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1. 发明申请

US20050036057A1 Image pickup device integrated with lens, method and apparatus for manufacturing the same 审中-公开
标题翻译：与其制造的镜头，方法和装置集成的图像拾取装置
公开(公告)号：US20050036057A1
公开(公告)日：2005-02-17
申请号：US10898522
申请日：2004-07-23
申请人： Kazuya Ushirokawa , Isamu Aokura , Koujirou Nakamura , Hidenobu Nishikawa , Tomonori Itoh
发明人： Kazuya Ushirokawa , Isamu Aokura , Koujirou Nakamura , Hidenobu Nishikawa , Tomonori Itoh
IPC分类号： H04N5/225
CPC分类号： H04N5/2254
摘要： The present invention of a manufacturing method and a apparatus for manufacturing an image pickup device integrated with lens in which a lens holding part having an optical lens is automatically adjusted with respect to a package on which an imaging chip is mounted so that an optical image from an optical axis adjusting pattern is formed on the image plane of the imaging chip and the lens holding part and the package are fixed to each other with an adhesive used therebetween as a position adjusting member at the adjusted position, and an image pickup device integrated with lens thus manufactured having excellent properties.
摘要翻译：本发明的一种制造方法和用于制造与透镜一体化的图像拾取装置的装置，其中具有光学透镜的透镜保持部分相对于其上安装有成像芯片的封装被自动调整，使得来自在成像芯片的图像平面上形成光轴调整图案，并且透镜保持部分和包装件之间用粘合剂彼此固定，作为调节位置处的位置调整部件，并且将图像拾取装置与由此制造的具有优异性能的透镜。

2. 发明申请

US20090301201A1 Ultrasonic Flaw Detection Method and Ultrasonic Flaw Detection Device 有权
标题翻译：超声波探伤法和超声波探伤仪
公开(公告)号：US20090301201A1
公开(公告)日：2009-12-10
申请号：US11918327
申请日：2006-06-12
申请人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
发明人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
IPC分类号： G01N29/00
CPC分类号： G01N29/28 , G01N2291/101 , G01N2291/2638 , G01N2291/2697
摘要： An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is a separate body from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.
摘要翻译：超声波传播介质被容纳在介质容器中，容器的开口被聚合物膜密封。检查对象被容纳在作为与介质容器分离的主体的检查对象接收容器主体中，并且其开口形成在与介质容器的聚合物膜相对的位置。检查对象接收容器主体的开口由介质容器的聚合物膜覆盖，并且由框体，聚合物膜和检查对象形成的测量环境空间被压缩以使聚合物膜成为与检查对象密切接触。然后，通过经由超声波传播介质和聚合物膜将超声波探头的超声波发射并施加到检查对象来进行探伤。

3. 发明申请

US20080053230A1 Ultrasonic Inspection Method and Ultrasonic Inspection Device 审中-公开
标题翻译：超声波检测方法和超声波检测装置
公开(公告)号：US20080053230A1
公开(公告)日：2008-03-06
申请号：US11794429
申请日：2006-01-11
申请人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
发明人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
IPC分类号： G01N29/28
CPC分类号： G01N29/043 , G01N29/28 , G01N2291/02854 , G01N2291/044 , G01N2291/2697
摘要： A bottom surface of a medium tank 1 is closed with a polymer film 2, the polymer film 2 is stuck to the medium tank 1 by reducing the pressure of the inside of the medium tank 1, an ultrasonic wave transmission medium 5 is injected while reducing the pressure of the inside of the medium tank 1 so that the distal end of an ultrasonic probe 3 is immersed, the inside of the medium tank 1 is pressurized while keeping an inspection object 6 in contact with the polymer film 2, an ultrasonic wave reflected by the inspection object is received by the ultrasonic probe 3.
摘要翻译：介质槽1的底面用聚合物膜2封闭，聚合物膜2通过降低介质槽1的内部的压力而粘附到介质槽1上，同时注入超声波传输介质5，同时还原介质罐1的内部的压力使得超声波探头3的远端被浸没，在保持检查对象6与聚合物膜2接触的同时对介质槽1的内部进行加压，反射的超声波由检查对象由超声波探头3接收。

4. 发明申请

US20090301771A1 CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME 审中-公开
标题翻译：导电布，其形成方法和使用其的电子元件安装结构
公开(公告)号：US20090301771A1
公开(公告)日：2009-12-10
申请号：US12477227
申请日：2009-06-03
申请人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
发明人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
IPC分类号： H05K1/16 , H05K1/11 , H01R43/02
CPC分类号： H05K3/4007 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/90 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/1132 , H01L2224/114 , H01L2224/11552 , H01L2224/11554 , H01L2224/116 , H01L2224/11901 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/83192 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/095 , H05K2201/0367 , H05K2201/0373 , H05K2201/09827 , H05K2203/0514 , H05K2203/1476 , Y10T29/49213 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.
摘要翻译：形成在电子部件的电极上的导电凸块。导电凸块由在电极上形成有一层或多层的第一凸块组成，并且包括至少包含球形导电填料的树脂和形成在第一凸块的上表面上的第二凸块，并且包括含有鳞片状导电填料。

5. 发明授权

US09041221B2 Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure body 有权
标题翻译：电子元件实施结构中间体，电子元件实施结构体和电子元件实施结构体的制造方法
公开(公告)号：US09041221B2
公开(公告)日：2015-05-26
申请号：US13993714
申请日：2011-09-12
申请人： Shozo Ochi , Kazuya Ushirokawa , Keiichi Kusumoto , Takashi Yamada , Ken Yasue
发明人： Shozo Ochi , Kazuya Ushirokawa , Keiichi Kusumoto , Takashi Yamada , Ken Yasue
IPC分类号： H01L23/538 , H01L23/00 , H01L25/065 , H01L25/18 , H01L23/498
CPC分类号： H01L23/5386 , H01L23/49816 , H01L23/49833 , H01L23/4985 , H01L24/05 , H01L24/14 , H01L24/16 , H01L24/73 , H01L24/80 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/1403 , H01L2224/16148 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.
摘要翻译：一种实现结构中间体，包括：具有第一连接端子的第一芯片; 第二芯片，其具有面向所述第一芯片的面中的第二连接端子; 并且具有设置在第一芯片和第二芯片之间的一个面中的具有第三连接端子的膜布线基板被装载在具有第五连接端子的芯片装载基板上，使得第一芯片的另一个面由此面对。在薄膜配线基板中，存在位于第一芯片和第二芯片的外侧的部分，在前端部设置有通过布线与第三连接端子连接的第四连接端子，一部分第一连接端子与第二连接端子连接，第三连接端子与第一连接端子的另一部分连接，第五连接端子连接到第四连接端子。

6. 发明申请

US20130277862A1 INTERMEDIATE FOR ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC COMPONENT MOUNTING STRUCTURE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MOUNTING STRUCTURE 有权
标题翻译：电子元件安装结构的中间件，电子部件安装结构和制造电子元件安装结构的方法
公开(公告)号：US20130277862A1
公开(公告)日：2013-10-24
申请号：US13993714
申请日：2011-09-12
申请人： Shozo Ochi , Kazuya Ushirokawa , Keiichi Kusumoto , Takashi Yamada , Ken Yasue
发明人： Shozo Ochi , Kazuya Ushirokawa , Keiichi Kusumoto , Takashi Yamada , Ken Yasue
IPC分类号： H01L23/538 , H01L23/00
CPC分类号： H01L23/5386 , H01L23/49816 , H01L23/49833 , H01L23/4985 , H01L24/05 , H01L24/14 , H01L24/16 , H01L24/73 , H01L24/80 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/1403 , H01L2224/16148 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.
摘要翻译：一种实现结构中间体，包括：具有第一连接端子的第一芯片; 第二芯片，其具有面向所述第一芯片的面中的第二连接端子; 并且具有设置在第一芯片和第二芯片之间的一个面中的具有第三连接端子的膜布线基板被装载在具有第五连接端子的芯片装载基板上，使得第一芯片的另一个面由此面对。在薄膜配线基板中，存在位于第一芯片和第二芯片的外侧的部分，在前端部设置有通过布线与第三连接端子连接的第四连接端子，一部分第一连接端子与第二连接端子连接，第三连接端子与第一连接端子的另一部分连接，第五连接端子连接到第四连接端子。

7. 发明授权

US07793546B2 Ultrasonic flaw detection method and ultrasonic flaw detection device 有权
标题翻译：超声波探伤法和超声波探伤仪
公开(公告)号：US07793546B2
公开(公告)日：2010-09-14
申请号：US11918327
申请日：2006-06-12
申请人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
发明人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
IPC分类号： G01N29/28
CPC分类号： G01N29/28 , G01N2291/101 , G01N2291/2638 , G01N2291/2697
摘要： An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is separate from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.
摘要翻译：超声波传播介质被容纳在介质容器中，容器的开口被聚合物膜密封。检查对象被容纳在与介质容器分离的检查对象接收容器主体中，并且其开口形成在与介质容器的聚合物膜相对的位置。检查对象接收容器主体的开口由介质容器的聚合物膜覆盖，并且由框体，聚合物膜和检查对象形成的测量环境空间被压缩以使聚合物膜成为与检查对象密切接触。然后，通过经由超声波传播介质和聚合物膜将超声波探头的超声波发射并施加到检查对象来进行探伤。

8. 发明申请

US20090286173A1 ELECTRONIC COMPONENT FORMING APPARATUS, ELECTRONIC COMPONENT FORMED WITH IT AND FORMING METHOD THEREOF 审中-公开
标题翻译：电子元件成型设备，与其形成的电子元件及其形成方法
公开(公告)号：US20090286173A1
公开(公告)日：2009-11-19
申请号：US12465847
申请日：2009-05-14
申请人： Kazuya Ushirokawa , Shozo Ochi
发明人： Kazuya Ushirokawa , Shozo Ochi
IPC分类号： G03F7/20 , A61N5/00
CPC分类号： G03F7/70791 , B23K26/032 , B23K26/066 , G03F7/70291 , H01L2224/11 , H01L2224/1155 , H01L2224/11554
摘要： An electronic component forming apparatus for forming an electronic component by radiating light to a photosensitive conductive resin provided on a forming work material, comprising radiation device for radiating light to the forming work material, detection device for detecting reflecting light reflected from the forming work material, and control device for controlling the radiating light responsive to an amount of the light detected by the detection device.
摘要翻译：一种电子部件形成装置，用于通过将光照射到设置在成形加工材料上的感光性导电性树脂上而形成电子部件，所述电子部件形成装置包括：向成形加工材料照射光的放射线装置;检测从成形加工材料反射的反射光的检测装置; 以及用于响应于由检测装置检测到的光量来控制辐射光的控制装置。

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