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1. 发明授权

US6000597A Molten solder dispensing system 失效
标题翻译：熔融焊料分配系统
公开(公告)号：US6000597A
公开(公告)日：1999-12-14
申请号：US14878
申请日：1998-01-28
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
摘要翻译：用于分配焊料的设备包括具有形成在其中的多个流动通道的喷嘴体。每个流动通道包括用于分配焊料的入口端和分配器端。喷嘴体形成围绕每个分配器端的乳头，并且喷嘴体还形成与每个分配器端连通的屏蔽室，用于保护相应的乳头，并且可选地提供惰性气体流和/或排除来自焊接区域的环境氧气。喷嘴体包括微加工硅。提供了各种流动通道构造以改善流动特性。

2. 发明授权

US5820772A Valveless diaphragm pump for dispensing molten metal 失效
标题翻译：用于分配熔融金属的无阀隔膜泵
公开(公告)号：US5820772A
公开(公告)日：1998-10-13
申请号：US786562
申请日：1997-01-21
申请人： Otto Wilhelm Freitag , Randy Claude Stevenson , Keith Wade Meranda
发明人： Otto Wilhelm Freitag , Randy Claude Stevenson , Keith Wade Meranda
IPC分类号： F04B15/04 , F04B43/06 , B67D1/10
CPC分类号： F04B43/06 , F04B15/04
摘要： A solder pump includes a pump body having a solder reservoir and pump chamber formed therein in fluid communication with each other. A nozzle portion is provided in communication with the pump chamber for dispensing solder. A thin movable diaphragm is positioned adjacent the pump chamber and movable into the pump chamber for selectively pressurizing solder in the pump chamber for dispensing solder through the nozzle portion. A diaphragm clamp is secured to the body for supporting the diaphragm. The clamp includes an internal channel extending therein and enclosed by the diaphragm. The channel is provided in communication with a source of pressurized air for selectively forcing the diaphragm into the pump chamber. An adjustable stop is positioned within the pump chamber adjacent the diaphragm for limiting movement of the diaphragm into the pump chamber.
摘要翻译：焊料泵包括具有形成在其中彼此流体连通的焊料储存器和泵室的泵体。喷嘴部分设置成与泵室连通以分配焊料。薄移动隔膜位于泵室附近并可移动到泵室中，用于选择性地加压泵室中的焊料，以通过喷嘴部分分配焊料。隔膜夹固定在主体上，用于支撑隔膜。夹具包括在其中延伸并由隔膜包围的内部通道。通道设置成与加压空气源连通，用于选择性地迫使隔膜进入泵室。位于泵室内的可调节止动件邻近隔膜，以限制隔膜进入泵室的运动。

3. 发明授权

US5746368A Molten solder dispensing system 失效
公开(公告)号：US5746368A
公开(公告)日：1998-05-05
申请号：US649750
申请日：1996-05-15
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

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