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    • 4. 发明申请
    • Critical pattern extracting method, critical pattern extracting program, and method of manufacturing semiconductor device
    • 关键模式提取方法,关键模式提取程序以及制造半导体器件的方法
    • US20050166172A1
    • 2005-07-28
    • US11006532
    • 2004-12-08
    • Daisuke KawamuraShigeki NojimaShoji Mimotogi
    • Daisuke KawamuraShigeki NojimaShoji Mimotogi
    • G03F1/36G03F1/68G03F1/70G03F7/00G03F9/00G06F17/50H01L21/027
    • G03F1/36
    • According to a aspect of the present invention, there is provided a critical pattern extracting method which extracts critical patterns from mask data for manufacturing a photomask used in a lithography step, comprising at least: extracting mask data of a peripheral region within a predetermined range from an interested portion to be decided in the mask data; defining portions constituting the peripheral region as reference portions and calculating process generation amounts generated from the each reference portion in the lithography step by simulation; performing a predetermined arithmetic operation by using the process generation amounts and distances between the interested portion and the each reference portion; performing multiple integral of an arithmetic operation value obtained by the predetermined arithmetic operation in the peripheral region or an arithmetic operation equivalent to the multiple integral to calculate a process affecter amount; and comparing the process affecter amount with a predetermined threshold value.
    • 根据本发明的一个方面,提供了一种临界图案提取方法,其从用于制造光刻步骤中使用的光掩模的掩模数据中提取临界图案,该方法至少包括:从预定范围内提取外围区域的掩模数据, 在掩模数据中确定的感兴趣部分; 将构成周边区域的部分作为参考部分,并通过模拟计算从光刻步骤中的每个参考部分产生的处理生成量; 通过使用感兴趣部分和每个参考部分之间的处理产生量和距离来执行预定的算术运算; 执行通过周边区域中的预定算术运算获得的算术运算值的多项积分或与多项积分相当的算术运算来计算加工效果量; 以及将所述过程影响器量与预定阈值进行比较。