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    • 3. 发明授权
    • Method of screening semiconductor device
    • 半导体器件的筛选方法
    • US5543334A
    • 1996-08-06
    • US356419
    • 1994-12-15
    • Ichiro YoshiiHiroyuki KamijohYoshio OzawaKikuo YamabeKazuhiko HashimotoKatsuya OkumuraKaoru Hama
    • Ichiro YoshiiHiroyuki KamijohYoshio OzawaKikuo YamabeKazuhiko HashimotoKatsuya OkumuraKaoru Hama
    • H01L21/66
    • H01L22/14H01L2924/0002
    • A method of screening a semiconductor device. A silicon wafer having gate electrodes formed on the gate oxide film is prepared. An insulating layer is deposited on the silicon wafer. Gate electrode portions of a group of transistors to be tested are exposed. A conductive layer is deposited on the silicon wafer having exposed gate electrodes. The conductive layer is patterned to be a wiring layer so that the gate electrodes of a group of the transistors can be electrically connected to each other. The chip area to be tested is irradiated with light having intensity enough to generate a required quantity of carriers in a depletion layer between a well and a substrate. A predetermined test voltage is applied between the wiring layer and the substrate of the silicon wafer during irradiation of the light to measure current flowing through the wiring layer and the gate oxide film. An abnormality of the gate oxide film can be detected on the basis of the measured current value. The screening method may be conducted before the completion of forming the gate electrodes. Further, gate electrode portions not to be used by a user may not be electrically connected to the gate electrode portions to be used.
    • 一种半导体器件的屏蔽方法。 制备在栅氧化膜上形成栅电极的硅晶片。 绝缘层沉积在硅晶片上。 待测试的一组晶体管的栅电极部分露出。 在具有暴露的栅电极的硅晶片上沉积导电层。 导电层被图案化为布线层,使得一组晶体管的栅电极可以彼此电连接。 用足够强度的光照射要测试的芯片面积,以在阱和衬底之间的耗尽层中产生所需量的载流子。 在光照射期间,在布线层和硅晶片的基板之间施加预定的测试电压,以测量流过布线层和栅氧化膜的电流。 可以基于测量的电流值来检测栅氧化膜的异常。 筛选方法可以在形成栅电极的完成之前进行。 此外,用户不使用的栅电极部分可以不与要使用的栅电极部分电连接。
    • 6. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08604536B2
    • 2013-12-10
    • US12406841
    • 2009-03-18
    • Katsuyuki SekineYoshio Ozawa
    • Katsuyuki SekineYoshio Ozawa
    • H01L29/792
    • H01L29/792H01L21/28282H01L29/513H01L29/66833
    • A semiconductor device includes a memory cell transistor including a first lower insulating film provided on a semiconductor substrate, a first intermediate insulating film provided on the first lower insulating film, a first upper insulating film provided on the first intermediate insulating film, and a first gate electrode provided on the first upper insulating film, and a select transistor including a second lower insulating film provided on the semiconductor substrate, a second intermediate insulating film provided on the second lower insulating film, a second upper insulating film provided on the second intermediate insulating film, and a second gate electrode provided on the second upper insulating film, wherein trap density of the second intermediate insulating film is lower than that of the first intermediate insulating film.
    • 半导体器件包括存储单元晶体管,其包括设置在半导体衬底上的第一下绝缘膜,设置在第一下绝缘膜上的第一中间绝缘膜,设置在第一中间绝缘膜上的第一上绝缘膜和第一栅极 设置在第一上绝缘膜上的电极和设置在半导体衬底上的第二下绝缘膜的选择晶体管,设置在第二下绝缘膜上的第二中间绝缘膜,设置在第二中间绝缘膜上的第二上绝缘膜 以及设置在第二上绝缘膜上的第二栅电极,其中第二中间绝缘膜的阱密度低于第一中间绝缘膜的陷阱密度。
    • 9. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US08304352B2
    • 2012-11-06
    • US13051031
    • 2011-03-18
    • Masayuki TanakaKazuhiro MatsuoYoshio Ozawa
    • Masayuki TanakaKazuhiro MatsuoYoshio Ozawa
    • H01L21/31H01L21/469
    • H01L21/28282H01L27/11568H01L27/11582
    • According to an embodiment, there is provided a method of manufacturing a semiconductor device, including forming a nitride film by nitriding a surface of an underlying region having a semiconductor region containing silicon as a main component and an insulating region containing silicon and oxygen as a main component and adjacent to the semiconductor region, carrying out oxidation with respect to the nitride film to convert a portion of the nitride film which is formed on the insulating region into an oxide film and to leave a portion of the nitride film which is formed on the semiconductor region as at least part of a charge storage insulating film, forming a block insulating film on the charge storage insulating film, and forming a gate electrode film on the block insulating film.
    • 根据一个实施例,提供一种制造半导体器件的方法,包括通过氮化作为主要成分的含有硅的半导体区域的下面的区域的表面和以硅和氧为主要的绝缘区域来形成氮化物膜 并且与半导体区域相邻,相对于氮化物膜进行氧化,将形成在绝缘区域上的氮化物膜的一部分转换为氧化膜,并且使形成在该半导体层上的氮化膜的一部分 半导体区域作为电荷存储绝缘膜的至少一部分,在电荷存储绝缘膜上形成块绝缘膜,并在块绝缘膜上形成栅极电极膜。