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1. 发明授权

US6006607A Piezoresistive pressure sensor with sculpted diaphragm 失效
标题翻译：压电式压力传感器，带雕刻膜片
公开(公告)号：US6006607A
公开(公告)日：1999-12-28
申请号：US144118
申请日：1998-08-31
申请人： Janusz Bryzek , David W. Burns , Sean S. Cahill , Steven S. Nasiri , James B. Starr
发明人： Janusz Bryzek , David W. Burns , Sean S. Cahill , Steven S. Nasiri , James B. Starr
IPC分类号： G01L9/00 , G01L9/06
CPC分类号： G01L9/0042 , G01L9/0054
摘要： The present invention is a semiconductor pressure sensor. In one embodiment, the semiconductor pressure sensor includes a diaphragm having a first thickness and at least cone raised boss that is coupled to a first side of the diaphragm. The at least one raised boss increases the diaphragm thickness in the region occupied by the at least one raised boss to a second thickness. A plurality of piezoresistors are disposed on a second side of the diaphragm in regions of the first thickness. In another embodiment, a semiconductor pressure sensor diaphragm includes at least one raised boss disposed along a central axis on a first side of the diaphragm. At least two raised bridge regions are disposed along the central axis, interconnecting the at least one raised boss and a diaphragm edge. Each raised bridge region is narrower than the raised boss. A plurality of piezoresistors are disposed on the raised bridge regions of the diaphragm along the central axis.
摘要翻译：本发明是半导体压力传感器。在一个实施例中，半导体压力传感器包括具有第一厚度和至少锥形凸起的隔膜，该凸起联接到隔膜的第一侧。所述至少一个凸起凸台将所述至少一个凸起凸起所占据的区域中的隔膜厚度增加到第二厚度。多个压电电阻器设置在第一厚度的区域中的隔膜的第二侧上。在另一个实施例中，半导体压力传感器膜片包括至少一个凸起的凸起部分，其沿着中心轴线设置在隔膜的第一侧上。至少两个凸起的桥接区域沿着中心轴线布置，将至少一个凸起的凸起和隔膜边缘互连。每个凸起的桥梁区域比凸起的凸起更窄。多个压电电阻器沿着中心轴设置在隔膜的凸起的桥接区域上。

2. 发明授权

US06351996B1 Hermetic packaging for semiconductor pressure sensors 有权
标题翻译：半导体压力传感器的气密封装
公开(公告)号：US06351996B1
公开(公告)日：2002-03-05
申请号：US09191718
申请日：1998-11-12
申请人： Steven S. Nasiri , David W. Burns , Janusz Bryzek , Sean S. Cahill
发明人： Steven S. Nasiri , David W. Burns , Janusz Bryzek , Sean S. Cahill
IPC分类号： G01L904
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084
摘要： A hermetic media interface for a sensor package is disclosed. Preferably, the hermetic media interface is incorporated into a pressure sensor package for interfacing directly to fluid and/or gaseous media. In one embodiment, the pressure sensor package includes a semiconductor die and a pressure port that are housed in a pre-molded plastic package. A eutectic solder is coupled between the semiconductor die and the pressure port to solder the same to the semiconductor die. The semiconductor die may be metallized to enhance solderability. In an alternative embodiment, the pressure port is made from one or more plastic materials and the pressure port is attached to the semiconductor die with an adhesive. An integral stress-isolation region may optionally be incorporated on the semiconductor die.
摘要翻译：公开了一种用于传感器封装的密封介质接口。优选地，密封介质界面结合到压力传感器封装中，用于直接与流体和/或气体介质接合。在一个实施例中，压力传感器封装包括容纳在预模制塑料封装中的半导体管芯和压力端口。共晶焊料耦合在半导体管芯和压力端口之间以将其焊接到半导体管芯。半导体管芯可以被金属化以增强可焊性。在替代实施例中，压力端口由一种或多种塑料材料制成，并且压力端口用粘合剂附接到半导体管芯。整体应力隔离区可任选地并入半导体管芯上。

3. 发明授权

US06346742B1 Chip-scale packaged pressure sensor 失效
标题翻译：芯片级封装压力传感器
公开(公告)号：US06346742B1
公开(公告)日：2002-02-12
申请号：US09190500
申请日：1998-11-12
申请人： Janusz Bryzek , David W. Burns , Sean S. Cahill , Steven S. Nasiri
发明人： Janusz Bryzek , David W. Burns , Sean S. Cahill , Steven S. Nasiri
IPC分类号： H01L2312
CPC分类号： G01L19/147 , G01L19/0038 , G01P2015/0828 , H01L2224/48091 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A chip-scale sensor package is described. In one embodiment, the chip-scale sensor package includes a semiconductor substrate having a sensor region, and a semiconductor cap having a recess. The semiconductor cap is bonded to the semiconductor substrate with a thermocompression bond to form a cavity therebetween. The semiconductor substrate is bonded to the semiconductor cap using different types of materials. The semiconductor substrate and/or the semiconductor cap may optionally include a semiconductor device such as an electronically trimmable integrated circuit fabricated thereon. In addition, the semiconductor substrate may optionally include an integral stress isolation flexible region for isolation of the sensor region.
摘要翻译：描述了芯片级传感器封装。在一个实施例中，芯片级传感器封装包括具有传感器区域的半导体衬底和具有凹部的半导体盖。半导体盖通过热压接合到半导体衬底上以在其间形成空腔。使用不同类型的材料将半导体衬底接合到半导体帽。半导体衬底和/或半导体帽可以可选地包括诸如其上制造的电子可调整体集成电路的半导体器件。此外，半导体衬底可以可选地包括用于隔离传感器区域的整体应力隔离柔性区域。

4. 发明授权

US06229190B1 Compensated semiconductor pressure sensor 有权
标题翻译：补偿半导体压力传感器
公开(公告)号：US06229190B1
公开(公告)日：2001-05-08
申请号：US09216073
申请日：1998-12-18
申请人： Janusz Bryzek , David W. Burns , Steven S. Nasiri , Sean S. Cahill
发明人： Janusz Bryzek , David W. Burns , Steven S. Nasiri , Sean S. Cahill
IPC分类号： H01L2982
CPC分类号： G01L19/147 , G01L9/0042 , G01L9/0054 , G01L19/0038 , G01L19/143 , G01P2015/084 , H01L2224/48091 , H01L2224/48247 , H01L2924/16151 , H01L2924/16195 , H01L2924/00014
摘要： A semiconductor pressure sensor compatible with fluid and gaseous media applications is described. The semiconductor pressure sensor includes a sensor capsule having a semiconductor die and a silicon cap that is bonded to the semiconductor die. The semiconductor die includes a diaphragm that incorporates piezoresistive sensors thereon, and a stress isolation mechanism for isolating the diaphragm from packaging and mounting stresses. The silicon cap includes a cavity for allowing the diaphragm to deflect. The semiconductor pressure sensor further includes a pressure port that is hermetically attached to the semiconductor die. The sensor capsule and pressure port may be incorporated into a plastic housing. In one embodiment, the silicon cap is bonded to the semiconductor die to form an integral pressure reference. In an alternative embodiment, a second pressure port is provided for allowing gage or differential pressure measurements. A technique for incorporating the piezoresistive sensors is also described. An ASIC may be optionally attached to the silicon cap, and/or active electronic circuitry may be fabricated on the semiconductor die or silicon cap. Additional coatings may be optionally applied to the pressure port and semiconductor die for enhancing chemical resistance.
摘要翻译：描述了与流体和气体介质应用相兼容的半导体压力传感器。半导体压力传感器包括具有半导体管芯和粘合到半导体管芯上的硅帽的传感器封装。半导体管芯包括在其上结合有压阻传感器的隔膜以及用于将隔膜与封装和安装应力隔离的应力隔离机构。硅帽包括用于允许隔膜偏转的空腔。半导体压力传感器还包括气密地附接到半导体管芯的压力端口。传感器胶囊和压力端口可以结合到塑料外壳中。在一个实施例中，硅帽结合到半导体管芯以形成整体的压力参考。在替代实施例中，提供了用于允许量规或差压测量的第二压力端口。还描述了一种用于结合压阻传感器的技术。 ASIC可以可选地附接到硅帽，和/或有源电子电路可以制造在半导体管芯或硅帽上。另外的涂层可以任选地施加到压力端口和半导体管芯上以提高耐化学性。

5. 发明授权

US06255728B1 Rigid encapsulation package for semiconductor devices 有权
标题翻译：用于半导体器件的刚性封装封装
公开(公告)号：US06255728B1
公开(公告)日：2001-07-03
申请号：US09232801
申请日：1999-01-15
申请人： Steven S. Nasiri , David W. Burns , Janusz Bryzek
发明人： Steven S. Nasiri , David W. Burns , Janusz Bryzek
IPC分类号： H01L2312
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084 , H01L2224/48091 , H01L2924/00014
摘要： A rigid encapsulation package for semiconductor sensors, actuators, and devices is described. In one embodiment, a semiconductor pressure sensor includes a sensor element having a deformable diaphragm for measurement of pressure, and a cap that includes a recess. The cap is attached to the sensor element to form a cavity therebetween. The pressure sensor further includes a leadframe, interconnecting bond wires, a pressure port that is coupled to the sensor element, and a nominally rigid material formed over the sensor element, cap, leadframe, and bond wires. The material may include one or more of the following: epoxy, RTV, resins, and gel. The sensor element may include a built-in stress isolation flexible region. A second pressure port may optionally be attached to the housing for providing differential or gage pressure measurements.
摘要翻译：描述了用于半导体传感器，致动器和装置的刚性封装封装。在一个实施例中，半导体压力传感器包括具有用于测量压力的可变形隔膜的传感器元件和包括凹部的盖。盖连接到传感器元件以在它们之间形成空腔。压力传感器还包括引线框架，互连接合线，耦合到传感器元件的压力端口，以及形成在传感器元件，盖子，引线框架和接合线上的标称刚性材料。该材料可以包括以下一种或多种：环氧树脂，RTV，树脂和凝胶。传感器元件可以包括内置的应力隔离柔性区域。可以可选地将第二压力端口附接到壳体以提供差压或量规压力测量。

6. 发明授权

US06636656B2 System architecture of optical switching fabric 失效
标题翻译：光交换结构体系结构
公开(公告)号：US06636656B2
公开(公告)日：2003-10-21
申请号：US10002310
申请日：2001-10-24
申请人： Cheng-Chung Huang , Steven S. Nasiri , Alex Harwit , Dmitry Vasily Bakin , Randall Brian Sprague , Janusz Bryzek
发明人： Cheng-Chung Huang , Steven S. Nasiri , Alex Harwit , Dmitry Vasily Bakin , Randall Brian Sprague , Janusz Bryzek
IPC分类号： G02B626
CPC分类号： G02B6/3512 , G02B6/359
摘要： An optical switching fabric enables an optical signal entering the device on any one of multiple input ports to be directed to any one of multiple output ports. The present optical switching fabrics include sensing and monitoring devices that permit precise initial calibration and continuous switch connection status monitoring and control. Light entering the switching fabric on an input port is reflected by one of a first set of individually controllable mirrors to one of a second set of individually controllable mirrors and then to a corresponding output port. The switching fabrics include control lasers and position sensing devices which provide output signals corresponding to the orientations of the mirrors. In addition, a subset of the input ports and output ports can be attached to monitor light sources and detectors for recalibration and control. Further, sensors for detecting the intensity of input signals, of signals that have been reflected by a mirror in the first set and by a mirror in the second set, and of signals backscattered from the output ports may be included.
摘要翻译：光交换结构使得能够将进入多个输入端口中的任何一个的设备的光信号引导到多个输出端口中的任何一个。本发明的光交换结构包括能够精确地进行初始校准和连续切换连接状态监视和控制的感测和监视设备。在输入端口上进入交换结构的光被第一组单独可控的反射镜中的一个反射到第二组单独可控的反射镜中的一个，然后到相应的输出端口。交换结构包括控制激光器和位置感测装置，其提供对应于反射镜取向的输出信号。此外，输入端口和输出端口的子集可以附加到监视光源和检测器上以进行重新校准和控制。此外，可以包括用于检测由第一组中的反射镜和第二组中的反射镜反射的信号的输入信号的强度的传感器和从输出端口反向散射的信号。

7. 发明授权

US08633049B2 Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom 有权
标题翻译：在晶片封装环境中制造Al / GE键合的方法和由其制造的产品
公开(公告)号：US08633049B2
公开(公告)日：2014-01-21
申请号：US13333580
申请日：2011-12-21
申请人： Steven S. Nasiri , Anthony F. Flannery, Jr.
发明人： Steven S. Nasiri , Anthony F. Flannery, Jr.
IPC分类号： H01L21/30 , H01L21/46 , H01L21/00 , H01L29/40
CPC分类号： B81C1/00238 , B23K20/023 , B81B3/0018 , B81B7/007 , B81B2203/0315 , B81B2207/012 , B81B2207/094 , B81C1/00269 , B81C3/001 , B81C2203/0118 , B81C2203/035 , B81C2203/038 , B81C2203/0792 , H01L21/187
摘要： A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
摘要翻译：公开了一种在两个基板之间将锗键合到铝以产生牢固的电气和机械接触的方法。铝 - 锗键具有以下独特的属性组合：（1）可形成气密封; （2）可用于在两个基板之间形成导电路径; （3）可以对其进行图案化，使得该导电路径被定位; （4）可以用作为标准铸造CMOS工艺的铝制成。这具有允许晶片级接合或封装而不向CMOS晶片添加任何附加工艺层的显着优点。

8. 发明授权

US07621183B2 X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging 有权
标题翻译： X-Y轴双质量音叉陀螺仪，具有垂直集成电子和晶片级密封包装
公开(公告)号：US07621183B2
公开(公告)日：2009-11-24
申请号：US12026533
申请日：2008-02-05
申请人： Joseph Seeger , Steven S. Nasiri , Alexander Castro
发明人： Joseph Seeger , Steven S. Nasiri , Alexander Castro
IPC分类号： G01C19/00 , G01P9/04
CPC分类号： G01C19/56 , G01C19/5712 , G01C19/5719 , G01C19/574
摘要： An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.
摘要翻译：角速度传感器具有横向设置在X-Y平面中并间接连接到框架的两个质量块。两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动为Z向反相振荡并测量角振荡幅度来感测传给框架。在优选实施例中，角速度传感器由体MEMS陀螺仪晶片，盖晶片和参考晶片制成。在另一优选实施例中，晶片组件提供了质量和周围环境之间的密封屏障。

9. 发明授权

US07258011B2 Multiple axis accelerometer 有权
公开(公告)号：US07258011B2
公开(公告)日：2007-08-21
申请号：US11285493
申请日：2005-11-21
申请人： Steven S. Nasiri , Joseph Seeger
发明人： Steven S. Nasiri , Joseph Seeger
IPC分类号： G01P15/125
CPC分类号： G01P15/18 , G01P1/023 , G01P15/0802 , G01P15/125 , G01P2015/082
摘要： A sensor for measuring acceleration in three mutually orthogonal axes, X, Y and Z is disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z, about by at least one linkage and is responsive to accelerations in the X, Y and Z directions. The sensor includes at least one paddle disposed in the sensing plane; and at least one pivot on the linkage. Finally, the sensor includes at least one electrode at the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the acceleration.

10. 发明授权

US06843574B2 Gimbaled micromechanical rotation system 失效
标题翻译：平衡式微机械旋转系统
公开(公告)号：US06843574B2
公开(公告)日：2005-01-18
申请号：US10225081
申请日：2002-08-20
申请人： James Starr , Mitchell J. Novack , Haesung Kwon , James H. Smith , Steven S. Nasiri
发明人： James Starr , Mitchell J. Novack , Haesung Kwon , James H. Smith , Steven S. Nasiri
IPC分类号： B81B3/00 , G02B6/35 , G02B26/08 , G02B7/182
CPC分类号： G02B6/3564 , B81B3/0062 , B81B2201/042 , G02B6/3512 , G02B6/3584 , G02B26/0833
摘要： The present invention is directed towards apparatuses for rotating a gimbaled platform with rotatable actuators. Gimbal springs comprised of component springs with compliant axes that intersect at a nonzero angle are coupled to the gimbaled platform. Preferably, the compliant axes of the component springs are oriented at an approximately 45 degree angle relative to the actuator rotation axes. Wraparound lever arms coupling the rotatable actuators with the gimbal springs serve to increase the leverage ratio, thereby permitting greater platform rotation for a given actuator rotation.
摘要翻译：本发明涉及用可旋转致动器旋转万向平台的装置。由具有与非零角度相交的柔性轴的分量弹簧组成的万向弹簧耦合到万向平台。优选地，组件弹簧的柔顺轴线相对于致动器旋转轴线定向成大致45度的角度。将可旋转致动器与万向弹簧联接的环绕杆臂用于增加杠杆比，从而允许给定致动器旋转更大的平台旋转。

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