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    • 6. 发明授权
    • Refresh control circuitry for refreshing storage data
    • 刷新控制电路以刷新存储数据
    • US06765838B2
    • 2004-07-20
    • US10209901
    • 2002-08-02
    • Junko MatsumotoTadaaki YamauchiTakeo Okamoto
    • Junko MatsumotoTadaaki YamauchiTakeo Okamoto
    • G11C700
    • G11C11/40622G11C11/406
    • A refresh array activating signal is activated in accordance with a refresh request and specific address bit(s) of a refresh address. Specific lower bit(s) of a refresh address counter is (are) utilized as the specific address bit(s) of the refresh address, and the specific address bit(s) is (are) utilized as upper bit(s) of the refresh address. Thus, in the self-refresh mode, refresh can be performed for a prescribed address region at uniform intervals, with a lengthened refresh interval, consuming less current. A semiconductor memory device is provided which allows current consumption to be distributed on a time basis and to be reduce in a self-refresh mode is provided.
    • 根据刷新请求和刷新地址的特定地址位激活刷新阵列激活信号。 刷新地址计数器的特定低位用作刷新地址的特定地址位,并且特定地址位用作(的)较高位 刷新地址。 因此,在自刷新模式下,可以以规定的地址区域以均匀的间隔进行刷新,延长刷新间隔,消耗较少的电流。 提供了一种半导体存储器件,其提供了在时间基础上分布电流消耗并且提供了自刷新模式中的电流消耗。
    • 7. 发明授权
    • Semiconductor device with data output circuit having slew rate adjustable
    • 数据输出电路具有压摆率可调的半导体器件
    • US06714461B2
    • 2004-03-30
    • US10139751
    • 2002-05-07
    • Junko MatsumotoTadaaki YamauchiTakeo Okamoto
    • Junko MatsumotoTadaaki YamauchiTakeo Okamoto
    • G11C700
    • G11C7/1057G11C7/1045G11C7/1051G11C7/1066
    • Data for switching a slew rate of a data output circuit included in a data input/output circuit between a slew rate in a normal mode and a slow slew rate is stored in a mode register. According to the data stored in mode register, a slew rate setting signal is generated. According to a slew rate switching circuit, the slew rate of the data input/output circuit is switched between a slew rate in the normal mode and a slow slew rate slower than the slew rate in the normal mode. A data output circuit is achieved which occupies a small area, is capable of setting a slew rate slower than the slew rate in a normal mode and outputting data without causing an erroneous operation with a low consumption current even when the slew rate is adjusted.
    • 将数据输入/输出电路中包括的数据输出电路的转换速率转换为正常模式的转换速率和慢速转换速率之间的数据被存储在模式寄存器中。 根据存储在模式寄存器中的数据,产生压摆率设定信号。 根据转换速率切换电路,数据输入/输出电路的转换速率在正常模式下的转换速率和比正常模式下的转换速率慢的慢速转换速率之间切换。 实现占用小面积的数据输出电路,即使在压摆率被调整的情况下,也能够将正常模式下的转换速度设定为比转换速度慢的输出速度,并输出数据而不引起低消耗电流的错误操作。
    • 9. 发明授权
    • Method of and device for transporting semiconductor substrate in
semiconductor processing system
    • 在半导体处理系统中传输半导体衬底的方法和装置
    • US5436848A
    • 1995-07-25
    • US47449
    • 1993-04-15
    • Masami NishidaMasahiro HimotoTetsuya HamadaNoriaki YokonoTakeo Okamoto
    • Masami NishidaMasahiro HimotoTetsuya HamadaNoriaki YokonoTakeo Okamoto
    • H01L21/00H01L21/677G06F19/00
    • H01L21/67103H01L21/67745
    • A robot (12) takes a wafer (3f) out of an indexer (1) and then transports the same to a heat processing part (41). A wafer (3e), which has already introduced in the heat processing part (41) is took out thereof by the robot (5). The wafer (3f) is introduced in the heat processing part (41) after a waiting time (18a) so that an excess heat processing in the heat processing part (41) can be avoided. The wafer (3e) is transported to a processing part (43) and introduced therein by the robot (5). After the robot (5) repeats the similar processings in processing parts (13, 42, 44), it returns to the wafer transferring robot (12) to receive a next wafer. At that time, the robot (5) waits for a predetermined time thereby a cycle time is adjusted. After the waiting, the robot (5) takes out the wafer (3f), which has been introduced in the heat processing part (41), out thereof. Since the cycle time is set in common for different lots, the waiting times (18a, 18b) are set individually for each lot.
    • 机器人(12)将晶片(3f)从分度器(1)中取出,然后将其输送到热处理部分(41)。 已经引入热处理部(41)的晶片(3e)被机器人(5)取出。 在等待时间(18a)之后,将晶片(3f)引入热处理部(41),从而可以避免热处理部(41)中的过度热处理。 将晶片(3e)输送到加工部(43)并由机器人(5)引入。 在机器人(5)重复处理部件(13,42,44)中的类似处理之后,返回到晶片传送机器人(12)以接收下一晶片。 此时,机器人(5)等待预定时间,从而调整循环时间。 在等待之后,机器人(5)将已经引入热处理部分(41)中的晶片(3f)取出。 由于循环时间对于不同的批次是共同设定的,因此为每个批次分别设置等待时间(18a,18b)。