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1. 发明授权

US07685556B2 Mask data correction method, photomask manufacturing method, computer program, optical image prediction method, resist pattern shape prediction method, and semiconductor device manufacturing method 失效
标题翻译：掩模数据校正方法，光掩模制造方法，计算机程序，光学图像预测方法，抗蚀剂图案形状预测方法和半导体器件制造方法
公开(公告)号：US07685556B2
公开(公告)日：2010-03-23
申请号：US11062437
申请日：2005-02-23
申请人： Kazuya Fukuhara , Daisuke Kawamura , Shoji Mimotogi
发明人： Kazuya Fukuhara , Daisuke Kawamura , Shoji Mimotogi
IPC分类号： G06F17/50
CPC分类号： G03F7/705 , G03F1/36 , G03F1/70 , G03F7/70133 , G03F7/70433
摘要： According to an aspect of the invention, there is provided a mask data correction method used when forming a photomask used in a photolithography process, comprising correcting mask data on the basis of simulation performed by using information including nonuniformity of an illumination luminance distribution in an exposure apparatus which uses the photomask formed by using the mask data obtained by the correction result.
摘要翻译：根据本发明的一个方面，提供了一种掩模数据校正方法，该方法在形成光刻工艺中使用的光掩模时使用，包括：基于通过使用包括曝光中的照度亮度分布的不均匀性的信息进行的模拟来校正掩模数据使用通过使用通过校正结果获得的掩模数据形成的光掩模的装置。

2. 发明申请

US20050188341A1 Mask data correction method, photomask manufacturing method, computer program, optical image prediction method, resist pattern shape prediction method, and semiconductor device manufacturing method 失效
标题翻译：掩模数据校正方法，光掩模制造方法，计算机程序，光学图像预测方法，抗蚀剂图案形状预测方法和半导体器件制造方法
公开(公告)号：US20050188341A1
公开(公告)日：2005-08-25
申请号：US11062437
申请日：2005-02-23
申请人： Kazuya Fukuhara , Daisuke Kawamura , Shoji Mimotogi
发明人： Kazuya Fukuhara , Daisuke Kawamura , Shoji Mimotogi
IPC分类号： G03F1/32 , G03F1/36 , G03F1/68 , G03F1/70 , G03F1/72 , G03F7/00 , G03F7/20 , G06F17/50 , H01L21/00 , H01L21/027
CPC分类号： G03F7/705 , G03F1/36 , G03F1/70 , G03F7/70133 , G03F7/70433
摘要： According to an aspect of the invention, there is provided a mask data correction method used when forming a photomask used in a photolithography process, comprising correcting mask data on the basis of simulation performed by using information including nonuniformity of an illumination luminance distribution in an exposure apparatus which uses the photomask formed by using the mask data obtained by the correction result.
摘要翻译：根据本发明的一个方面，提供了一种掩模数据校正方法，该方法在形成光刻工艺中使用的光掩模时使用，包括：基于通过使用包括曝光中的照度亮度分布的不均匀性的信息进行的模拟来校正掩模数据使用通过使用通过校正结果获得的掩模数据形成的光掩模的装置。

3. 发明授权

US08077292B2 Projection exposure method 失效
标题翻译：投影曝光法
公开(公告)号：US08077292B2
公开(公告)日：2011-12-13
申请号：US12395513
申请日：2009-02-27
申请人： Yosuke Kitamura , Masaki Satake , Shoji Mimotogi , Kazuya Fukuhara
发明人： Yosuke Kitamura , Masaki Satake , Shoji Mimotogi , Kazuya Fukuhara
IPC分类号： G03B27/52
CPC分类号： G03B27/42 , G03B27/72
摘要： A projection exposure method that projects the shape of a hole onto a wafer by projecting a diffracted light, which is produced by applying light to a mask having a pattern for forming a hole pattern, onto the wafer through a projection optical system for exposure, wherein, in a plane substantially perpendicular to an optical axis, the light applied to the mask has a first intensity distribution in which the intensity is higher in the vicinity of eight apexes of an octagon centered at the optical axis than in other areas, the mask has a plurality of first opening patterns are arranged in a rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis, and a plurality of second opening patterns are arranged in a face-centered rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis.
摘要翻译：一种投影曝光方法，其通过将通过将具有用于形成孔图案的图案的掩模施加光而产生的衍射光投射到晶片上的投影光学系统进行曝光，将衍射光投射到晶片上，其中在基本上垂直于光轴的平面中，施加到掩模的光具有第一强度分布，其中在光轴中心的八边形的八个顶点附近的强度比在其他区域中的强度高，掩模具有多个第一开口图案被布置成矩形格子构型，其具有平行于通过光轴的八边形的对角线的边，并且多个第二开口图案以面向中心的矩形格子构造布置，具有平行于八角形通过光轴。

4. 发明申请

US20050153540A1 Method of forming contact hole and method of manufacturing semiconductor device 失效
标题翻译：形成接触孔的方法和制造半导体器件的方法
公开(公告)号：US20050153540A1
公开(公告)日：2005-07-14
申请号：US10969996
申请日：2004-10-22
申请人： Shoji Mimotogi , Hiroko Nakamura , Kazuya Fukuhara , Satoshi Tanaka , Soichi Inoue
发明人： Shoji Mimotogi , Hiroko Nakamura , Kazuya Fukuhara , Satoshi Tanaka , Soichi Inoue
IPC分类号： G03F7/26 , G03F7/20 , H01L21/027 , H01L21/302 , H01L21/3065 , H01L21/461 , H01L21/4763 , H01L21/768
CPC分类号： G03F7/70425 , G03F7/70466 , H01L21/76816
摘要： A method of forming a contact hole on a substrate by using a projection aligner comprising a lighting system including a light source, an aperture, and a condenser lens, a photo mask on which light from the lighting system is incident, and a projection lens for projecting the light from the photo mask onto the substrate, comprises forming a first photosensitive resist film on the substrate; exposing the first photosensitive resist film by using a photo mask in which mask patterns are cyclically arranged in a first direction and a second direction which is orthogonal to the first direction and a first aperture having light transmission parts arranged symmetrically with respect to a center point in the first direction; developing the exposed first photosensitive resist film to form first lines and linear spaces; forming a second photosensitive resist film on the substrate; exposing the second photosensitive resist film by using the photo mask and a second aperture having light transmission parts arranged symmetrically with respect to a center point in the second direction; and developing the second photosensitive resist film to form second lines and linear spaces which are orthogonal to the first lines and linear spaces.
摘要翻译：一种通过使用包括光源，孔径和聚光透镜的照明系统的投影对准器在基板上形成接触孔的方法，来自照明系统的光入射的光掩模和用于将来自光掩模的光投射到基板上，包括在基板上形成第一光敏抗蚀剂膜; 通过使用掩模图案沿与第一方向正交的第一方向和第二方向循环布置的光掩模曝光第一光敏抗蚀剂膜，以及具有相对于中心点对称布置的光传输部分的第一孔第一个方向显影第一光敏抗蚀剂膜以形成第一线和线性空间; 在所述基板上形成第二光敏抗蚀剂膜; 通过使用光掩模曝光第二光敏抗蚀剂膜，并且具有相对于第二方向的中心点对称布置的透光部分的第二孔; 并显影第二光敏抗蚀剂膜以形成与第一线和线性空间正交的第二线和线性空间。

5. 发明申请

US20090244504A1 PROJECTION EXPOSURE METHOD 失效
标题翻译：投影曝光方法
公开(公告)号：US20090244504A1
公开(公告)日：2009-10-01
申请号：US12395513
申请日：2009-02-27
申请人： Yosuke Kitamura , Masaki Satake , Shoji Mimotogi , Kazuya Fukuhara
发明人： Yosuke Kitamura , Masaki Satake , Shoji Mimotogi , Kazuya Fukuhara
IPC分类号： G03B27/42 , G03B27/72
CPC分类号： G03B27/42 , G03B27/72
摘要： A projection exposure method that projects the shape of a hole onto a wafer by projecting a diffracted light, which is produced by applying light to a mask having a pattern for forming a hole pattern, onto the wafer through a projection optical system for exposure, wherein, in a plane substantially perpendicular to an optical axis, the light applied to the mask has a first intensity distribution in which the intensity is higher in the vicinity of eight apexes of an octagon centered at the optical axis than in other areas, the mask has a plurality of first opening patterns are arranged in a rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis, and a plurality of second opening patterns are arranged in a face-centered rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis.
摘要翻译：一种投影曝光方法，其通过将通过将具有用于形成孔图案的图案的掩模施加光而产生的衍射光投射到晶片上的投影光学系统进行曝光，将衍射光投射到晶片上，其中在基本上垂直于光轴的平面中，施加到掩模的光具有第一强度分布，其中在光轴中心的八边形的八个顶点附近的强度比在其它区域中的强度高，掩模具有多个第一开口图案被布置成矩形格子构型，其具有平行于通过光轴的八边形的对角线的边，并且多个第二开口图案以面向中心的矩形格子构造布置，具有平行于八角形通过光轴。

6. 发明授权

US07148138B2 Method of forming contact hole and method of manufacturing semiconductor device 失效
标题翻译：形成接触孔的方法和制造半导体器件的方法
公开(公告)号：US07148138B2
公开(公告)日：2006-12-12
申请号：US10969996
申请日：2004-10-22
申请人： Shoji Mimotogi , Hiroko Nakamura , Kazuya Fukuhara , Satoshi Tanaka , Soichi Inoue
发明人： Shoji Mimotogi , Hiroko Nakamura , Kazuya Fukuhara , Satoshi Tanaka , Soichi Inoue
IPC分类号： H01L21/4763
CPC分类号： G03F7/70425 , G03F7/70466 , H01L21/76816
摘要： A method of forming a contact hole on a substrate by using a projection aligner comprising a lighting system including a light source, an aperture, and a condenser lens, a photo mask on which light from the lighting system is incident, and a projection lens for projecting the light from the photo mask onto the substrate, comprises forming a first photosensitive resist film on the substrate; exposing the first photosensitive resist film by using a photo mask in which mask patterns are cyclically arranged in a first direction and a second direction which is orthogonal to the first direction and a first aperture having light transmission parts arranged symmetrically with respect to a center point in the first direction; developing the exposed first photosensitive resist film to form first lines and linear spaces; forming a second photosensitive resist film on the substrate; exposing the second photosensitive resist film by using the photo mask and a second aperture having light transmission parts arranged symmetrically with respect to a center point in the second direction; and developing the second photosensitive resist film to form second lines and linear spaces which are orthogonal to the first lines and linear spaces.
摘要翻译：一种通过使用包括光源，孔径和聚光透镜的照明系统的投影对准器在基板上形成接触孔的方法，来自照明系统的光入射的光掩模和用于将来自光掩模的光投射到基板上，包括在基板上形成第一光敏抗蚀剂膜; 通过使用掩模图案沿与第一方向正交的第一方向和第二方向循环布置的光掩模曝光第一光敏抗蚀剂膜，以及具有相对于中心点对称布置的光传输部分的第一孔第一个方向显影第一光敏抗蚀剂膜以形成第一线和线性空间; 在所述基板上形成第二光敏抗蚀剂膜; 通过使用光掩模曝光第二光敏抗蚀剂膜，并且具有相对于第二方向的中心点对称布置的透光部分的第二孔; 并显影第二光敏抗蚀剂膜以形成与第一线和线性空间正交的第二线和线性空间。

7. 发明申请

US20050183056A1 Simulator of lithography tool, simulation method, and computer program product for simulator 失效
标题翻译：光刻工具的模拟器，模拟方法，以及模拟器的计算机程序产品
公开(公告)号：US20050183056A1
公开(公告)日：2005-08-18
申请号：US11045296
申请日：2005-01-31
申请人： Shoji Mimotogi , Daisuke Kawamura , Akiko Yamada
发明人： Shoji Mimotogi , Daisuke Kawamura , Akiko Yamada
IPC分类号： G03F7/20 , G03C5/00 , G03F9/00 , G06F17/50 , H01L21/027
CPC分类号： G06F17/5009 , G03F7/70625
摘要： A simulator of a lithography tool includes a correcting parameter memory storing a correcting scaling value to correct a focus error of a projection optical system in the lithography tool and a correcting bias to correct a critical dimension error gene rated in the lithography tool. A model simulation engine simulates an image formation under a corrected focus calculated by multiplying a defocus of the projection optical system by the correcting scaling value to model a calculated critical dimension of an image. A bias corrector adds the correcting bias to the calculated critical dimension to correct the image.
摘要翻译：光刻工具的模拟器包括校正参数存储器，其存储校正缩放值以校正光刻工具中的投影光学系统的聚焦误差，以及校正偏差以校正光刻工具中评估的关键尺寸误差基因。模型仿真引擎模拟在通过将投影光学系统的散焦乘以校正缩放值计算的校正焦点下的图像形成，以对图像的计算临界尺寸进行建模。偏置校正器将校正偏差添加到计算的临界尺寸以校正图像。

8. 发明申请

US20050166172A1 Critical pattern extracting method, critical pattern extracting program, and method of manufacturing semiconductor device 审中-公开
标题翻译：关键模式提取方法，关键模式提取程序以及制造半导体器件的方法
公开(公告)号：US20050166172A1
公开(公告)日：2005-07-28
申请号：US11006532
申请日：2004-12-08
申请人： Daisuke Kawamura , Shigeki Nojima , Shoji Mimotogi
发明人： Daisuke Kawamura , Shigeki Nojima , Shoji Mimotogi
IPC分类号： G03F1/36 , G03F1/68 , G03F1/70 , G03F7/00 , G03F9/00 , G06F17/50 , H01L21/027
CPC分类号： G03F1/36
摘要： According to a aspect of the present invention, there is provided a critical pattern extracting method which extracts critical patterns from mask data for manufacturing a photomask used in a lithography step, comprising at least: extracting mask data of a peripheral region within a predetermined range from an interested portion to be decided in the mask data; defining portions constituting the peripheral region as reference portions and calculating process generation amounts generated from the each reference portion in the lithography step by simulation; performing a predetermined arithmetic operation by using the process generation amounts and distances between the interested portion and the each reference portion; performing multiple integral of an arithmetic operation value obtained by the predetermined arithmetic operation in the peripheral region or an arithmetic operation equivalent to the multiple integral to calculate a process affecter amount; and comparing the process affecter amount with a predetermined threshold value.
摘要翻译：根据本发明的一个方面，提供了一种临界图案提取方法，其从用于制造光刻步骤中使用的光掩模的掩模数据中提取临界图案，该方法至少包括：从预定范围内提取外围区域的掩模数据，在掩模数据中确定的感兴趣部分; 将构成周边区域的部分作为参考部分，并通过模拟计算从光刻步骤中的每个参考部分产生的处理生成量; 通过使用感兴趣部分和每个参考部分之间的处理产生量和距离来执行预定的算术运算; 执行通过周边区域中的预定算术运算获得的算术运算值的多项积分或与多项积分相当的算术运算来计算加工效果量; 以及将所述过程影响器量与预定阈值进行比较。

9. 发明授权

US07336341B2 Simulator of lithography tool for correcting focus error and critical dimension, simulation method for correcting focus error and critical dimension, and computer medium for storing computer program for simulator 失效
标题翻译：用于校正焦点误差和关键尺寸的光刻工具的模拟器，用于校正聚焦误差和关键尺寸的模拟方法，以及用于存储用于模拟器的计算机程序的计算机介质
公开(公告)号：US07336341B2
公开(公告)日：2008-02-26
申请号：US11045296
申请日：2005-01-31
申请人： Shoji Mimotogi , Daisuke Kawamura , Akiko Yamada
发明人： Shoji Mimotogi , Daisuke Kawamura , Akiko Yamada
IPC分类号： G03B27/68
CPC分类号： G06F17/5009 , G03F7/70625
摘要： A simulator of a lithography tool includes a correcting parameter memory storing a correcting scaling value to correct a focus error of a projection optical system in the lithography tool and a correcting bias to correct a critical dimension error generated in the lithography tool. A model simulation engine simulates an image formation under a corrected focus calculated by multiplying a defocus of the projection optical system by the correcting scaling value to model a calculated critical dimension of an image. A bias corrector adds the correcting bias to the calculated critical dimension to correct the image.
摘要翻译：光刻工具的模拟器包括存储校正缩放值以校正光刻工具中的投影光学系统的聚焦误差的校正参数存储器以及用于校正光刻工具中产生的临界尺寸误差的校正偏置。模型仿真引擎模拟在通过将投影光学系统的散焦乘以校正缩放值计算的校正焦点下的图像形成，以对图像的计算临界尺寸进行建模。偏置校正器将校正偏差添加到计算的临界尺寸以校正图像。

10. 发明授权

US08381138B2 Simulation model creating method, computer program product, and method of manufacturing a semiconductor device 有权
标题翻译：模拟模型创建方法，计算机程序产品和制造半导体器件的方法
公开(公告)号：US08381138B2
公开(公告)日：2013-02-19
申请号：US13420690
申请日：2012-03-15
申请人： Tetsuaki Matsunawa , Shoji Mimotogi , Masafumi Asano
发明人： Tetsuaki Matsunawa , Shoji Mimotogi , Masafumi Asano
IPC分类号： G06F17/50
CPC分类号： G03F7/705
摘要： According to a simulation model creating method of an embodiment, a resist pattern is formed by transferring a mask pattern on a first substrate with an exposing amount and a focus value being changed, and a line width of the resist pattern is measured. Next, measurement results which are not within an allowable change range due to an irregularity of the exposing amount, an irregularity of the focus value or pattern feature amount are removed. In addition, measurement results which are not with in an allowable change range due to an irregularity of the line width of the mask pattern are removed. Next, a simulation model is created by using measurement results which are not removed.
摘要翻译：根据实施例的模拟模型创建方法，通过以暴露量和焦点值改变在第一基板上转印掩模图案并且测量抗蚀剂图案的线宽来形成抗蚀剂图案。接下来，除去由于曝光量的不规则性，焦点值或图案特征量的不规则性而在允许的变化范围内的测量结果。此外，除去由于掩模图案的线宽的不规则性而在允许的变化范围内不具有的测量结果。接下来，通过使用未被去除的测量结果来创建模拟模型。

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