10636 , H05K2201/2036 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156
摘要： A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
摘要翻译：从蚀刻的三金属层结构制造电子电路组件（例如，电路板）的方法，其提供空气桥交叉和从三金属层结构的中间层蚀刻的特殊设计的凸起。凸起形成在特定的电路位置，以提供用于（1）重引线键合，（2）细线接合或（3）直接芯片附接的互连。或者提供（4）用于确保最小焊点间隙高度的提升器，或（5）阻止焊点裂纹扩展的障碍物。

4. 发明申请

US20170108959A1 TWO PIECE LENS ASSEMBLY 审中-公开
公开(公告)号：US20170108959A1
公开(公告)日：2017-04-20
申请号：US14884029
申请日：2015-10-15
申请人： Richard Keith McMillan , Robert Edward Belke , Daren Lee Harris
发明人： Richard Keith McMillan , Robert Edward Belke , Daren Lee Harris
IPC分类号： G06F3/041 , G02B1/11
CPC分类号： G06F3/041 , B29D11/00817 , B29K2105/0058 , B29K2105/0097 , G02B1/04 , G02B1/11 , G02B3/12
摘要： A lens assembly for an electronic display, and a method of manufacturing said lens assembly is provided herein. The lens assembly includes a first lens layer, the first lens layer defining a surface opposing a viewer of the lens assembly; a second lens layer opposing a second surface of the first lens layer, the second surface being on an opposite side of the surface; a reservoir formed by the first lens layer and the second lens layer placed on a border, a liquid optical clear adhesive (loca) deposited into the reservoir; and a touch sensor attached to either the first lens layer and the second lens layer.

5. 发明申请

US20160303970A1 GLASS LENS ASSEMBLY WITH AN ELASTIC ADHESIVE 审中-公开
标题翻译：玻璃透镜组件与弹性粘合剂
公开(公告)号：US20160303970A1
公开(公告)日：2016-10-20
申请号：US14689515
申请日：2015-04-17
申请人： James Frederick Krier , Robert Edward Belke
发明人： James Frederick Krier , Robert Edward Belke
IPC分类号： B60K35/00 , B29C65/48
CPC分类号： B60K35/00 , B29C65/48 , B29C66/1162 , B29C66/5346 , B29C66/73112 , B29C66/7465 , B29L2011/0016 , B29L2012/00 , B60K37/02 , B60K2370/20 , B60K2370/693 , G02B7/02
摘要： A lens assembly, and a method for providing a lens assembly is disclosed herein. The lens assembly includes a first frame piece with a first edge on the direction in which a viewer of the electronic display would face, the first edge forming a first angle with a second edge; a second frame piece with a third edge on the direction in which a viewer of the electronic display would face, the third edge forming a second angle with a fourth edge; a lens with a first lens edge facing the viewer, a second lens edge and third lens edge connected to the first lens edge and forming a lens angle; a first adhesive layer placed between the second edge and the second lens edge to attach the first frame piece to the lens; and a second adhesive layer placed between the fourth edge and the third lens edge to attach the second frame piece to the lens.
摘要翻译：本文公开了一种透镜组件和用于提供透镜组件的方法。所述透镜组件包括第一框架件，所述第一框架件在所述电子显示器的观察者将面向的方向上具有第一边缘，所述第一边缘与第二边缘形成第一角度; 第二框架件，其具有电子显示器的观察者将面向的方向上的第三边缘，所述第三边缘与第四边缘形成第二角度; 具有面向观察者的第一透镜边缘的透镜，连接到第一透镜边缘并形成透镜角度的第二透镜边缘和第三透镜边缘; 第一粘合剂层，设置在第二边缘和第二透镜边缘之间，以将第一框架件附接到透镜; 以及设置在所述第四边缘和所述第三透镜边缘之间以将所述第二框架件附接到所述透镜的第二粘合剂层。

6. 发明授权

US06830176B2 System and method for repairing flex circuits 失效
标题翻译：修复柔性电路的系统和方法
公开(公告)号：US06830176B2
公开(公告)日：2004-12-14
申请号：US10061599
申请日：2002-02-01
申请人： Peter Joseph Sinkunas , Zhong-You Shi , Jay D. Baker , Robert Edward Belke , Charles Frederick Schweitzer , Raymond Eric Foster , Stephen Edward Fuks
发明人： Peter Joseph Sinkunas , Zhong-You Shi , Jay D. Baker , Robert Edward Belke , Charles Frederick Schweitzer , Raymond Eric Foster , Stephen Edward Fuks
IPC分类号： B23K3100
CPC分类号： H05K3/225 , H05K3/363
摘要： A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.
摘要翻译：公开了一种用于修复柔性电路的新系统和方法。柔性电路向电子设备传导电信号。该系统通常包括柔性电路衬底，至少一个电导体和修补贴片。柔性电路基板具有切割区域和修复区域。所述至少一个电导体由所述柔性电路基板支撑。电导体被配置为承载电信号。修补补片用于至少电连接两个维修区域。

7. 发明授权

US06571820B2 Concealed air vents 失效
标题翻译：隐蔽的通风口
公开(公告)号：US06571820B2
公开(公告)日：2003-06-03
申请号：US09904231
申请日：2001-07-12
申请人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Robert Edward Belke , Jay DeAvis Baker , Joseph Mario Giachino , Lakhi Nandlal Goenka , Myron Lemecha
IPC分类号： F61K100
CPC分类号： B60H1/3407 , Y10T137/6888
摘要： A vent assembly that can be concealed when in a closed configuration is provided in one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent. A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.
摘要翻译：在一个实施例中，在闭合构造中可以隐藏的排气组件，排气组件包括固定到管道或其它通道的安装表面的基座构件和导向构件。柔性杆固定地附接到基座构件并且可滑动地设置在由引导构件限定的通道内。面板设置在柔性杆上或围绕柔性杆并且位于基部和引导构件之间。致动器能够使杆变形，使得面板移动远离管道的端子开口，从而打开排气口。还提供了包括根据本发明的通风组件的流体分配系统。

8. 发明授权

US06490786B2 Circuit assembly and a method for making the same 失效
公开(公告)号：US06490786B2
公开(公告)日：2002-12-10
申请号：US09836658
申请日：2001-04-17
申请人： Robert Edward Belke , Charles Alan Still , Robert Joseph Gordon
发明人： Robert Edward Belke , Charles Alan Still , Robert Joseph Gordon
IPC分类号： H05K336
CPC分类号： H05K3/361 , H05K1/095 , H05K1/117 , H05K1/142 , H05K3/041 , H05K3/305 , H05K3/363 , H05K3/4611 , H05K2201/0129 , H05K2201/0376 , H05K2201/0391 , H05K2201/09109 , H05K2201/09445 , H05K2201/09781 , H05K2203/065 , H05K2203/107 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128
摘要： A method 10 for producing a circuit assembly 30 having a polymeric member 14 upon which conductors, such as conductors 64, may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

9. 发明授权

US06403893B2 Circuit board and a method for making the same 失效
标题翻译：电路板及其制作方法
公开(公告)号：US06403893B2
公开(公告)日：2002-06-11
申请号：US09907971
申请日：2001-03-20
申请人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号： H05K114
CPC分类号： H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49156
摘要： A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.
摘要翻译：一种用于制造具有电镀孔96,98的多层电子电路板136的方法，其可以与电接地构件46选择性地和电隔离，并且还具有结构上由材料支撑的选择性地形成的空气桥和/或交叉构件128 134。

10. 发明授权

US5783867A Repairable flip-chip undercoating assembly and method and material for same 失效
标题翻译：可修复的倒装芯片底漆组装及方法和材料相同
公开(公告)号：US5783867A
公开(公告)日：1998-07-21
申请号：US554181
申请日：1995-11-06
申请人： Robert Edward Belke , Bethany Walles , Michael G. Todd , Brian J. Hayden
发明人： Robert Edward Belke , Bethany Walles , Michael G. Todd , Brian J. Hayden
IPC分类号： C09J171/12 , H01L21/56 , H01L21/60 , H01L23/29 , H01L23/31 , H01L23/48 , H01L23/52 , H01L27/40
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L2224/16 , H01L2224/73203 , H01L2224/81801 , H01L2224/83101 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01033 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/16195
摘要： In a method for reversible assembly of a semiconductor electronic flip-chip device to an electrical interconnecting substrate, a filled thermoplastic adhesive is interposed between an active face of the flip-chip device and a bond site on the substrate. Electrical connection is established between the flip-chip device and the substrate and, generally simultaneously, adhesive bonding between them is established via viscous flow of the filled thermoplastic adhesive above its glass transition temperature, followed by cooling of the adhesive. The adhesive can be reheated to free the flip-chip device of its adhesive bond to the substrate. The filled thermoplastic adhesive includes a low expansion filler in a binder matrix. In accordance with one aspect of the invention, the binder matrix is poly(aryl ether ketone) having the chemical formula ##STR1## where n is from 5 to 150 and R is selected from suitable divalent moieties. The filled thermoplastic adhesive can be interposed between the flip-chip device and the substrate as a preform or by other suitable method, such as syringe extrusion in a molten or viscous state.
摘要翻译：在将半导体电子倒装芯片可逆组装到电互连衬底的方法中，填充的热塑性粘合剂介于倒装芯片器件的有源面和衬底上的键合位置之间。在倒装芯片器件和衬底之间建立电连接，并且通常同时通过填充的热塑性粘合剂的粘性流动高于其玻璃化转变温度来建立它们之间的粘结，然后冷却粘合剂。粘合剂可以被再加热以使其倒装芯片的粘合剂结合到基底上。填充的热塑性粘合剂包括粘合剂基质中的低膨胀填料。根据本发明的一个方面，粘合剂基质是具有选自合适的二价部分的化学式的聚（芳基醚酮）。填充的热塑性粘合剂可以作为预成型件插入在倒装芯片器件和衬底之间，或者通过其它合适的方法，例如在熔融或粘性状态下的注射器挤出。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式