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1. 发明授权

US5759918A Method for chemical mechanical polishing 失效
标题翻译：化学机械抛光方法
公开(公告)号：US5759918A
公开(公告)日：1998-06-02
申请号：US689741
申请日：1996-08-13
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B1/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
摘要翻译：公开了一种用于抛光半导体晶片的表面的方法和装置。晶片通过工具头保持在适当位置并且被研磨垫接触。提供了一个桌子，研磨垫固定在该工作台上，两者都沿平行于待抛光晶片的表面的方向移动。控制器根据预定的抛光图案控制工作台的运动，并且能够在晶片和研磨垫之间保持恒定的速度。工具头包括圆形压板和围绕压板的外边缘周向定向的保持环，其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。可调联接件安装到压板和环上，并且用于在抛光环相对于晶片表面的高度期间可调节地定位，并且在抛光保持环的位置期间刚性地支撑。柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。

2. 发明授权

US5141008A Dental floss applicator 失效
标题翻译：牙线牙膏
公开(公告)号：US5141008A
公开(公告)日：1992-08-25
申请号：US700752
申请日：1991-05-15
申请人： Lawrence L. Lee
发明人： Lawrence L. Lee
IPC分类号： A61C15/04
CPC分类号： A61C15/046
摘要： A dental floss applicator having an elongated body, a bow across which the floss is to be stretched, a storage area for a supply of floss, a supply capstan for drawing the floss out of the storage area, a take-up capstan for disposal of the used floss, an axle to support the supply and take-up capstans, and guides to guide the floss between the bow and the capstans. The supply and take-up capstans are coaxial and integrated into one piece so that they rotate together as one rigid-body around the axle. The supply capstan is smaller in diameter than the take-up capstan, therefore, as the capstans are turned to advance the floss they also stretch the floss to generate floss tension. The axle is an extension of the body; it is hollow and it supports the capstans from a direction along the capstans common axis, on the side of the supply capstan (away from the take-up capstan). The guide is also an extension of the body, reaching axially over the supply capstan to guide the floss to the take-up capstan. The body is also hollow, thus providing rigidity while not having any thick areas that would be expensive to mold out of plastic.
摘要翻译：一种具有细长主体的牙线涂抹器，用于将牙线拉伸的弓，用于供应牙线的储存区域，用于将牙线从存储区域拉出的供应绞盘，用于处理牙线的卷取绞盘使用的牙线，用于支撑供应和卷取绞盘的轴，以及引导引导弓和绞盘之间的牙线。供应和卷绕绞盘是同轴的并且集成成一体，使得它们作为一个刚体围绕轴旋转在一起。供应绞盘的直径小于卷取绞盘的直径，因此，当绞盘转动以推进牙线时，它们也拉伸牙线以产生牙线张力。车轴是车身的延伸线; 它是中空的，并且从供电绞盘（远离卷取绞盘）的一侧沿着绞盘公共轴线的方向支撑绞盘。引导件也是身体的延伸部分，轴向延伸到供应绞盘上以将牙线引导到卷取绞盘。身体也是中空的，因此提供刚性，而不具有从塑料模制成本昂贵的任何厚的区域。

3. 发明授权

US4903698A Pacifier strap and fastener for attachment to a garment 失效
标题翻译：用于连接到服装的安抚奶嘴和紧固件
公开(公告)号：US4903698A
公开(公告)日：1990-02-27
申请号：US325868
申请日：1989-03-20
申请人： Gloria L. Huber , Lawrence L. Lee
发明人： Gloria L. Huber , Lawrence L. Lee
IPC分类号： A61J9/06 , A61J17/00
CPC分类号： A61J9/06 , A61J17/001 , Y10T24/1397 , Y10T24/141
摘要： A tethering strap for a baby's pacifier, bottle or the like includes an elongated strap having an elastic button at one end for detachable attachment to a pacifier and a clamp and a slit at the other end for detachable attachment to the clothing of an infant.
摘要翻译：用于婴儿奶嘴，瓶子或类似物的束缚带包括在一端具有弹性按钮的细长带，用于可拆卸地连接到奶嘴和夹子以及在另一端的狭缝，用于可拆卸地附接到婴儿的衣服。

4. 发明授权

US4768502A Perforated splint 失效
标题翻译：穿孔夹板
公开(公告)号：US4768502A
公开(公告)日：1988-09-06
申请号：US832589
申请日：1986-02-25
申请人： Lawrence L. Lee
发明人： Lawrence L. Lee
IPC分类号： A61F5/058 , A61F5/04
CPC分类号： A61F5/05866
摘要： A splint for use with retaining straps to immobilize part of a limb comprising an elongated rigid sheet and a rigid collar. The sheet is formed into a shape to conform to the surface of one side of the part of the limb to be immobilized. The collar, which is attached to one end of the sheet, extends circumferentially more than halfway around the limb, grips the limb, and holds it in a fixed position relative to the sheet. Retaining straps are used at other positions along the sheet to hold the limb against the splint. In one embodiment, the splint is made of stainless steel, the sheet is formed of intersecting strips of stainless steel that are spotwelded together at intersection points to form a perforated sheet having large holes distributed throughout its area for ventilation and removal of water from the surface of the limb. The collar can be attached to the sheet in more than one orientations; one of these orientations allows the splint to fit a person's left limb, and another one of these orientations allows the splint to fit the person's right limb. Final adjustments of the splint are made by manually bending the sheet and the collar. The splint can be made to fit the limb so well that it is comfortable to wear in direct contact with the skin (without padding material) for extended periods of time.
摘要翻译：用于固定带的夹板以固定包括细长刚性片和刚性环的肢体的一部分。片材形成为与要固定的肢体部分的一侧的表面一致。附接到片材的一端的套环周向延伸超过肢体的一半，握住肢体，并将其保持在相对于片材的固定位置。保持带用于沿着片材的其他位置，以将肢体夹持在夹板上。在一个实施例中，夹板由不锈钢制成，片材由相交的不锈钢带形成，它们在交叉点处点焊在一起形成具有分布在其整个区域中的大孔的穿孔板，用于从表面通风和去除水的肢体。衣领可以多个方向连接到片材上; 这些方向之一允许夹板适合人的左肢，另外一个方向允许夹板适合人的右肢。夹板的最终调整是通过手动弯曲片材和衣领来进行的。夹板可以使其适合肢体，以使其与皮肤（无填充材料）直接接触很长时间佩戴舒适。

5. 外观设计

USD292668S Rope fastener 失效
公开(公告)号：USD292668S
公开(公告)日：1987-11-10
申请号：US729538
申请日：1985-05-02
申请人： Lawrence L. Lee
设计人： Lawrence L. Lee

6. 发明授权

US4283438A Method for individually encapsulating magnetic particles 失效
标题翻译：单独封装磁性颗粒的方法
公开(公告)号：US4283438A
公开(公告)日：1981-08-11
申请号：US106793
申请日：1979-12-26
申请人： Lawrence L. Lee
发明人： Lawrence L. Lee
IPC分类号： B01J13/04 , B05D3/14 , G09F9/37 , H01F1/113 , H01F1/44
CPC分类号： H01F1/44 , B01J13/04 , G09F9/375 , H01F1/113
摘要： A method for encapsulating magnetic particles by enclosure within oil drops, mixing in an aqueous solution and dispersing the oil drops with the enclosed particles by application of an alternating magnetic field. The dispersed and oil-covered particles are microencapsulated with at least one type of polymer.
摘要翻译：一种用于将磁性颗粒封装在油滴中的方法，在水溶液中混合并通过施加交变磁场将油滴与封闭的颗粒分散。分散的和油包覆的颗粒用至少一种类型的聚合物微囊化。

7. 发明授权

US06161274A Dynamoelectric machine and processes for making the same 失效
标题翻译：发电机和制程相同的过程
公开(公告)号：US06161274A
公开(公告)日：2000-12-19
申请号：US15583
申请日：1998-01-29
申请人： William H. Stark , Muhammad S. Malik , Lawrence L. Lee , Peter J. Klug , Arthur C. Keck
发明人： William H. Stark , Muhammad S. Malik , Lawrence L. Lee , Peter J. Klug , Arthur C. Keck
IPC分类号： H02K5/00 , H02K5/04 , H02K5/15 , H02K5/173 , H02K5/22 , H02K15/16 , H02K15/00 , H02K15/14
CPC分类号： H02K5/00 , H02K5/04 , H02K5/15 , H02K5/173 , H02K5/225 , H02K15/16 , Y10T29/49009 , Y10T29/49011 , Y10T29/49012 , Y10T29/4902 , Y10T29/49073
摘要： Disclosed are methods of making dynamoelectric machines which include use of two sheet metal cup-shaped members to form a housing that completely surrounds and encloses the stator. The stator is assembled with a can in such a manner that the core of the stator is completely contained within the can. Thereafter, a cap is positioned at the exposed face of the stator and the cap and can are joined together by a sheet metal fastening technique which displaces material from one superposed sheet into a second sheet of material. The can and cap are precision formed so that they will have precision sized and located bearing receivers and core retention regions. Both the cap and the can are provided with multiple flange locations which are utilized for fastening the can and cap together during the assembly process. The cap is also provided with a notch which accommodates a lead protecting grommet that preferably is held in place by one or more bosses or pins that are fastened in openings in still another flange formed on the can.
摘要翻译：公开了制造电动机的方法，其包括使用两个钣金杯形构件形成完全包围和封闭定子的壳体。定子以罐的方式组装，使得定子的芯完全容纳在罐内。此后，盖子定位在定子的暴露面上，并且盖子和罐体可以通过金属紧固技术连接在一起，该技术将材料从一个叠置的片材移位到第二片材料中。罐头和盖子精确地形成，使得它们将具有精确尺寸和位置的轴承接收器和芯保持区域。盖和罐均设有多个法兰位置，用于在组装过程中将罐和盖固定在一起。盖子还设置有一个槽口，该槽口容纳一个优先通过一个或多个凸起或销固定在适当位置上的引线保护索环，该凸台或销固定在形成在罐上的又一个凸缘中的开口中。

8. 发明授权

US6113479A Wafer carrier for chemical mechanical planarization polishing 失效
公开(公告)号：US6113479A
公开(公告)日：2000-09-05
申请号：US900184
申请日：1997-07-25
申请人： James Sinclair , Lawrence L. Lee
发明人： James Sinclair , Lawrence L. Lee
IPC分类号： B24B41/06 , B24B49/04 , B24B29/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/04
摘要： An apparatus, and particularly, a wafer carrier for polishing the face of a semiconductor wafer are provided. The wafer carrier forms a first cavity which can be pressure controlled to vary the shape of a face of a platen which contacts the wafer during polishing. A second cavity within the first cavity is provided. The second cavity can be independently pressure controlled to form a vacuum for holding the wafer against the platen surface or for forming a pressure stream to separate the wafer from the platen and/or to purge the holes in the surface of the platen. A non-contact displacement sensor capable of measuring a distance between the wafer carrier mount and the platen, may be provided. An endpoint detector capable of detecting a relative surface roughness of the wafer, to determine when the wafer has been sufficiently polished, may also be provided. A ring is peripherally located about an outer edge of the platen, and is mounted and positioned to resist lateral forces on the wafer during polishing. The ring is adjustably mounted so as to be variably and controllably vertically positioned, with respect to the wafer to help control standing waves in the polishing media and uneven polishing of the wafer surface.

9. 发明授权

US5938884A Apparatus for chemical mechanical polishing 失效
标题翻译：化学机械抛光装置
公开(公告)号：US5938884A
公开(公告)日：1999-08-17
申请号：US900750
申请日：1997-07-25
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B37/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
摘要翻译：公开了一种用于抛光半导体晶片的表面的方法和装置。晶片通过工具头保持在适当位置并且被研磨垫接触。提供了一个桌子，研磨垫固定在该工作台上，两者都沿平行于待抛光晶片的表面的方向移动。控制器根据预定的抛光图案控制工作台的运动，并且能够在晶片和研磨垫之间保持恒定的速度。工具头包括圆形压板和围绕压板的外边缘周向定向的保持环，其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。可调联接件安装到压板和环上，并且用于在抛光环相对于晶片表面的高度期间可调节地定位，并且在抛光保持环的位置期间刚性地支撑。柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。

10. 发明授权

US5908530A Apparatus for chemical mechanical polishing 失效
标题翻译：化学机械抛光装置
公开(公告)号：US5908530A
公开(公告)日：1999-06-01
申请号：US443956
申请日：1995-05-18
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard De Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard De Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B37/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： An apparatus for polishing wafers, preferably by chemical mechanical polishing. The apparatus includes a table defining a planar polishing surface adapted to contain a polishing medium and a wafer carrier assembly adapted to hold a wafer against the polishing surface. The wafer carrier assembly includes a wafer carrier and prevents rotation of the wafer carrier with respect to the polishing table even when the wafer carrier is moved in a circular or orbital path on the polishing surface. Polishing is carried out relative movement between the wafer carrier and the polishing surface in any direction within the plane of the polishing surface. The relative movement can be accomplished by moving the wafer carrier, the polishing table, or a combination of movements of the wafer carrier and polishing table.
摘要翻译：优选通过化学机械抛光抛光晶片的装置。该装置包括限定适于容纳抛光介质的平面抛光表面和适于将晶片保持在抛光表面上的晶片载体组件的工作台。晶片载体组件包括晶片载体并且防止晶片载体相对于抛光台旋转，即使当晶片载体在抛光表面上以圆形或轨道路径移动时。抛光在抛光表面的平面内的任何方向上进行晶片载体和抛光表面之间的相对移动。可以通过移动晶片载体，抛光台或晶片载体和抛光台的运动的组合来实现相对运动。

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