专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5337144A Etch rate monitor using collimated light and method of using same 失效
标题翻译：蚀刻速率监视器使用准直光和使用方法
公开(公告)号：US5337144A
公开(公告)日：1994-08-09
申请号：US880464
申请日：1992-05-05
申请人： Bruno Strul , Richard de Geus , Peter Ebbing
发明人： Bruno Strul , Richard de Geus , Peter Ebbing
IPC分类号： G01B11/06 , G01B11/22 , G01B9/02
CPC分类号： G01B11/0683 , G01B11/22
摘要： An etch rate monitor for use with semiconductor wafer etching processes includes a source of light of normal incidence to the wafer surface through a window in the etching chamber. In a first embodiment, a Fresnel or positive lens is used to collect some of the diffraction orders caused by the repetitive patterns on the wafer surface which merge from the window. In alternate embodiments, a concave spherical mirror and/or a photodetector system are used to collect the diffraction orders. A collimating lens applies these diffraction orders of normal incidence to interference filters which reject plasma and ambient light and pass the diffraction orders to a photodetector to monitor etch rate as a function of the cycle period between interference minima or maxima caused by the difference in path length between the etched and not etched surfaces of the wafer.
摘要翻译：用于半导体晶片蚀刻工艺的蚀刻速率监视器包括通过蚀刻室中的窗口正常入射到晶片表面的光源。在第一实施例中，菲涅尔或正透镜用于收集由从窗口合并的晶片表面上的重复图案引起的一些衍射级。在替代实施例中，使用凹球面镜和/或光电检测器系统来收集衍射级。准直透镜将这些正常入射的衍射级应用于干涉滤光器，其干扰等离子体和环境光，并将衍射级传递到光电检测器，以将蚀刻速率作为由路径长度差导致的干扰最小值或最大值之间的周期周期的函数在晶片的蚀刻和未蚀刻的表面之间。

2. 发明授权

US5938884A Apparatus for chemical mechanical polishing 失效
标题翻译：化学机械抛光装置
公开(公告)号：US5938884A
公开(公告)日：1999-08-17
申请号：US900750
申请日：1997-07-25
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B37/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
摘要翻译：公开了一种用于抛光半导体晶片的表面的方法和装置。晶片通过工具头保持在适当位置并且被研磨垫接触。提供了一个桌子，研磨垫固定在该工作台上，两者都沿平行于待抛光晶片的表面的方向移动。控制器根据预定的抛光图案控制工作台的运动，并且能够在晶片和研磨垫之间保持恒定的速度。工具头包括圆形压板和围绕压板的外边缘周向定向的保持环，其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。可调联接件安装到压板和环上，并且用于在抛光环相对于晶片表面的高度期间可调节地定位，并且在抛光保持环的位置期间刚性地支撑。柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。

3. 发明授权

US5908530A Apparatus for chemical mechanical polishing 失效
标题翻译：化学机械抛光装置
公开(公告)号：US5908530A
公开(公告)日：1999-06-01
申请号：US443956
申请日：1995-05-18
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard De Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard De Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B37/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： An apparatus for polishing wafers, preferably by chemical mechanical polishing. The apparatus includes a table defining a planar polishing surface adapted to contain a polishing medium and a wafer carrier assembly adapted to hold a wafer against the polishing surface. The wafer carrier assembly includes a wafer carrier and prevents rotation of the wafer carrier with respect to the polishing table even when the wafer carrier is moved in a circular or orbital path on the polishing surface. Polishing is carried out relative movement between the wafer carrier and the polishing surface in any direction within the plane of the polishing surface. The relative movement can be accomplished by moving the wafer carrier, the polishing table, or a combination of movements of the wafer carrier and polishing table.
摘要翻译：优选通过化学机械抛光抛光晶片的装置。该装置包括限定适于容纳抛光介质的平面抛光表面和适于将晶片保持在抛光表面上的晶片载体组件的工作台。晶片载体组件包括晶片载体并且防止晶片载体相对于抛光台旋转，即使当晶片载体在抛光表面上以圆形或轨道路径移动时。抛光在抛光表面的平面内的任何方向上进行晶片载体和抛光表面之间的相对移动。可以通过移动晶片载体，抛光台或晶片载体和抛光台的运动的组合来实现相对运动。

4. 发明授权

US4595221A Disc transfer device 失效
标题翻译：光盘传输设备
公开(公告)号：US4595221A
公开(公告)日：1986-06-17
申请号：US658536
申请日：1984-10-09
申请人： Richard de Geus , James J. Grubish
发明人： Richard de Geus , James J. Grubish
IPC分类号： B66C1/28 , B25B9/00 , B65G7/12 , G11B23/00 , B66C1/30
CPC分类号： B25B9/00 , G11B23/00
摘要： A disc transfer device for the manipulation of hard discs without damage to the recording surfaces thereof. The device is manually operated and consists of a U-shaped handle adapted for fitting over a disc storage spindle. The handle includes two grippers made of a rigid and smooth yet soft material which will not damage the disc surfaces. One gripper is fixedly attached to one end of the handle, and the other gripper is attached to a pivotable arm affixed to the other end of the handle. A lever attached to the movable arm allows for moving the arm outwards to enable a disc to fit between the grippers. A spring biases the arm in the normally closed position.
摘要翻译：一种用于操纵硬盘而不损坏其记录表面的盘传送装置。该装置是手动操作的，并且由适于装配在盘存储主轴上的U形手柄组成。手柄包括由刚性光滑而柔软的材料制成的两个夹持器，其不会损坏盘表面。一个夹持器固定地附接到手柄的一端，另一个夹持器附接到固定到手柄另一端的可枢转臂。附接到可动臂的杠杆允许向外移动臂以使盘能够装配在夹具之间。弹簧将手臂偏置在常闭位置。

5. 发明授权

US5759918A Method for chemical mechanical polishing 失效
标题翻译：化学机械抛光方法
公开(公告)号：US5759918A
公开(公告)日：1998-06-02
申请号：US689741
申请日：1996-08-13
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B1/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
摘要翻译：公开了一种用于抛光半导体晶片的表面的方法和装置。晶片通过工具头保持在适当位置并且被研磨垫接触。提供了一个桌子，研磨垫固定在该工作台上，两者都沿平行于待抛光晶片的表面的方向移动。控制器根据预定的抛光图案控制工作台的运动，并且能够在晶片和研磨垫之间保持恒定的速度。工具头包括圆形压板和围绕压板的外边缘周向定向的保持环，其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。可调联接件安装到压板和环上，并且用于在抛光环相对于晶片表面的高度期间可调节地定位，并且在抛光保持环的位置期间刚性地支撑。柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式