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1. 发明申请

US20080292492A1 Solder Alloy 有权
标题翻译：焊接合金
公开(公告)号：US20080292492A1
公开(公告)日：2008-11-27
申请号：US11720578
申请日：2005-12-01
申请人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
发明人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
IPC分类号： C22C13/00 , B23K35/24
CPC分类号： B23K35/262 , C22C1/06 , C22C13/00 , C22C13/02
摘要： An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
摘要翻译：适用于波峰焊工艺，回流焊接工艺，热空气整平工艺或球栅阵列的合金，该合金含有0.08-3wt。％铋，0.15-1.5重量％％铜，0.1-1.5重量％％银，0-0.1重量％％磷，0-0.1重量％％锗，0-0.1重量％％镓，0-0.3重量％％的一种或多种稀土元素，0-0.3wt。％铟，0-0.3重量％％镁，0-0.3重量％％钙，0-0.3重量％％硅，0-0.3重量％％铝，0-0.3重量％％锌，以及从0.02-0.3重量％镍，0.008-0.2重量％锰，0.01-0.3重量％钴，0.01-0.3重量％铬，0.02-0.3重量％铁，，和0.008-0.1重量％的锆，余量为锡，以及不可避免的杂质。

2. 发明授权

US07187083B2 Thermal interface material and solder preforms 有权
标题翻译：热界面材料和焊料预制件
公开(公告)号：US07187083B2
公开(公告)日：2007-03-06
申请号：US10722288
申请日：2003-11-25
申请人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
发明人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01L2924/01019 , H01L2924/01066 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
摘要翻译：具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。含有内在吸气剂的活性焊料。

3. 发明授权

US09221131B2 Solder alloy 有权
标题翻译：焊锡合金
公开(公告)号：US09221131B2
公开(公告)日：2015-12-29
申请号：US11720578
申请日：2005-12-01
申请人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
发明人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
IPC分类号： B23K35/26 , C22C1/06 , C22C13/00
CPC分类号： B23K35/262 , C22C1/06 , C22C13/00 , C22C13/02
摘要： An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
摘要翻译：适用于波峰焊工艺，回流焊接工艺，热空气整平工艺或球栅阵列的合金，该合金含有0.08-3wt。％铋，0.15-1.5重量％％铜，0.1-1.5重量％％银，0-0.1重量％％磷，0-0.1重量％％锗，0-0.1重量％％镓，0-0.3重量％％的一种或多种稀土元素，0-0.3wt。％铟，0-0.3重量％％镁，0-0.3重量％％钙，0-0.3重量％％硅，0-0.3重量％％铝，0-0.3重量％％锌，以及从0.02-0.3重量％镍，0.008-0.2重量％锰，0.01-0.3重量％钴，0.01-0.3重量％铬，0.02-0.3重量％铁，，和0.008-0.1重量％的锆，余量为锡，以及不可避免的杂质。

4. 发明授权

US07663242B2 Thermal interface material and solder preforms 有权
标题翻译：热界面材料和焊料预制件
公开(公告)号：US07663242B2
公开(公告)日：2010-02-16
申请号：US11682729
申请日：2007-03-06
申请人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
发明人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
IPC分类号： H01L23/48
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L23/433 , H01L2224/73253 , H01L2924/0002 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/12041 , H01L2924/3011 , H01L2924/00
摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
摘要翻译：具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。含有内在吸气剂的活性焊料。

5. 发明授权

US5382299A Soldering flux 失效
标题翻译：焊剂焊剂
公开(公告)号：US5382299A
公开(公告)日：1995-01-17
申请号：US187738
申请日：1994-01-28
申请人： Dosten Baluch , Anthony E. Ingham
发明人： Dosten Baluch , Anthony E. Ingham
IPC分类号： B23K1/00 , B23K35/36 , B23K35/363 , B23K35/40 , B23K35/34
CPC分类号： B23K35/3616 , B23K35/3615
摘要： A soldering flux composition includes an aqueous solution containing as component (A) a compound selected from (i) hydrohalides and hydrophosphates of guanidine and substituted guanidines, (ii) hydrohalides and hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formulaC.sub.x N.sub.y H.sub.3in which x is 1 or 2 and y is 4 or 5, and mixtures of (i) and (ii) and as component (B) at least one compound selected from hydrohalides and hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH.sub.3 (CH.sub.2).sub.n NR.sub.2 and aliphatic diamines of formula R.sub.2 N(CH.sub.2).sub.m NR.sub.2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, the components (A) and (B) being present in the relative proportions of 25 to 100% by weight of (A) and 75 to 0% of (B).
摘要翻译：助焊剂组合物包括含有作为组分（A）的水溶液，该化合物选自（i）卤化氢和胍和取代的胍的氢氧化磷酸盐，（ii）式C x N y H 3的五元含氮杂环胺的氢卤酸盐和氢氧化磷在其中x为1或2，y为4或5，以及（i）和（ii）和作为组分（B）的混合物，选自脂族胺的氢卤酸盐和氢氧化磷中的至少一种化合物，其选自式CH3的脂族单胺）nNR2和式R2N（CH2）mNR2的脂族二胺，其中n为0至10，m为5至10，R为氢，甲基，乙基，丙基或丁基，组分（A）和（B）（A）的25〜100重量％，（B）的相对比例为75〜0％。

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