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1. 发明授权

US09156673B2 Packaging to reduce stress on microelectromechanical systems 有权
标题翻译：包装以减轻微机电系统的压力
公开(公告)号：US09156673B2
公开(公告)日：2015-10-13
申请号：US13821586
申请日：2011-09-18
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： H01L23/495 , H01L21/00 , B81B3/00 , H01L29/84 , B81C1/00 , B81B7/00
CPC分类号： B81B3/0021 , B81B3/0072 , B81B7/0016 , B81B7/0051 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/0785 , H01L29/84 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/32145 , H01L2224/32245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit.
摘要翻译：一个示例包括集成电路，其包括设置在细长上的至少一个电互连，远离集成电路的主要部分延伸，以及包括振荡部分的微机电层，微机电层耦合到集成电路的主要部分。

2. 发明申请

US20130277773A1 THROUGH SILCON VIA WITH REDUCED SHUNT CAPACITANCE 有权
标题翻译：通过SILCON通过减少分流电容
公开(公告)号：US20130277773A1
公开(公告)日：2013-10-24
申请号：US13821612
申请日：2011-09-20
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： B81B3/00
CPC分类号： B81B3/0086 , B81B7/007 , B81B2201/0235 , B81B2207/096 , H01G7/06
摘要： This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can include a substrate having a pair of trenches separated in a horizontal direction by a portion of the substrate, wherein each trench of the pair of trenches includes first and second vertical layers including dielectric, the first and second vertical layers separated by a third vertical layer including polysilicon.
摘要翻译：本文件涉及具有减小的分流电容的通孔的微机电系统（MEMS）传感器的器件层的装置和方法。在一个示例中，器件层可以包括具有一对沟槽的衬底，该衬底具有沿着衬底的一部分在水平方向上分离的一对沟槽，其中该对沟槽的每个沟槽包括包括电介质的第一和第二垂直层，第一和第二垂直层由包括多晶硅的第三垂直层隔开。

3. 发明申请

US20130250532A1 MULTI-DIE MEMS PACKAGE 有权
公开(公告)号：US20130250532A1
公开(公告)日：2013-09-26
申请号：US13821609
申请日：2011-09-16
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： H05K1/18
CPC分类号： B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/07 , B81C1/0023 , H01L23/481 , H01L2224/131 , H01L2924/1461 , H05K1/18 , H01L2924/014 , H01L2924/00
摘要： This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.

4. 发明授权

US07260984B2 Power generation utilizing tire pressure changes 有权
标题翻译：发电利用轮胎压力变化
公开(公告)号：US07260984B2
公开(公告)日：2007-08-28
申请号：US11245485
申请日：2005-10-05
申请人： Shad Roundy , Janusz Bryzek , Curtis Ray , Michael Malaga , David L. Brown
发明人： Shad Roundy , Janusz Bryzek , Curtis Ray , Michael Malaga , David L. Brown
IPC分类号： B60C23/02
CPC分类号： B60C23/0411
摘要： A method of powering one or more electronic devices in a tire monitoring system using a tire pressure based energy scavenger is provided. With this method, a tire is rotated on a surface to generate pressure changes within the tire. These pressure changes are then converted into electrical energy with a transducer and the energy is stored. The electrical energy or stored electrical energy can then be used to power one or more electronic devices in a tire monitoring system, such as a tire pressure sensor, temperature sensor, acceleration profile sensor, and/or a tire wear monitor. A tire monitoring system with a tire pressure based energy scavenger is also provided.
摘要翻译：提供一种使用轮胎压力能量清除剂在轮胎监测系统中为一个或多个电子设备供电的方法。利用该方法，轮胎在表面上旋转以在轮胎内产生压力变化。然后，这些压力变化用换能器转换成电能并储存能量。然后可以使用电能或存储的电能来为轮胎监测系统中的一个或多个电子设备供电，例如轮胎压力传感器，温度传感器，加速度曲线传感器和/或轮胎磨损监测器。还提供了一种具有基于轮胎压力的能量清除剂的轮胎监测系统。

5. 发明申请

US20070125161A1 Integrated tire pressure sensor system 有权
标题翻译：综合轮胎压力传感器系统
公开(公告)号：US20070125161A1
公开(公告)日：2007-06-07
申请号：US11292946
申请日：2005-12-01
申请人： Janusz Bryzek , Curtis Ray , Brian Bircumshaw , Elizabeth Logan
发明人： Janusz Bryzek , Curtis Ray , Brian Bircumshaw , Elizabeth Logan
IPC分类号： B60C23/02
CPC分类号： B60C23/0408 , B81B3/0086 , B81B2201/0235 , B81B2201/0264 , B81B2207/015 , B81C2203/0118
摘要： The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator. Thus, the disclosed tire pressure sensor system is high in functionality, yet small in size.
摘要翻译：本发明提供一种轮胎压力传感器系统，其具有多种功能并被集成到小包装中。该系统包括一个或多个基于微机电系统（MEMS）的传感器，包括基于MEMS的压力传感器; 基于MEMS振荡器的无线信号发射机; 以及微控制器，其中微处理器由至少一个基于MEMS的传感器产生的数据控制至少一个基于MEMS的传感器，并且控制来自无线信号发射器的数据传输的编码和定时。优选地，基于MEMS的传感器，基于MEMS振荡器的无线信号发射器和微控制器集成到一个或多个封装中的一个或多个芯片上。该系统还优选地包括基于MEMS的运动传感器，低频（LF）接收器，基于IC的电压传感器，电压调节器，温度传感器和极化电压发生器。因此，所公开的轮胎压力传感器系统的功能性高，但体积小。

6. 发明授权

US06898341B2 Optical system for calibration and control of an optical fiber switch 失效
标题翻译：用于光纤开关校准和控制的光学系统
公开(公告)号：US06898341B2
公开(公告)日：2005-05-24
申请号：US09999610
申请日：2001-10-24
申请人： Cheng-Chung Huang , Steven Saeed Nasiri , Randall Brian Sprague , Alex Harwit , Dmitry Vasily Bakin , Janusz Bryzek
发明人： Cheng-Chung Huang , Steven Saeed Nasiri , Randall Brian Sprague , Alex Harwit , Dmitry Vasily Bakin , Janusz Bryzek
IPC分类号： G02B6/42 , G02B6/35 , G02B26/08 , H04Q3/52 , H04Q11/00 , G02B6/26
CPC分类号： H04Q11/0005 , G02B6/3546 , G02B6/3556 , G02B6/3586 , H04Q2011/0026 , H04Q2011/003 , H04Q2011/0037 , H04Q2011/0039 , H04Q2011/0049 , H04Q2011/0083
摘要： Methods of calibrating and operating optical switches as well as optical switches in which the orientations of mirrors are measured and controlled using control light beams and position sensing detectors are described. The present invention may provide high resolution control of a plurality of mirrors in an optical switch and thus allow the optical switch to cross-connect a large number of input and output ports with a low insertion loss.
摘要翻译：描述了使用控制光束和位置感测检测器来测量和控制光学开关以及光学开关的校准和操作的方法。本发明可以提供光开关中的多个反射镜的高分辨率控制，从而允许光开关以低插入损耗交叉连接大量输入和输出端口。

7. 发明授权

US06351996B1 Hermetic packaging for semiconductor pressure sensors 有权
标题翻译：半导体压力传感器的气密封装
公开(公告)号：US06351996B1
公开(公告)日：2002-03-05
申请号：US09191718
申请日：1998-11-12
申请人： Steven S. Nasiri , David W. Burns , Janusz Bryzek , Sean S. Cahill
发明人： Steven S. Nasiri , David W. Burns , Janusz Bryzek , Sean S. Cahill
IPC分类号： G01L904
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084
摘要： A hermetic media interface for a sensor package is disclosed. Preferably, the hermetic media interface is incorporated into a pressure sensor package for interfacing directly to fluid and/or gaseous media. In one embodiment, the pressure sensor package includes a semiconductor die and a pressure port that are housed in a pre-molded plastic package. A eutectic solder is coupled between the semiconductor die and the pressure port to solder the same to the semiconductor die. The semiconductor die may be metallized to enhance solderability. In an alternative embodiment, the pressure port is made from one or more plastic materials and the pressure port is attached to the semiconductor die with an adhesive. An integral stress-isolation region may optionally be incorporated on the semiconductor die.
摘要翻译：公开了一种用于传感器封装的密封介质接口。优选地，密封介质界面结合到压力传感器封装中，用于直接与流体和/或气体介质接合。在一个实施例中，压力传感器封装包括容纳在预模制塑料封装中的半导体管芯和压力端口。共晶焊料耦合在半导体管芯和压力端口之间以将其焊接到半导体管芯。半导体管芯可以被金属化以增强可焊性。在替代实施例中，压力端口由一种或多种塑料材料制成，并且压力端口用粘合剂附接到半导体管芯。整体应力隔离区可任选地并入半导体管芯上。

8. 发明授权

US5062302A Laminated semiconductor sensor with overpressure protection 失效
标题翻译：具有超压保护功能的层压半导体传感器
公开(公告)号：US5062302A
公开(公告)日：1991-11-05
申请号：US574387
申请日：1990-08-27
申请人： Kurt E. Petersen , Phillip W. Barth , Janusz Bryzek , Joseph R. Mallon, Jr.
发明人： Kurt E. Petersen , Phillip W. Barth , Janusz Bryzek , Joseph R. Mallon, Jr.
IPC分类号： G01L9/00 , G01L19/06
CPC分类号： G01L19/0618 , G01L19/0636 , G01L9/0042 , G01L9/0054 , G01L9/0073 , Y10S73/04
摘要： An electromechanical sensor is provided which comprises: first semiconductor wafer including a first stop surface residing in a first shallow recessed region of the first wafer; a second semiconductor wafer; wherein the first and second semiconductor wafers are laminated together such that the first recessed region of the first wafer and the second wafer define a first chamber in which the first stop surface and the second wafer are disposed close enough together such that the first stop surface restrains the second wafer from deflecting beyond the first stop surface; and an apparatus for measuring deflection of the second wafer.
摘要翻译：提供了一种机电传感器，其包括：第一半导体晶片，其包括位于第一晶片的第一浅凹陷区域中的第一停止表面; 第二半导体晶片; 其中所述第一和第二半导体晶片被层压在一起，使得所述第一晶片和所述第二晶片的所述第一凹陷区域限定第一室，其中所述第一止动表面和所述第二晶片被设置得足够靠近在一起，使得所述第一止动表面限制所述第二晶片从所述第一止动表面偏转; 以及用于测量第二晶片的偏转的装置。

9. 发明授权

US4879903A Three part low cost sensor housing 失效
标题翻译：三部件低成本传感器外壳
公开(公告)号：US4879903A
公开(公告)日：1989-11-14
申请号：US241030
申请日：1988-09-02
申请人： Jeffery E. Ramsey , Janusz Bryzek , Joseph R. Mallon, Jr.
发明人： Jeffery E. Ramsey , Janusz Bryzek , Joseph R. Mallon, Jr.
IPC分类号： G01L9/00
CPC分类号： G01L19/0084 , G01L19/142 , Y10S73/04 , Y10T29/49103
摘要： A pressure measurement apparatus is provided which comprises: a housing formed from a thermoplastic material and defining a chamber, the housing including an upper wall region and a lower wall region and first and second opposed side-wall regions disposed between the upper and lower wall regions, the upper wall region including first and second vent ports formed therein; a semiconductor pressure transducer mounted within the chamber, the pressure transducer including a first surface in communication with the first vent port and including a second surface in communication with the second vent port; at least one first pin terminal extending through the first side-wall region, the at least one first pin terminal including a short segment within the chamber and an elongated segment outside the chamber; and at least one second pin terminal extending through the second side-wall region, the at least one second pin terminal including a short segment within the chamber and an elongated segment outside the chamber.
摘要翻译：提供了一种压力测量装置，其包括：由热塑性材料形成并限定腔室的壳体，所述壳体包括上壁区域和下壁区域以及设置在上壁区域和下壁区域之间的第一和第二相对侧壁区域所述上壁区域包括形成在其中的第一和第二排气口; 安装在所述腔室内的半导体压力传感器，所述压力传感器包括与所述第一通气口连通的第一表面，并且包括与所述第二通气口连通的第二表面; 延伸穿过第一侧壁区域的至少一个第一引脚端子，所述至少一个第一引脚端子包括在该腔室内的短段和在腔室外部的细长段; 以及延伸穿过所述第二侧壁区域的至少一个第二销端子，所述至少一个第二销端子包括所述室内的短段和所述室外的细长段。

10. 发明授权

US10065851B2 Microelectromechanical pressure sensor including reference capacitor 有权
公开(公告)号：US10065851B2
公开(公告)日：2018-09-04
申请号：US13821598
申请日：2011-09-20
申请人： Janusz Bryzek
发明人： Janusz Bryzek
IPC分类号： B81B3/00 , B81C1/00 , G01L9/00 , G01L19/04
摘要： This document discusses, among other things, an apparatus including a silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a top silicon die port extending from the silicon die top through the silicon die to a top of the vibratory diaphragm, and with a bottom silicon die port extending from the silicon die bottom to a bottom of the vibratory diaphragm, wherein the bottom silicon die port has a cross sectional area that is larger than a cross-sectional area of the top silicon die port, a capacitor electrode disposed along a bottom of the silicon die, across the bottom silicon die port, the capacitor electrode including a first signal generation portion that is coextensive with the top silicon die port, and a second signal generation portion surrounding the first portion.

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