专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09202622B2 Welding transformer and welding transformer assembly and welding apparatus 有权
标题翻译：焊接变压器和焊接变压器总成及焊接设备
公开(公告)号：US09202622B2
公开(公告)日：2015-12-01
申请号：US13813174
申请日：2012-06-29
申请人： Koji Kai , Kazuki Houzan , Akira Nagai , Kazuhiro Suzuki
发明人： Koji Kai , Kazuki Houzan , Akira Nagai , Kazuhiro Suzuki
IPC分类号： B23K11/24 , H01F27/06 , H01F38/08 , B23K11/11 , H01F27/40
CPC分类号： H01F38/085 , B23K11/115 , B23K11/241 , B23K2101/18 , H01F2027/408
摘要： It is possible to control a welding in a high speed and a high precision large electric current, and consumption electric power is also reduced. In the welding transformer, a loop magnetic core 25, a wound primary coil 12, plural positive side coils 14 and plural negative side coils 16 that are alternately sandwiched between respective gaps 12a of the primary coil 12, are comprised. A coil is fixed on the other surface of a contact base member 62. On the other surface of the contact base member 62, a first connection polar board 44 is electrically connected to a positive side electric conductor 30 through the first connection polar board 44. A negative side coil 16 is electrically connected to a negative side electric conductor 32. The connecting part of the positive side coil 14 and the negative side coil 16 is electrically connected to the third connection polar board 48. By sandwiching a thin insulation layer 31, a positive side electric conductor 30, a rectifying device 18 and a first polar board 34 are arranged on one side; A negative side electric conductor 32, a rectifying device 20 and a second polar board 36 are arranged on the other side; and the first polar board 34 and the second polar board 36 are electrically connected to a third polar board 38. It is possible to use by combining plural units and by connecting an output side in parallel in a small size and a large capacity.
摘要翻译：可以高速，高精度的大电流控制焊接，消耗电力也降低。在焊接变压器中，包括交替夹在初级线圈12的相应间隙12a之间的环形磁芯25，绕组初级线圈12，多个正侧线圈14和多个负侧线圈16。线圈固定在接触基底构件62的另一个表面上。在接触基底构件62的另一个表面上，第一连接极板44通过第一连接极板44电连接到正侧电导体30。负极侧线圈16与负极侧导体32电连接。正极侧线圈14与负极侧线圈16的连接部与第3连接极板48电连接。通过夹持薄层绝缘层31，正侧导电体30，整流装置18和第一极板34一侧配置; 负侧导电体32，整流装置20和第二极板36配置在另一侧。并且第一极板34和第二极板36电连接到第三极板38.可以通过组合多个单元并且通过以小尺寸和大容量并联连接输出侧来使用。

2. 发明申请

US20140360994A1 WELDING TRANSFORMER AND WELDING TRANSFORMER ASSEMBLY AND WELDING APPARATUS 有权
标题翻译：焊接变压器和焊接变压器总成和焊接设备
公开(公告)号：US20140360994A1
公开(公告)日：2014-12-11
申请号：US13813174
申请日：2012-06-29
申请人： Koji Kai , Kazuki Houzan , Akira Nagai , Kazuhiro Suzuki
发明人： Koji Kai , Kazuki Houzan , Akira Nagai , Kazuhiro Suzuki
IPC分类号： H01F38/08
CPC分类号： H01F38/085 , B23K11/115 , B23K11/241 , B23K2101/18 , H01F2027/408
摘要： It is possible to control a welding in a high speed and a high precision large electric current, and consumption electric power is also reduced. In the welding transformer, a loop magnetic core 25, a wound primary coil 12, plural positive side coils 14 and plural negative side coils 16 that are alternately sandwiched between respective gaps 12a of the primary coil 12, are comprised. A coil is fixed on the other surface of a contact base member 62. On the other surface of the contact base member 62, a first connection polar board 44 is electrically connected to a positive side electric conductor 30 through the first connection polar board 44. A negative side coil 16 is electrically connected to a negative side electric conductor 32. The connecting part of the positive side coil 14 and the negative side coil 16 is electrically connected to the third connection polar board 48. By sandwiching a thin insulation layer 31, a positive side electric conductor 30, a rectifying device 18 and a first polar board 34 are arranged on one side; A negative side electric conductor 32, a rectifying device 20 and a second polar board 36 are arranged on the other side; and the first polar board 34 and the second polar board 36 are electrically connected to a third polar board 38. It is possible to use by combining plural units and by connecting an output side in parallel in a small size and a large capacity.
摘要翻译：可以高速，高精度的大电流控制焊接，消耗电力也降低。在焊接变压器中，包括交替夹在初级线圈12的相应间隙12a之间的环形磁芯25，绕组初级线圈12，多个正侧线圈14和多个负侧线圈16。线圈固定在接触基底构件62的另一个表面上。在接触基底构件62的另一个表面上，第一连接极板44通过第一连接极板44电连接到正侧电导体30。负极侧线圈16与负极侧导电体32电连接。正极侧线圈14与负极侧线圈16的连接部与第3连接极板48电连接。通过夹持薄层绝缘层31，正侧导电体30，整流装置18和第一极板34一侧配置; 负侧导电体32，整流装置20和第二极板36配置在另一侧。并且第一极板34和第二极板36电连接到第三极板38.可以通过组合多个单元并且通过以小尺寸和大容量并联连接输出侧来使用。

3. 发明授权

US06638352B2 Thermal stable low elastic modulus material and device using the same 失效
标题翻译：热稳定性低弹性模量材料及其使用方法
公开(公告)号：US06638352B2
公开(公告)日：2003-10-28
申请号：US10097664
申请日：2002-03-15
申请人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
发明人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
IPC分类号： C08L8300
CPC分类号： H01L24/10 , C08L79/08 , C08L83/10 , H01L23/293 , H01L23/3114 , H01L23/3171 , H01L23/49894 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/351 , H05K1/0271 , Y10T428/31663 , C08L83/00 , H01L2224/13099 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.
摘要翻译：本发明提供一种热稳定性低的弹性模量材料，它具有高的热稳定性，在-50℃至300℃的温度范围内的动态特性如热膨胀系数和弹性模量的变化很小，具有在室温下为2-0.01GPa的弹性模量，并且电绝缘的可靠性高，而不管温度波动如何，并且提供了使用其的半导体器件。本发明还提供一种通过热量获得的热稳定性低弹性模量树脂组合物固化含有聚酰亚胺，聚酰胺 - 酰亚胺或聚酰胺树脂或树脂前体的混合物，其固化产物在-50℃下测量的2-0.01GPa的弹性模量和具有官能团的有机硅化合物的低聚物引起与NH和/或COOH基团的加成反应。

4. 发明授权

US06638631B2 Thermal stable low elastic modulus material and device using the same 失效
公开(公告)号：US06638631B2
公开(公告)日：2003-10-28
申请号：US10188961
申请日：2002-07-05
申请人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
发明人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
IPC分类号： B32B904
CPC分类号： H01L24/10 , C08L79/08 , C08L83/10 , H01L23/293 , H01L23/3114 , H01L23/3171 , H01L23/49894 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/351 , H05K1/0271 , Y10T428/31663 , C08L83/00 , H01L2224/13099 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.

5. 发明授权

US08578592B2 Method of manufacturing laminated rotor core 有权
标题翻译：层叠转子铁心的制造方法
公开(公告)号：US08578592B2
公开(公告)日：2013-11-12
申请号：US13509190
申请日：2011-04-01
申请人： Akira Nagai , Mei Arazoe , Go Kato
发明人： Akira Nagai , Mei Arazoe , Go Kato
IPC分类号： H02K15/03 , H02K1/27
CPC分类号： H02K15/03 , H02K1/276
摘要： A method of manufacturing a laminated rotor core, includes a first process of placing segment dummy plates between an iron core and a die, each of each segment dummy plates covering one or more of plural magnet insertion portions and including a resin injection hole communicating to the one or more of the magnet insertion portions; a second process of injecting a resin from resin reservoir parts formed in any one of an upper die and a lower die holding the iron core through the resin injection hole of each segment dummy plate to the corresponding one or more of the magnet insertion portions; and a third process of detaching the segment dummy plates together with excess resin after the resin injected to the one or more of the magnet insertion portions is cured.
摘要翻译：一种叠层转子铁芯的制造方法，其特征在于，包括：在铁芯和模具之间配置分段虚拟板的第一工序，各个虚拟板各自覆盖多个磁体插入部的一个或多个，一个或多个磁体插入部分; 将形成在保持铁芯的上模和下模中的任一个中的树脂储存部分注入树脂的第二过程通过每个段虚拟板的树脂注入孔到相应的一个或多个磁体插入部分; 以及在注入到所述一个或多个所述磁体插入部分中的树脂被固化之后，将多个模板与多余的树脂一起分离的第三过程。

6. 发明授权

US08273457B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
公开(公告)号：US08273457B2
公开(公告)日：2012-09-25
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

7. 发明授权

US08044524B2 Adhesive for connection of circuit member and semiconductor device using the same 失效
标题翻译：用于连接电路元件和使用其的半导体器件的粘合剂
公开(公告)号：US08044524B2
公开(公告)日：2011-10-25
申请号：US12500114
申请日：2009-07-09
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L29/40 , H01L23/29
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

8. 发明申请

US20110247873A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION 有权
公开(公告)号：US20110247873A1
公开(公告)日：2011-10-13
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo WATANABE , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： H05K1/11 , H05K13/04 , B32B37/14 , B32B37/10 , B32B37/12
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

9. 发明申请

US20110127667A1 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：用于连接电路部件和使用其的半导体器件的粘合剂
公开(公告)号：US20110127667A1
公开(公告)日：2011-06-02
申请号：US13023195
申请日：2011-02-08
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L23/48 , C08K3/18 , C08K3/34 , C08K3/38 , C09J163/00 , H01B1/20
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

10. 发明申请

US20110121447A1 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
公开(公告)号：US20110121447A1
公开(公告)日：2011-05-26
申请号：US13023208
申请日：2011-02-08
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L23/48 , C08K3/22 , C08K3/38 , C08K3/34 , C09J163/00 , H01B1/14
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式