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1. 发明授权

US06653741B2 Thermal interface material and heat sink configuration 有权
公开(公告)号：US06653741B2
公开(公告)日：2003-11-25
申请号：US10151741
申请日：2002-05-20
申请人： Attiganal N. Sreeram , Brian Lewis , Leszek Hozer , Michael James Liberatore , Gerard Minogue
发明人： Attiganal N. Sreeram , Brian Lewis , Leszek Hozer , Michael James Liberatore , Gerard Minogue
IPC分类号： H01L2348
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L23/433 , H01L2224/73253 , H01L2924/0002 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/12041 , H01L2924/3011 , H01L2924/00
摘要： A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder that contains indium and an intrinsic oxygen getter selected from the group consisting of alkali metals, alkaline-earth metals, refractory metals, rare earth metals and zinc and mixtures and alloys thereof. Lastly, damage due to an electronic package due to thermal cycling stress is reduced by using an insert in a lid of an electronic device package wherein the insert has a coefficient of thermal expansion that is between about that of the lid and about that of a semiconductor substrate.

2. 发明申请

US20070145546A1 THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS 有权
标题翻译：热界面材料和焊接前体
公开(公告)号：US20070145546A1
公开(公告)日：2007-06-28
申请号：US11682729
申请日：2007-03-06
申请人： Brian Lewis , Bawa Singh , John Laughlin , David Kyaw , Anthony Ingham , Attiganal Sreeram , Leszek Hozer , Michael Liberatore , Gerard Minogue
发明人： Brian Lewis , Bawa Singh , John Laughlin , David Kyaw , Anthony Ingham , Attiganal Sreeram , Leszek Hozer , Michael Liberatore , Gerard Minogue
IPC分类号： H01L23/495
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L23/433 , H01L2224/73253 , H01L2924/0002 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/12041 , H01L2924/3011 , H01L2924/00
摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
摘要翻译：具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。含有内在吸气剂的活性焊料。

3. 发明授权

US07187083B2 Thermal interface material and solder preforms 有权
标题翻译：热界面材料和焊料预制件
公开(公告)号：US07187083B2
公开(公告)日：2007-03-06
申请号：US10722288
申请日：2003-11-25
申请人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
发明人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01L2924/01019 , H01L2924/01066 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
摘要翻译：具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。含有内在吸气剂的活性焊料。

4. 发明授权

US07663242B2 Thermal interface material and solder preforms 有权
标题翻译：热界面材料和焊料预制件
公开(公告)号：US07663242B2
公开(公告)日：2010-02-16
申请号：US11682729
申请日：2007-03-06
申请人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
发明人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
IPC分类号： H01L23/48
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L23/433 , H01L2224/73253 , H01L2924/0002 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/12041 , H01L2924/3011 , H01L2924/00
摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
摘要翻译：具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。含有内在吸气剂的活性焊料。

5. 发明授权

US06500571B2 Enzymatic fuel cell 失效
标题翻译：酶燃料电池
公开(公告)号：US06500571B2
公开(公告)日：2002-12-31
申请号：US09376792
申请日：1999-08-18
申请人： Michael James Liberatore , Leszek Hozer , Attiganal Narayanaswamy Sreeram , Rajan Kumar , Chetna Bindra , Zhonghui Hugh Fan
发明人： Michael James Liberatore , Leszek Hozer , Attiganal Narayanaswamy Sreeram , Rajan Kumar , Chetna Bindra , Zhonghui Hugh Fan
IPC分类号： H01M816
CPC分类号： H01M14/00 , H01M8/16 , H01M14/005 , Y02E60/527
摘要： Provided is a fuel cell comprising a first compartment, a second compartment and a barrier separating the first and second compartments, wherein the barrier comprises a proton transporting moiety.
摘要翻译：提供了一种燃料电池，其包括第一隔室，第二隔室和隔离第一和第二隔室的屏障，其中阻挡层包括质子传输部分。

6. 发明授权

US6160469A Large value buried inductors in low temperature co-fired ceramic circuit boards 有权
标题翻译：低温共烧陶瓷电路板大值埋电感器
公开(公告)号：US6160469A
公开(公告)日：2000-12-12
申请号：US218862
申请日：1998-12-23
申请人： Michael James Liberatore , Leszek Hozer , Je-Do Mun , In-Tae Kim , Yun-Hwi Park , Hyun-Gyu Kang , Sung-Dae Park
发明人： Michael James Liberatore , Leszek Hozer , Je-Do Mun , In-Tae Kim , Yun-Hwi Park , Hyun-Gyu Kang , Sung-Dae Park
IPC分类号： H01F5/00 , C04B35/26 , C04B35/497 , C08K3/22 , C08L101/00 , H01F1/00 , H01F17/00 , H01F41/04 , H01G4/12 , H01G4/30 , H05K1/03 , H05K1/16 , H05K3/46 , H01F27/28
CPC分类号： H01F41/046 , C04B35/265 , C04B35/497 , H01F1/0027 , H01F17/0006 , H01F41/042 , H01F41/043 , H01G4/1254 , H01G4/30 , H05K1/0306 , H05K1/165
摘要： Large value embedded inductors are made by screen printing an inductor coil onto one or more ferrite tapes, and covering the ferrite tapes with one or more ferrite tape layer or layers. Low firing temperature green tapes surround the ferrite layer or layers. These green tapes can be expansion matched to gallium arsenide.
摘要翻译：通过将电感线圈丝网印刷到一个或多个铁氧体磁带上并用一个或多个铁氧体磁带层或层覆盖铁氧体磁带，制成大值嵌入式电感器。低烧结温度绿带围绕铁氧体层或层。这些绿色磁带可以与砷化镓扩展匹配。

7. 发明授权

US06551720B2 Materials to fabricate a high resolution plasma display back panel 失效
公开(公告)号：US06551720B2
公开(公告)日：2003-04-22
申请号：US09847912
申请日：2001-05-02
申请人： Attiganal Narayanaswamy Sreeram , Kalipada Palit , Leszek Hozer , Ellen Schwartz Tormey , Michael James Liberatore
发明人： Attiganal Narayanaswamy Sreeram , Kalipada Palit , Leszek Hozer , Ellen Schwartz Tormey , Michael James Liberatore
IPC分类号： B32B1504
CPC分类号： C23C28/04 , B32B17/06 , C03C8/16 , C03C8/22 , C03C2207/02
摘要： Materials for making a plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. The dielectric material is made from a green ceramic tape which is bonded to the core and cofired with the core to form the back panel. The materials for the dielectric can be chosen such that the composite TCE of the cofired assembly matches the TCE of the front panel.

8. 发明授权

US06168490A Back panel for a plasma display device 失效
标题翻译：等离子显示装置后面板
公开(公告)号：US06168490A
公开(公告)日：2001-01-02
申请号：US09088501
申请日：1998-06-01
申请人： Leszek Hozer , Kalipada Palit , Attiganal Narayanaswamy Sreeram , Robert L. Quinn , Ashok Narayan Prabhu
发明人： Leszek Hozer , Kalipada Palit , Attiganal Narayanaswamy Sreeram , Robert L. Quinn , Ashok Narayan Prabhu
IPC分类号： H01J924
CPC分类号： H01J9/02 , C03C3/064 , C03C10/0009 , C03C14/004 , H01J9/20 , H01J2211/36
摘要： A plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. Conductive electrodes are on the surface of or imbedded in the dielectric layer of the back panel. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. Barrier ribs are formed on the back panel by embossing the green tape before cofiring the bonded assembly. The green tape is embossed using pulsed pressure and an embossing tool that is formed by assembling embossing members and spacing members in compression. The embossing tool further includes elastic spacers mounted outside of the embossing tool and in a position such that the elastic spacers are held in compression during the embossing operation to aid in releasing the embossed green tape from the embossing tool after the embossing operation.
摘要翻译：一种等离子体显示器，其具有与后面板间隔开的透明前面板，背面板是具有延伸并结合到芯体的电介质材料层的金属芯体。导电电极位于背板的介质层的表面或嵌入其中。选择制造后面板的材料以形成具有与前面板的热膨胀系数相容的热膨胀系数的后面板。通过在烧结粘合组件之前对生胶带进行压花，在背面板上形成阻挡肋。生胶带使用脉冲压力压花，并且压花工具通过在压缩中组装压花部件和间隔部件而形成。压花工具还包括安装在压花工具外部的弹性间隔件，并且在压花操作期间使弹性间隔件保持压缩的位置，以帮助在压花操作之后从浮雕工具释放浮雕的生带。

9. 发明授权

US06784606B2 Cathode-ray tube having a focus mask with improved insulator performance 失效
标题翻译：阴极射线管具有提高绝缘子性能的聚焦掩模
公开(公告)号：US06784606B2
公开(公告)日：2004-08-31
申请号：US09741537
申请日：2000-12-20
申请人： Attiganal Narayanaswamy Sreeram , Leszek Hozer
发明人： Attiganal Narayanaswamy Sreeram , Leszek Hozer
IPC分类号： H01J2980
CPC分类号： H01J29/81 , H01J2229/0777
摘要： A color cathode-ray tube (CRT) having an evacuated envelope with an electron gun therein for generating at least one electron beam is provided. The envelope further includes a faceplate panel having a luminescent screen with phosphor elements on an interior surface thereof. A focus mask, having a plurality of spaced-apart first conductive strands, is located adjacent to an effective picture area of the screen. The spacing between the first conductive strands defines a plurality of apertures substantially parallel to the phosphor elements on the screen. Each of the first conductive strands has a substantially continuous insulating material layer formed on a screen facing side thereof. A plurality of second conductive wires are oriented substantially perpendicular to the plurality of first conductive lines and are bonded thereto by the insulating material layer. The insulating material layer comprises a low porosity lead-zinc-borosilicate glass.
摘要翻译：提供一种具有用于产生至少一个电子束的具有电子枪的真空外壳的彩色阴极射线管（CRT）。信封还包括具有荧光屏的荧光屏的面板，荧光屏在其内表面上。具有多个间隔开的第一导电线束的聚焦掩模位于屏幕的有效图像区域附近。第一导电线之间的间隔限定了基本上平行于荧光体元件的多个孔。每个第一导电股线具有形成在面向其屏幕侧的基本上连续的绝缘材料层。多个第二导线的取向基本上垂直于多个第一导电线并且通过绝缘材料层与其键合。绝缘材料层包括低孔率铅 - 锌 - 硼硅酸盐玻璃。

10. 发明授权

US06286204B1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate 失效
标题翻译：使用钛支撑基板制造双面陶瓷电路板的方法
公开(公告)号：US06286204B1
公开(公告)日：2001-09-11
申请号：US09264651
申请日：1999-03-08
申请人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Leszek Hozer , Kalipada Palit
发明人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Leszek Hozer , Kalipada Palit
IPC分类号： H01K310
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/5384 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/053 , H05K3/4053 , H05K3/445 , H05K3/4614 , H05K3/4629 , H05K3/4641 , H05K2203/061 , H05K2203/1438 , Y10T29/49117 , Y10T29/49126 , H01L2924/00
摘要： An integrated double sided metal supported display device has a green tape stack on both sides of the metal support. The green tape stacks incorporate circuitry and conductor filled vias to access the circuitry electrically on each green tape layer. The metal support has a plurality of openings to access both of the green tape stacks. These openings are made by forming the openings in the metal support, filling them with a dielectric that has a thermal coefficient of expansion close to that of the metal support, forming an opening in the dielectric and filling the opening with a conductive ink.
摘要翻译：集成的双面金属支撑显示装置在金属支架的两侧具有生铁带堆叠。绿色磁带堆叠包含电路和导体填充的通孔，以在每个生胶带层上电连接电路。金属支撑件具有多个开口，以便进入两个生胶带堆叠。这些开口是通过在金属支撑体中形成开口而形成的，用电介质填充它们，该电介质的热膨胀系数接近于金属载体，在电介质中形成开口并用导电油墨填充开口。

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