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    • 1. 发明授权
    • Semiconductor device manufacturing method
    • 半导体器件制造方法
    • US08679731B2
    • 2014-03-25
    • US13606834
    • 2012-09-07
    • Kazuya FukuharaTakaki HashimotoKazuyuki MasukawaYasunobu Kai
    • Kazuya FukuharaTakaki HashimotoKazuyuki MasukawaYasunobu Kai
    • G03F7/20
    • G03F1/00G03F1/36G03F7/70433
    • A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.
    • 一种半导体器件制造方法,包括将照明光施加到光掩模,以及经由投影光学系统从光掩模投射衍射光成分,以在基板上形成光刻胶图案。 光掩模包括多个开口图案,其以在第二方向上的规则的第二间隔布置在多条平行线中的每一条上,并且在垂直于第二方向的第一方向上具有规则的第一间隔。 布置在多条平行线上相邻的多个平行线上的多个开口图案在第二方向上相互偏移第二间隔的一半。 此外,设置多个开口图案的尺寸和光掩模中的非透明区域的复振幅透射率,使得穿过投影光学系统的光瞳的三个衍射光分量具有相等的幅度。
    • 4. 发明授权
    • Exposure apparatus inspection mask and exposure apparatus inspection method
    • 曝光装置检查面罩和曝光装置检查方法
    • US08343692B2
    • 2013-01-01
    • US12886157
    • 2010-09-20
    • Nobuhiro KomineKazuya Fukuhara
    • Nobuhiro KomineKazuya Fukuhara
    • G03F1/38
    • G03F1/44G03F7/70641G03F7/70683
    • According to one embodiment, an exposure apparatus inspection mask includes a substrate and a first pattern portion. The substrate has a major surface reflective to exposure light. The first pattern portion is provided on the major surface. The first pattern portion includes a first lower layer and a plurality of first reflection layers. The first lower layer is provided on the major surface and includes a plurality of first absorption layers periodically arranged at a prescribed pitch along a first direction parallel to the major surface and is absorptive to the exposure light. The plurality of first reflection layers are provided on a side of the first lower layer opposite to the substrate, are periodically arranged at the pitch along the first direction, expose at least part of each of the plurality of first absorption layers, and have higher reflectance for the exposure light than the first absorption layers.
    • 根据一个实施例,曝光装置检查掩模包括基板和第一图案部分。 基板具有反射曝光光的主表面。 第一图案部分设置在主表面上。 第一图案部分包括第一下层和多个第一反射层。 第一下层设置在主表面上,并且包括沿着平行于主表面的第一方向以规定间距周期性地排列并且吸收曝光光的多个第一吸收层。 多个第一反射层设置在与基板相对的第一下层的一侧上,沿着第一方向以间距周期性地布置,暴露多个第一吸收层中的每一个的至少一部分,并且具有更高的反射率 用于曝光光比第一吸收层。
    • 7. 发明授权
    • Projection exposure method
    • 投影曝光法
    • US08077292B2
    • 2011-12-13
    • US12395513
    • 2009-02-27
    • Yosuke KitamuraMasaki SatakeShoji MimotogiKazuya Fukuhara
    • Yosuke KitamuraMasaki SatakeShoji MimotogiKazuya Fukuhara
    • G03B27/52
    • G03B27/42G03B27/72
    • A projection exposure method that projects the shape of a hole onto a wafer by projecting a diffracted light, which is produced by applying light to a mask having a pattern for forming a hole pattern, onto the wafer through a projection optical system for exposure, wherein, in a plane substantially perpendicular to an optical axis, the light applied to the mask has a first intensity distribution in which the intensity is higher in the vicinity of eight apexes of an octagon centered at the optical axis than in other areas, the mask has a plurality of first opening patterns are arranged in a rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis, and a plurality of second opening patterns are arranged in a face-centered rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis.
    • 一种投影曝光方法,其通过将通过将具有用于形成孔图案的图案的掩模施加光而产生的衍射光投射到晶片上的投影光学系统进行曝光,将衍射光投射到晶片上,其中 在基本上垂直于光轴的平面中,施加到掩模的光具有第一强度分布,其中在光轴中心的八边形的八个顶点附近的强度比在其他区域中的强度高,掩模具有 多个第一开口图案被布置成矩形格子构型,其具有平行于通过光轴的八边形的对角线的边,并且多个第二开口图案以面向中心的矩形格子构造布置,具有平行于 八角形通过光轴。
    • 9. 发明申请
    • EXPOSURE METHOD AND EXPOSURE SYSTEM
    • 曝光方法和曝光系统
    • US20100195069A1
    • 2010-08-05
    • US12696111
    • 2010-01-29
    • Kazuya FUKUHARA
    • Kazuya FUKUHARA
    • G03B27/68G03F7/20
    • G03B27/68G03F1/36G03F1/70G03F7/70441G03F7/705
    • An exposure method has acquiring first OPE (Optical Proximity Effect) error corresponding to a first and second transcriptional pattern portions formed by transcribing a first and second pattern portions of a mask pattern onto a substrate with an exposure apparatus, computing a first correction amount of an exposure condition, the first correction amount reducing the first OPE error, computing a best focus difference between the first transcriptional pattern portion and the second transcriptional pattern portion transcribed with the exposure apparatus to which the first correction amount is imparted, computing a second correction amount of a projection optical system of the exposure apparatus, the second correction amount reducing the best focus difference, acquiring second OPE error corresponding to the first and second transcriptional pattern portions transcribed with the exposure apparatus to which the first and second correction amounts are imparted, and performing exposure processing with the exposure apparatus using a mask comprising the mask pattern, the first correction amount and the second correction amount being imparted to the exposure apparatus, when the second OPE error is included in a predetermined range.
    • 曝光方法获得与通过用曝光装置将掩模图案的第一图案部分和第二图案部分转印到基板上形成的第一和第二转录图案部分相对应的第一OPE(光学近似效应)误差,计算第一校正量 曝光条件,第一校正量减小第一OPE误差,计算第一转录图案部分与被赋予第一校正量的曝光装置转录的第二转录图案部分之间的最佳聚焦差,计算第二校正量 曝光装置的投影光学系统,第二校正量减少最佳聚焦差异,获取与施加了第一和第二校正量的曝光装置转录的第一和第二转录图案部分相对应的第二OPE误差,并执行 曝光过程 当第二OPE误差被包括在预定范围内时,使用包括掩模图案的掩模的曝光装置施加第一校正量和第二校正量给曝光装置。