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1. 发明授权

US07048423B2 Integrated light and accessory assembly 有权
公开(公告)号：US07048423B2
公开(公告)日：2006-05-23
申请号：US09966634
申请日：2001-09-28
申请人： Walter Kuzma Stepanenko , Jay DeAvis Baker , Lawrence LeRoy Kneisel , Richard Keith McMillan , Brenda Joyce Nation , Cindy Maria Rutyna , Charles Frederick Schweitzer , Peter Langer
发明人： Walter Kuzma Stepanenko , Jay DeAvis Baker , Lawrence LeRoy Kneisel , Richard Keith McMillan , Brenda Joyce Nation , Cindy Maria Rutyna , Charles Frederick Schweitzer , Peter Langer
IPC分类号： B60Q1/26
CPC分类号： H05K1/0274 , B29C45/14811 , B29C2045/14868 , B29K2705/00 , B29L2031/3055 , B29L2031/747 , F21S41/00 , F21S41/17 , F21S43/14 , F21S43/195 , G01S2013/9396 , H05K1/0284 , H05K3/202 , H05K2201/09118 , H05K2201/10106 , H05K2201/10113 , H05K2201/2054
摘要： An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

2. 发明授权

US06501031B1 Electrical circuit board and a method for making the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06501031B1
公开(公告)日：2002-12-31
申请号：US09655809
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
发明人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
IPC分类号： H05K111
CPC分类号： H05K3/445 , H05K3/386 , H05K3/4038 , H05K3/4092 , H05K2201/0305 , H05K2201/0361 , H05K2201/0394 , H05K2201/0397 , H05K2201/09554 , H05K2201/09581 , H05K2203/1438 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49172
摘要： A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.
摘要翻译：具有芯构件12，设置在其上的一对电介质层14,16的多层电子电路板设计10以及使用粘合材料层连接到电介质层14和芯构件12的第一电路部分20 电路板设计10还具有选择性地形成通过第一电路部分20形成的“盲”孔，通孔或空腔22，电介质层14和粘合层18，从而露出芯构件12。

3. 发明授权

US06316736B1 Anti-bridging solder ball collection zones 失效
标题翻译：抗桥接焊球收集区
公开(公告)号：US06316736B1
公开(公告)日：2001-11-13
申请号：US09092821
申请日：1998-06-08
申请人： Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H01R909
CPC分类号： H05K3/3442 , H01L2224/10175 , H01L2924/384 , H01L2924/3841 , H05K1/111 , H05K3/3452 , H05K2201/0939 , H05K2201/0989 , H05K2201/10636 , H05K2201/10689 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.
摘要翻译：这里公开了具有改进的抗焊料桥接和元件偏心/墓碑的电阻的印刷电路板（PCB）。印刷电路板（PCB）包括具有顶面12的基板10; 至少两个安装焊盘14，其配置在与电子部件24的端子26相匹配的顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘22o中。每个孔口18包括位于至少一个外部孔口边缘22o中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可以被引导并保持在其中。

4. 发明授权

US5917704A Laser-solderable electronic component 失效
标题翻译：激光可焊接电子部件
公开(公告)号：US5917704A
公开(公告)日：1999-06-29
申请号：US944700
申请日：1997-10-06
申请人： John Trublowski , Andrew Z. Glovatsky , Richard Keith McMillan, II , Bernard Allen Meyer
发明人： John Trublowski , Andrew Z. Glovatsky , Richard Keith McMillan, II , Bernard Allen Meyer
IPC分类号： H01L23/31 , H01L23/433 , H05K1/02 , H05K3/34 , H05K7/20
CPC分类号： H01L23/4334 , H01L23/3121 , H05K3/341 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K1/0206 , H05K2201/0112 , H05K2201/09909 , H05K2201/10166 , H05K2201/10969 , H05K2203/107 , H05K3/3452 , H05K3/3494 , Y02P70/613
摘要： There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.
摘要翻译：这里公开了一种具有整体散热器16的电子部件10，其特别设计用于辅助将散热器激光焊接到衬底20上的焊盘22上。部件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大体上垂直于顶表面和底表面之间。部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端接件14的一部分。散热器16限定电子部件10的至少一部分底表面32，并且至少电子部件10的至少一个周边外表面34的一部分。

5. 发明授权

US5878487A Method of supporting an electrical circuit on an electrically insulative base substrate 失效
标题翻译：在电绝缘基底上支撑电路的方法
公开(公告)号：US5878487A
公开(公告)日：1999-03-09
申请号：US718166
申请日：1996-09-19
申请人： Richard Keith McMillan, II , Andrew Zachary Glovatsky , Michael George Todd
发明人： Richard Keith McMillan, II , Andrew Zachary Glovatsky , Michael George Todd
IPC分类号： H05K1/02 , H05K3/10 , H05K3/42 , H05K3/46 , H01K3/10
CPC分类号： H05K1/0245 , H05K1/0224 , H05K1/0228 , H05K3/107 , H05K3/428 , H05K3/4685 , H05K1/0253 , H05K2201/0376 , H05K2201/0379 , H05K2201/0715 , H05K2201/09681 , H05K2201/097 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method of supporting an electrical circuit on an electrically insulative base substrate comprises embossing a first circuit pattern on the substrate, and plating or etching a second circuit pattern over the first circuit pattern such that the first and second circuit patterns are in physical contact with each other for electrical communication therebetween. Plated through-holes are provided for facilitating support of a twisted pair of electrical conductors on a base substrate.
摘要翻译：一种在电绝缘基底基板上支撑电路的方法包括在衬底上压印第一电路图案，以及在第一电路图案上电镀或蚀刻第二电路图案，使得第一和第二电路图案与每个电路图案物理接触另一个用于其间的电气通信。提供镀通孔以便于支撑基底基板上的双绞电导体。

6. 发明申请

US20170108959A1 TWO PIECE LENS ASSEMBLY 审中-公开
公开(公告)号：US20170108959A1
公开(公告)日：2017-04-20
申请号：US14884029
申请日：2015-10-15
申请人： Richard Keith McMillan , Robert Edward Belke , Daren Lee Harris
发明人： Richard Keith McMillan , Robert Edward Belke , Daren Lee Harris
IPC分类号： G06F3/041 , G02B1/11
CPC分类号： G06F3/041 , B29D11/00817 , B29K2105/0058 , B29K2105/0097 , G02B1/04 , G02B1/11 , G02B3/12
摘要： A lens assembly for an electronic display, and a method of manufacturing said lens assembly is provided herein. The lens assembly includes a first lens layer, the first lens layer defining a surface opposing a viewer of the lens assembly; a second lens layer opposing a second surface of the first lens layer, the second surface being on an opposite side of the surface; a reservoir formed by the first lens layer and the second lens layer placed on a border, a liquid optical clear adhesive (loca) deposited into the reservoir; and a touch sensor attached to either the first lens layer and the second lens layer.

7. 发明授权

US06772733B2 Optically controlled IPCS circuitry 失效
标题翻译：光控IPCS电路
公开(公告)号：US06772733B2
公开(公告)日：2004-08-10
申请号：US10271205
申请日：2002-10-15
申请人： Zhong-You Shi , Bernard A. Meyer , Harvinder Singh , Jay DeAvis Baker , Lawrence Leroy Kneisel , Richard Keith McMillan , David James Steinert
发明人： Zhong-You Shi , Bernard A. Meyer , Harvinder Singh , Jay DeAvis Baker , Lawrence Leroy Kneisel , Richard Keith McMillan , David James Steinert
IPC分类号： F02P500
CPC分类号： F02D41/28 , F02B75/22 , F02B77/085 , F02B77/089 , F02D41/26 , F02D2400/18 , F02M51/005 , F05C2225/08 , G01F23/2925 , G01L11/02 , G01L23/16 , G02B6/12004 , G02B6/12007 , G02B6/122 , G02B6/4298 , G02B6/43 , G02B2006/12104 , G02B2006/12109 , G08C23/02 , G08C2201/31 , G08C2201/41
摘要： An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.
摘要翻译：一种集成控制系统，包括控制发动机的至少一个部件或子系统的集成电路和当通过集成电路触发时产生第一光信号的第一光源。第一光信号从第一光源传播通过也可以用作衬底的LCC，其中致动发动机部件的信号可以是第一光信号或在产生第一光信号之后产生的信号。发动机的部件或子系统可以是点火系统或燃料喷射系统。本发明还涉及一种控制发动机的部件或子系统的方法。

8. 发明授权

US06169253A Solder resist window configurations for solder paste overprinting 失效
标题翻译：焊膏套印的阻焊窗配置
公开(公告)号：US06169253A
公开(公告)日：2001-01-02
申请号：US09093079
申请日：1998-06-08
申请人： Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H05K118
CPC分类号： H05K3/3452 , H05K3/3442 , H05K3/3484 , H05K2201/0989 , H05K2201/10166 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49144
摘要： There is disclosed herein an electronic circuit assembly, such as a printed circuit board, having solder resist windows with one or more enlarged solder resist pullback zones, thereby facilitating solder paste overprinting.
摘要翻译：这里公开了一种电子电路组件，例如印刷电路板，其具有具有一个或多个扩大的阻焊剂回拉区的阻焊窗，从而便于焊膏叠印。

9. 发明授权

US6115262A Enhanced mounting pads for printed circuit boards 失效
公开(公告)号：US6115262A
公开(公告)日：2000-09-05
申请号：US93025
申请日：1998-06-08
申请人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H05K1/11 , H05K3/34 , H05K1/18 , H05K7/06
CPC分类号： H05K3/3442 , H05K1/111 , H05K2201/09381 , H05K2201/0939 , H05K2201/10636 , H05K2203/0465 , H05K3/3484 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

10. 发明授权

US07102888B2 Electronically integrated vehicle structure 有权
标题翻译：电子集成车辆结构
公开(公告)号：US07102888B2
公开(公告)日：2006-09-05
申请号：US10828396
申请日：2004-04-20
申请人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
发明人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
IPC分类号： H05K7/20 , B62D25/14
CPC分类号： B60R16/0207
摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.
摘要翻译：集成车辆结构包括塑料支撑结构中的电子位置。该电子站点具有安装在其上的电子部件的柔性基板。塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。每个肋具有形成塑料安装表面的一部分的侧边缘。柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。也可以提供限定金属安装表面的方法支撑结构。一个或多个电子侧可以附接到金属和塑料安装表面。

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