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    • 4. 发明授权
    • Redundancy circuit for repairing defective bits in semiconductor memory
device
    • 用于修复半导体存储器件中的有缺陷的位的冗余电路
    • US5574729A
    • 1996-11-12
    • US338817
    • 1994-11-10
    • Mitsuya KinoshitaShigeru MoriYoshikazu MorookaHiroshi MiyamotoShigeru KikudaMakoto Suwa
    • Mitsuya KinoshitaShigeru MoriYoshikazu MorookaHiroshi MiyamotoShigeru KikudaMakoto Suwa
    • G11C11/401G11C29/00G11C29/04G06F11/00
    • G11C29/848
    • A semiconductor memory device includes a plurality of memory blocks, i main row or column select lines extending over the plurality of memory blocks, and a decoder for selecting one of the main row or column select lines in accordance with an applied address signal. The decoder includes i outputs. Each of the memory blocks includes a plurality of memory cells arranged in rows and columns and at least (i+1) sub row or column select lines each for selecting one row or one column of memory cells. A shift redundancy circuit is provided for each of the memory blocks, for connecting the main row or column select line and the sub row or column select line. The shift redundancy circuit includes a switch circuit for connecting one main row or column select line to one of the plurality of adjacent sub row or column select lines, and a circuit for setting a connection path of the switch circuit. The shift redundancy circuit connects successively adjacent sub row or column select lines to main row or column select lines in one to one correspondence except a defective sub row or column select line associated with a defective bit.
    • 一种半导体存储器件包括多个存储块,i个在多个存储块上延伸的主行或列选择线,以及用于根据所施加的地址信号选择主行或列选择线中的一个的解码器。 解码器包括i个输出。 每个存储块包括排列成行和列的多个存储器单元和至少(i + 1)个子行或列选择线,每个用于选择一行或一列存储单元。 为每个存储块提供移位冗余电路,用于连接主行或列选择线和子行或列选择线。 移位冗余电路包括用于将一个主行或列选择线连接到多个相邻子行或列选择线中的一个的开关电路和用于设置开关电路的连接路径的电路。 除了与有缺陷的位相关联的有缺陷的子行或列选择线之外,移位冗余电路将连续相邻的子行或列选择线以一对一的对应方式连接到主行或列选择线。
    • 9. 再颁专利
    • Dynamic random access memory with isolated well structure
    • 具有隔离井结构的动态随机存取存储器
    • USRE35613E
    • 1997-09-23
    • US496569
    • 1995-06-29
    • Kenichi YasudaMakoto SuwaShigeru Mori
    • Kenichi YasudaMakoto SuwaShigeru Mori
    • H01L27/02H01L27/105H01L27/108
    • H01L27/10805H01L27/0218H01L27/105
    • A semiconductor memory device includes a first conductivity type well in a first conductivity type semiconductor substrate surrounded by a second conductivity type well, one of a memory cell and an external input circuit arranged on the first conductivity type well and the other disposed outside the second conductivity type well. A predetermined power supply voltage is applied to the second conductivity type well and the first conductivity type well is connected to ground. In the structure, charge carriers injected from the external input circuit are absorbed in the second conductivity type well. As a result, the charge carriers are prevented from reaching the memory cell and destroying data stored therein. Therefore, it is possible to miniaturize transistors and increase integration density of dynamic random access memory devices without degrading the source to drain dielectric strength.
    • 半导体存储器件包括第一导电类型的半导体衬底中的第一导电类型的阱,该第一导电类型的半导体衬底由第二导电类型阱围绕,存储单元和布置在第一导电类型阱上的外部输入电路之一,另一个位于第二导电类型 类型很好。 对第二导电类型阱施加预定的电源电压,并且将第一导电类型阱连接到地。 在该结构中,从外部输入电路注入的电荷载流子被吸收在第二导电型阱中。 结果,防止电荷载体到达存储单元并破坏其中存储的数据。 因此,可以使晶体管小型化并提高动态随机存取存储器件的集成密度,而不会使源极降低介电强度。