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    • 1. 发明授权
    • Apparatus for chemical mechanical polishing
    • 化学机械抛光装置
    • US5938884A
    • 1999-08-17
    • US900750
    • 1997-07-25
    • Jon A. HoshizakiRoger O. WilliamsJames D. BuhlerCharles A. ReichelWilliam K. HollywoodRichard de GeusLawrence L. Lee
    • Jon A. HoshizakiRoger O. WilliamsJames D. BuhlerCharles A. ReichelWilliam K. HollywoodRichard de GeusLawrence L. Lee
    • B24B7/24B24B37/04B24B37/10B24B37/30B24B37/32G05B19/18H01L21/304B24B37/00
    • B24B37/105B24B37/042B24B37/30B24B37/32B24B7/241G05B19/182G05B2219/43142G05B2219/45058G05B2219/45232
    • A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
    • 公开了一种用于抛光半导体晶片的表面的方法和装置。 晶片通过工具头保持在适当位置并且被研磨垫接触。 提供了一个桌子,研磨垫固定在该工作台上,两者都沿平行于待抛光晶片的表面的方向移动。 控制器根据预定的抛光图案控制工作台的运动,并且能够在晶片和研磨垫之间保持恒定的速度。 工具头包括圆形压板和围绕压板的外边缘周向定向的保持环,其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。 可调联接件安装到压板和环上,并且用于在抛光环相对于晶片表面的高度期间可调节地定位,并且在抛光保持环的位置期间刚性地支撑。 柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。 柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。
    • 3. 发明授权
    • Method for chemical mechanical polishing
    • 化学机械抛光方法
    • US5759918A
    • 1998-06-02
    • US689741
    • 1996-08-13
    • Jon A. HoshizakiRoger O. WilliamsJames D. BuhlerCharles A. ReichelWilliam K. HollywoodRichard de GeusLawrence L. Lee
    • Jon A. HoshizakiRoger O. WilliamsJames D. BuhlerCharles A. ReichelWilliam K. HollywoodRichard de GeusLawrence L. Lee
    • B24B7/24B24B37/04B24B37/10B24B37/30B24B37/32G05B19/18H01L21/304B24B1/00
    • B24B37/105B24B37/042B24B37/30B24B37/32B24B7/241G05B19/182G05B2219/43142G05B2219/45058G05B2219/45232
    • A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
    • 公开了一种用于抛光半导体晶片的表面的方法和装置。 晶片通过工具头保持在适当位置并且被研磨垫接触。 提供了一个桌子,研磨垫固定在该工作台上,两者都沿平行于待抛光晶片的表面的方向移动。 控制器根据预定的抛光图案控制工作台的运动,并且能够在晶片和研磨垫之间保持恒定的速度。 工具头包括圆形压板和围绕压板的外边缘周向定向的保持环,其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。 可调联接件安装到压板和环上,并且用于在抛光环相对于晶片表面的高度期间可调节地定位,并且在抛光保持环的位置期间刚性地支撑。 柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。 柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。
    • 5. 发明授权
    • Full surface texture collet system
    • 全表面纹理夹头系统
    • US5785324A
    • 1998-07-28
    • US694438
    • 1996-08-12
    • Roger O. WilliamsJon A. HoshizakiKevin C. Hursh
    • Roger O. WilliamsJon A. HoshizakiKevin C. Hursh
    • G11B17/028B23B31/40
    • G11B17/028G11B17/0281Y10T279/1008Y10T279/1083Y10T279/17521
    • A collet system for mounting, holding, and rotating a rigid disk is described, the collet system including a collet and an expander, the collet having a base portion and fingers longitudinally extending therefrom, the fingers forming a disk contact ring opposite the base. The disk contact ring is less than the thickness of the disk to allow for full surface texturization of the disk. The disk contact ring is not coplanar with any locus of expansion contact points between the collet fingers and the expander, and is sufficiently distant therefrom such that the outward force exerted on the inner disk surface is determined by a cantilever spring deflection experienced by the fingers. This ensures substantially uniform and repeatable outward forces on the inner surface of the disk regardless of minor surface variations along the locus of expansion contact points.
    • 描述了一种用于安装,保持和旋转刚性盘的夹头系统,夹头系统包括夹头和膨胀器,夹头具有基部和从其纵向延伸的指状物,指状物形成与基部相对的盘接触环。 磁盘接触环小于磁盘的厚度,以允许磁盘的全表面纹理化。 圆盘接触环与夹头和膨胀机之间的膨胀接触点的任何轨迹不共面,并且与其相距很远,使得施加在内盘表面上的向外的力由手指经历的悬臂弹簧偏转决定。 这确保了盘的内表面上的基本均匀和可重复的向外力,而不管沿着膨胀接触点的轨迹的小的表面变化。