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1. 发明授权

US5600520A Laminated magnetic head core 失效
标题翻译：层压磁头芯
公开(公告)号：US5600520A
公开(公告)日：1997-02-04
申请号：US441947
申请日：1995-05-16
申请人： Isamu Aokura , Kumio Nago , Hitoshi Yamanishi , Hiroshi Sakakima , Youichi Ohnishi
发明人： Isamu Aokura , Kumio Nago , Hitoshi Yamanishi , Hiroshi Sakakima , Youichi Ohnishi
IPC分类号： G11B5/31 , G11B5/127 , G11B5/147 , H01F10/14
CPC分类号： G11B5/147 , G11B5/3116 , Y10S428/90 , Y10T428/1129 , Y10T428/24975 , Y10T428/265
摘要： In a laminated magnetic head core, Fe--M--N system soft magnetic thin films (M being at least one element selected from the group consisting of Ta, Nb, Zr, and Hf) and non-magnetic insulating films are alternately laminated. Each of the soft magnetic thin films is 0.2-10 .mu.m thick. Each of the non-magnetic insulating films is 10 through 1000 nm thick. One of the soft magnetic thin films shows high magnetic permeability in a different direction from that of an adjacent soft magnetic thin film via the non-magnetic insulating film within a film surface of the soft magnetic thin film.
摘要翻译：在层叠磁头芯中，交替层叠Fe-M-N系软磁薄膜（M为选自Ta，Nb，Zr和Hf中的至少一种元素）和非磁性绝缘膜。每个软磁薄膜的厚度为0.2-10μm。每个非磁性绝缘膜的厚度为10〜1000nm。一个软磁性薄膜通过软磁性薄膜的膜表面内的非磁性绝缘膜，在与相邻的软磁性薄膜的方向不同的方向上表现出高的磁导率。

2. 发明授权

US5403457A Method for making soft magnetic film 失效
标题翻译：制造软磁膜的方法
公开(公告)号：US5403457A
公开(公告)日：1995-04-04
申请号：US111055
申请日：1993-08-24
申请人： Kumio Nago , Isamu Aokura , Hitoshi Yamanishi , Koichi Osano , Hiroshi Sakakima , Toshiyuki Suemitsu
发明人： Kumio Nago , Isamu Aokura , Hitoshi Yamanishi , Koichi Osano , Hiroshi Sakakima , Toshiyuki Suemitsu
IPC分类号： G11B5/147 , H01F41/18 , H01F41/30 , C23C14/35 , G11B5/127
CPC分类号： B82Y25/00 , B82Y40/00 , G11B5/147 , H01F41/18 , H01F41/302 , Y10T29/49034
摘要： The method of the invention provides a soft magnetic film having a high saturation magnetic flux density and an anisotropy of high magnetic permeability suitable for use in various types of magnetic heads at a high production yield by use of a sputtering apparatus provided with a sputtering electrode, which has permanent magnets arranged above a target 1 mainly of Fe or Co in such a way that lines of magnetic force 3 generated by said permanent magnets are in parallel to the surface of said target 1 and to the center line of said target 1 and have a magnetic strength pattern symmetric with respect to said center line while the lines of magnetic force to the right of said center line are of a reverse direction to those to the left of said center line.
摘要翻译：本发明的方法通过使用具有溅射电极的溅射装置，提供了一种具有高饱和磁通密度和高磁导率的各向异性的软磁性膜，其适用于各种类型的磁头，以高产率生产，其具有主要以Fe或Co布置在目标1上方的永磁体，使得由所述永磁体产生的磁力线3平行于所述目标1的表面和所述目标1的中心线并且具有相对于所述中心线对称的磁强度图案，而所述中心线右侧的磁力线与所述中心线左侧的磁力线相反。

3. 发明授权

US5609739A Sputtering apparatus 失效
标题翻译：溅射装置
公开(公告)号：US5609739A
公开(公告)日：1997-03-11
申请号：US362778
申请日：1994-12-23
申请人： Isamu Aokura , Hitoshi Yamanishi , Youichi Ohnishi , Tanejiro Ikeda
发明人： Isamu Aokura , Hitoshi Yamanishi , Youichi Ohnishi , Tanejiro Ikeda
IPC分类号： C23C14/35 , H01J37/34 , C23C14/34
CPC分类号： H01J37/3426 , H01J37/3408 , H01J37/3452
摘要： A sputtering apparatus for performing sputtering operation by using a rectangular target made of ferromagnetic material, the apparatus includes an electrode in which one first permanent magnet is disposed on each side edge of a front surface of the target, polarities of the first magnets confronting each other with the target interposed between the first magnets are opposite to each other, one second permanent magnet is disposed on each side edge of a rear surface of the target, polarities of the second magnets confronting each other with the target interposed between the second magnets are opposite to each other, and the polarity of each second magnet disposed on the rear surface of the target is the same as that of the first magnet disposed on the front surface of the target.
摘要翻译：一种用于通过使用由铁磁材料制成的矩形靶进行溅射操作的溅射装置，该装置包括：电极，其中一个第一永磁体设置在靶的前表面的每个侧边缘上，第一磁体彼此面对的极性夹在第一磁体之间的目标彼此相对，在目标的后表面的每个侧边缘上设置一个第二永磁体，并且夹在第二磁体之间的目标彼此面对的第二磁体的极性相反并且设置在靶的后表面上的每个第二磁体的极性与设置在靶的前表面上的第一磁体的极性相同。

4. 发明授权

US5512156A Sputtering electrode 失效
标题翻译：溅射电极
公开(公告)号：US5512156A
公开(公告)日：1996-04-30
申请号：US265019
申请日：1994-06-24
申请人： Hitoshi Yamanishi , Isamu Aokura , Toshiyuki Suemitsu , Takahiro Takisawa
发明人： Hitoshi Yamanishi , Isamu Aokura , Toshiyuki Suemitsu , Takahiro Takisawa
IPC分类号： C23C14/35 , H01J37/34
CPC分类号： H01J37/3455 , C23C14/35 , H01J37/3408
摘要： A magnetron sputtering electrode assembly which is used in a sputtering system having a rectangular flat-plate target, includes permanent magnets arranged along the longitudinal edges of the target to pass lines of magnetic forces in parallel to the surface of the rectangular flat-plate target, and a driving device for reversing polarity of the magnets to change by 180 degrees the direction of the lines of magnetic force caused by the permanent magnets passing in parallel to the surface of the rectangular flat-plate target.
摘要翻译：在具有矩形平板靶的溅射系统中使用的磁控溅射电极组件包括沿着靶的纵向边缘布置的永磁体，以平行于矩形平板靶的表面传递磁力线，以及驱动装置，用于使磁铁的极性反转，使永磁体平行于矩形平板靶的表面产生的磁力线的方向变化180度。

5. 发明授权

US5917682A Magnetic head and manufacturing method therefor 失效
标题翻译：磁头及其制造方法
公开(公告)号：US5917682A
公开(公告)日：1999-06-29
申请号：US925385
申请日：1997-09-08
申请人： Hitoshi Yamanishi , Isamu Aokura , Koichi Osano , Yasushi Inoue , Fumio Sakai
发明人： Hitoshi Yamanishi , Isamu Aokura , Koichi Osano , Yasushi Inoue , Fumio Sakai
IPC分类号： G11B5/187 , G11B5/31 , G11B5/40 , G11B5/23
CPC分类号： G11B5/1878 , G11B5/314 , G11B5/40 , Y10T428/115
摘要： A magnetic head includes a back core made of ferrite and a magnetic alloy film arranged in a vicinity of a magnetic gap and having an average composition expressed by TxMyNz wherein T is Fe or Co; M is at least one metal selected from a group consisting of Nb, Zr, Ta, Hf, Cr, W and Mo; N is nitrogen; and x, y and z are atomic percentages holding 65.ltoreq.x.ltoreq.94, 5.ltoreq.y.ltoreq.25, 0
摘要翻译：磁头包括由铁氧体制成的背芯和布置在磁隙附近的具有由TxMyNz表示的平均组成的磁性合金膜，其中T是Fe或Co; M是选自Nb，Zr，Ta，Hf，Cr，W和Mo中的至少一种金属; N是氮; 而x，y和z是保持65

6. 发明授权

US5626727A Sputtering apparatus and method 失效
标题翻译：溅射装置和方法
公开(公告)号：US5626727A
公开(公告)日：1997-05-06
申请号：US504516
申请日：1995-07-20
申请人： Hitoshi Yamanishi , Isamu Aokura , Masahide Yokoyama , Takahiro Takisawa
发明人： Hitoshi Yamanishi , Isamu Aokura , Masahide Yokoyama , Takahiro Takisawa
IPC分类号： C23C14/34 , C23C14/35 , H01J37/34 , H01L21/203
CPC分类号： H01J37/347 , H01J37/3405
摘要： A sputtering apparatus uses a plurality of rectangular targets to form a thin film on a substrate, and includes a plurality of magnets disposed along both side edges of each target in such a manner that the polarities of adjacent magnets along the side edges of the targets are opposite, and polarities of the magnets confronting each other across the targets are opposite. The surfaces of at least two targets are inclined to a surface of the substrate at an angle not smaller than 30.degree. and not larger than 60.degree..
摘要翻译：溅射装置使用多个矩形目标在基板上形成薄膜，并且包括沿着目标的两个侧边缘设置的多个磁体，使得沿着靶的侧边缘的相邻磁体的极性为相反的，并且彼此面对的磁体的极性相反。至少两个靶的表面以不小于30°并且不大于60°的角度倾斜到基底的表面。

7. 发明授权

US07728429B2 Semiconductor device having recessed connector portions 有权
标题翻译：具有凹入连接器部分的半导体器件
公开(公告)号：US07728429B2
公开(公告)日：2010-06-01
申请号：US11826673
申请日：2007-07-17
申请人： Isamu Aokura , Toshiyuki Fukuda , Yukitoshi Ota , Keiji Miki
发明人： Isamu Aokura , Toshiyuki Fukuda , Yukitoshi Ota , Keiji Miki
IPC分类号： H01L23/495
CPC分类号： H01L24/81 , H01L23/13 , H01L23/49816 , H01L23/5386 , H01L24/16 , H01L25/0655 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/10175 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/45124 , H01L2224/48465 , H01L2224/49171 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/157 , H01L2924/19107 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device in accordance with the present invention includes IC chips (semiconductor elements) (2, 3, 4) having solder bumps (24) (projecting electrodes) formed on electrode pads, and a first wiring board (1) having connection terminals (7) to which the respective solder bumps (24) of the IC chips (2, 3, 4) are connected, external connection terminals (8) for connection to an external apparatus, and conductor wires (9) provided in respective groove portions formed in a board surface and connected to the respective connection terminals (7). In spite of the reduced pitch of the conductor wires (9), the presence of the groove portions enables an increase in cross section, allowing a reduction in wiring resistance.
摘要翻译：根据本发明的半导体器件包括在电极焊盘上形成有焊料凸点（24）（突出电极）的IC芯片（半导体元件）（2,3,4）和具有连接端子的第一布线板（1） 7），IC芯片（2,3,4）的各个焊料凸块（24）连接到其上，用于连接到外部设备的外部连接端子（8）和形成在各个槽部分中的导线（9）在板表面上并连接到相应的连接端子（7）。尽管导体线（9）的间距减小，但是沟槽部分的存在使得横截面增加，从而允许降低布线电阻。

8. 发明申请

US20050036057A1 Image pickup device integrated with lens, method and apparatus for manufacturing the same 审中-公开
标题翻译：与其制造的镜头，方法和装置集成的图像拾取装置
公开(公告)号：US20050036057A1
公开(公告)日：2005-02-17
申请号：US10898522
申请日：2004-07-23
申请人： Kazuya Ushirokawa , Isamu Aokura , Koujirou Nakamura , Hidenobu Nishikawa , Tomonori Itoh
发明人： Kazuya Ushirokawa , Isamu Aokura , Koujirou Nakamura , Hidenobu Nishikawa , Tomonori Itoh
IPC分类号： H04N5/225
CPC分类号： H04N5/2254
摘要： The present invention of a manufacturing method and a apparatus for manufacturing an image pickup device integrated with lens in which a lens holding part having an optical lens is automatically adjusted with respect to a package on which an imaging chip is mounted so that an optical image from an optical axis adjusting pattern is formed on the image plane of the imaging chip and the lens holding part and the package are fixed to each other with an adhesive used therebetween as a position adjusting member at the adjusted position, and an image pickup device integrated with lens thus manufactured having excellent properties.
摘要翻译：本发明的一种制造方法和用于制造与透镜一体化的图像拾取装置的装置，其中具有光学透镜的透镜保持部分相对于其上安装有成像芯片的封装被自动调整，使得来自在成像芯片的图像平面上形成光轴调整图案，并且透镜保持部分和包装件之间用粘合剂彼此固定，作为调节位置处的位置调整部件，并且将图像拾取装置与由此制造的具有优异性能的透镜。

9. 发明申请

US20080099891A1 Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20080099891A1
公开(公告)日：2008-05-01
申请号：US11898502
申请日：2007-09-12
申请人： Yutaka Kato , Hiroaki Suzuki , Naoto Ueda , Isamu Aokura , Takayuki Yoshida , Takuma Motofuji
发明人： Yutaka Kato , Hiroaki Suzuki , Naoto Ueda , Isamu Aokura , Takayuki Yoshida , Takuma Motofuji
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/3128 , H01L21/56 , H01L23/3677 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/16251 , H01L2924/181 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device including: a semiconductor element 1, a heat conductor 91 opposed to the main surface of the semiconductor element 1, and a sealing resin 6 for sealing at least a part of the semiconductor element 1 and a part of the heat conductor 91, the heat conductor 91 having a surface partially exposed from the sealing resin 6 to the outside, the surface being opposite to the other surface facing the main surface of the semiconductor element 1, wherein the semiconductor device further includes an opening 11 penetrating in the thickness direction on a part of the surface including an exposed part of the heat conductor 91. Since resin can be injected from the opening 11 facing the main surface of the semiconductor element 1, the quality can be stabilized.
摘要翻译：一种半导体器件，包括：半导体元件1，与半导体元件1的主表面相对的热导体91和用于密封半导体元件1的至少一部分和热导体91的一部分的密封树脂6，具有从密封树脂6部分地露出到外部的表面与面向半导体元件1的主表面的另一表面相对的表面的热导体91，其中半导体器件还包括沿厚度方向穿透的开口11 在包括热导体91的暴露部分的表面的一部分上。由于树脂可以从面向半导体元件1的主表面的开口11注入，所以可以使质量稳定。

10. 发明授权

US06342139B1 Sputtering system 失效
标题翻译：溅射系统
公开(公告)号：US06342139B1
公开(公告)日：2002-01-29
申请号：US09495293
申请日：2000-02-01
申请人： Isamu Aokura , Tomohiro Okumura , Naoki Suzuki
发明人： Isamu Aokura , Tomohiro Okumura , Naoki Suzuki
IPC分类号： C23C1435
CPC分类号： H01J37/321 , C23C14/358 , H01J37/3408
摘要： A sputtering system includes a vacuum chamber, a sputtering electrode provided in the vacuum chamber, a target supported on the sputtering electrode with a front surface of the target and a substrate disposed in the vacuum chamber so as to be opposed to each other. A high-frequency or DC power source supplies a high-frequency or DC power to the sputtering electrode to generate plasma on the target, and an antenna is provided for generating an electromagnetic wave and is disposed outside the vacuum chamber and near the target. An electromagnetic-wave inlet window for introducing into the vacuum chamber an electromagnetic wave generated from the antenna is provided in a wall of the vacuum chamber.
摘要翻译：溅射系统包括真空室，设置在真空室中的溅射电极，具有靶的前表面的溅射电极上支撑的靶和设置在真空室中的基板以彼此相对。高频或直流电源向溅射电极提供高频或直流电力，以在目标上产生等离子体，并且提供用于产生电磁波的天线，并设置在真空室外部和靶附近。在真空室的壁上设置有用于将从天线产生的电磁波引入真空室的电磁波入口窗口。

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