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1. 发明授权

US06168490A Back panel for a plasma display device 失效
标题翻译：等离子显示装置后面板
公开(公告)号：US06168490A
公开(公告)日：2001-01-02
申请号：US09088501
申请日：1998-06-01
申请人： Leszek Hozer , Kalipada Palit , Attiganal Narayanaswamy Sreeram , Robert L. Quinn , Ashok Narayan Prabhu
发明人： Leszek Hozer , Kalipada Palit , Attiganal Narayanaswamy Sreeram , Robert L. Quinn , Ashok Narayan Prabhu
IPC分类号： H01J924
CPC分类号： H01J9/02 , C03C3/064 , C03C10/0009 , C03C14/004 , H01J9/20 , H01J2211/36
摘要： A plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. Conductive electrodes are on the surface of or imbedded in the dielectric layer of the back panel. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. Barrier ribs are formed on the back panel by embossing the green tape before cofiring the bonded assembly. The green tape is embossed using pulsed pressure and an embossing tool that is formed by assembling embossing members and spacing members in compression. The embossing tool further includes elastic spacers mounted outside of the embossing tool and in a position such that the elastic spacers are held in compression during the embossing operation to aid in releasing the embossed green tape from the embossing tool after the embossing operation.
摘要翻译：一种等离子体显示器，其具有与后面板间隔开的透明前面板，背面板是具有延伸并结合到芯体的电介质材料层的金属芯体。导电电极位于背板的介质层的表面或嵌入其中。选择制造后面板的材料以形成具有与前面板的热膨胀系数相容的热膨胀系数的后面板。通过在烧结粘合组件之前对生胶带进行压花，在背面板上形成阻挡肋。生胶带使用脉冲压力压花，并且压花工具通过在压缩中组装压花部件和间隔部件而形成。压花工具还包括安装在压花工具外部的弹性间隔件，并且在压花操作期间使弹性间隔件保持压缩的位置，以帮助在压花操作之后从浮雕工具释放浮雕的生带。

2. 发明授权

US06286204B1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate 失效
标题翻译：使用钛支撑基板制造双面陶瓷电路板的方法
公开(公告)号：US06286204B1
公开(公告)日：2001-09-11
申请号：US09264651
申请日：1999-03-08
申请人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Leszek Hozer , Kalipada Palit
发明人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Leszek Hozer , Kalipada Palit
IPC分类号： H01K310
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/5384 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/053 , H05K3/4053 , H05K3/445 , H05K3/4614 , H05K3/4629 , H05K3/4641 , H05K2203/061 , H05K2203/1438 , Y10T29/49117 , Y10T29/49126 , H01L2924/00
摘要： An integrated double sided metal supported display device has a green tape stack on both sides of the metal support. The green tape stacks incorporate circuitry and conductor filled vias to access the circuitry electrically on each green tape layer. The metal support has a plurality of openings to access both of the green tape stacks. These openings are made by forming the openings in the metal support, filling them with a dielectric that has a thermal coefficient of expansion close to that of the metal support, forming an opening in the dielectric and filling the opening with a conductive ink.
摘要翻译：集成的双面金属支撑显示装置在金属支架的两侧具有生铁带堆叠。绿色磁带堆叠包含电路和导体填充的通孔，以在每个生胶带层上电连接电路。金属支撑件具有多个开口，以便进入两个生胶带堆叠。这些开口是通过在金属支撑体中形成开口而形成的，用电介质填充它们，该电介质的热膨胀系数接近于金属载体，在电介质中形成开口并用导电油墨填充开口。

3. 发明授权

US06361390B1 Method for making an embossed plasma display back panel 有权
标题翻译：制造压花等离子体显示背板的方法
公开(公告)号：US06361390B1
公开(公告)日：2002-03-26
申请号：US09659234
申请日：2000-09-11
申请人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Les Hozer , Kalipada Palit
发明人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Les Hozer , Kalipada Palit
IPC分类号： H01J924
CPC分类号： C03C17/04 , C03C8/22 , H01J9/241 , H01J9/242 , H01J11/12 , H01J11/34 , H01J11/36 , H01J2211/366
摘要： A plasma display device of the type having a composite back plate including a metal substrate and a ceramic barrier rib structure, is formed using a green ceramic tape which is a combination of two glasses, a primary glass which flows back during firing and a secondary glass that has a relatively high thermal coefficient of expansion. These glasses are combined in proportion to match the thermal coefficient of expansion of the metal substrate. Channels are formed on the inner surface of the back panel by laminating a green ceramic tape to the metal substrate and then soaking the laminated tape in a solvent before embossing the green tape to form the ribs. This soaking step enhances the flow of the green ceramic tape during the embossing process. The ceramic components of the green tape are formulated with a particle size 15 &mgr;m or more to enhance particle flow when the green tape is embossed. Electrodes are printed onto one or more of the green ceramic tape layers, by screen printing using a metal emulsion screen, prior to embossing such that the electrode layer covers all or substantially all of the green tape layer and the electrodes are separated by the embossing process. Alternatively, the electrodes are printed onto one or more of the green ceramic tape layers using a conductive ink which may be applied using an ink-jet printing technique. In another alternative, the electrodes are formed from sheets of conductive material and applied to the back panel either before or after the panel is embossed.
摘要翻译：具有包括金属基板和陶瓷隔壁结构的复合背板的类型的等离子体显示装置使用作为两个玻璃的组合的生坯陶瓷带，在烧制期间回流的主玻璃和二次玻璃具有较高的热膨胀系数。这些玻璃按比例组合以匹配金属基底的热膨胀系数。通过将生坯陶瓷带层压到金属基底上，然后在压花生带之前将层压带浸渍在溶剂中以形成肋条，在后面板的内表面上形成通道。这种浸泡步骤增强了在压花加工过程中生坯陶瓷带的流动。将生胶带的陶瓷成分配制成粒径为15μm或更大的颗粒，以便在生胶带被压花时增强颗粒流动。在压花之前，通过使用金属乳液筛网的丝网印刷将电极印刷到一个或多个生坯陶瓷带层上，使得电极层覆盖所有或基本上全部的生胶带层，并且电极通过压花过程分离。或者，使用可以使用喷墨打印技术施加的导电油墨将电极印刷到一个或多个生坯陶瓷带层上。在另一替代方案中，电极由导电材料片形成并且在面板被压花之前或之后施加到后面板。

4. 发明授权

US6140759A Embossed plasma display back panel 失效
标题翻译：压花等离子显示背板
公开(公告)号：US6140759A
公开(公告)日：2000-10-31
申请号：US127425
申请日：1998-07-31
申请人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Les Hozer , Kalipada Palit
发明人： Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , Les Hozer , Kalipada Palit
IPC分类号： C03C3/062 , C03C3/078 , C03C3/085 , C03C8/22 , C03C17/04 , H01J9/02 , H01J9/24 , H01J11/12 , H01J11/34 , H01J11/36 , H01J5/48
CPC分类号： C03C17/04 , C03C8/22 , H01J11/12 , H01J11/34 , H01J11/36 , H01J9/241 , H01J9/242 , H01J2211/366
摘要： A plasma display device having a composite back panel including a metal substrate having a predetermined thermal coefficient of expansion (TCE) and a ceramic barrier rib structure which are co-fired at a pre-determined temperature, the ceramic barrier rib structure is composed from a first glass material having a TCE which is less than the TCE of the metal substrate, the first glass formulated to flow-back at the co-firing temperature; and a second glass material having a TCE which is greater than the TCE of the metal substrate, wherein the first and the second glass materials are mixed in a proportion to produce a composite ceramic material having a TCE which is substantially equal to the TCE of the metal substrate. The plasma display device having the ceramic barrier rib structure composed of the first and second glasses provides control of the TCE to minimize stresses in the final produce and assure panel flatness. A green ceramic tape defined by percentage weight formulation as: 40-70% glass 1, 1-15% glass 2, 10-30% solvent, 10-40% resin, wherein glass 1 is defined by percentage weight formulation as: 15-50% ZnO, 10-45% MgO, 5-30%, BaO, 10-45% SiO.sub.2, and glass 2 is defined by percentage weight formulation as: 10-80% SiO.sub.2, 5-60% B.sub.2 O.sub.3, 5-30% BaO, 0-60% Al.sub.2 O.sub.3. The green tape ceramic including the aforementioned glass 1 and glass 2 promotes solidification and densification.
摘要翻译：一种等离子体显示装置，其具有包括具有预定的热膨胀系数（TCE）的金属基板和在预定温度下共烧的陶瓷隔壁结构的复合后面板，所述陶瓷隔壁结构由第一玻璃材料具有小于金属基材的TCE的TCE，第一玻璃配制成在共烧温度下回流; 和具有大于金属基材的TCE的TCE的第二玻璃材料，其中第一和第二玻璃材料按比例混合以制备具有基本上等于TCE的TCE的TCE的复合陶瓷材料金属基板。具有由第一和第二玻璃构成的陶瓷隔壁结构的等离子体显示装置提供了TCE的控制，以最小化最终产品中的应力并确保面板的平坦度。由百分比重量配方定义的绿色陶瓷带：40-70％玻璃1,1-5％玻璃2,10-30％溶剂，10-40％树脂，其中玻璃1由以重量百分比配方定义为： 50％ZnO，10-45％MgO，5-30％，BaO，10-45％SiO 2和玻璃2由百分比重量配方定义为：10-80％SiO 2，5-60％B 2 O 3，5-30％ BaO，0-60％Al2O3。包括上述玻璃1和玻璃2的生胶带陶瓷促进固化和致密化。

5. 发明授权

US06455930B1 Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology 有权
标题翻译：集成散热封装采用低温共烧陶瓷金属电路板技术
公开(公告)号：US06455930B1
公开(公告)日：2002-09-24
申请号：US09664599
申请日：2000-09-18
申请人： Ponnuswamy Palanisamy , Attiganal Narayanaswamy Sreeram , Ellen Schwartz Tormey , Barry Jay Thaler , John Connolly , Ramon Ubaldo Martinelli , Ashok Narayan Prabhu , Mark Stuart Hammond
发明人： Ponnuswamy Palanisamy , Attiganal Narayanaswamy Sreeram , Ellen Schwartz Tormey , Barry Jay Thaler , John Connolly , Ramon Ubaldo Martinelli , Ashok Narayan Prabhu , Mark Stuart Hammond
IPC分类号： H01L2334
CPC分类号： H01S5/02248 , H01L2224/16225 , H01L2224/48091 , H01S5/02284 , H01S5/02415 , H01S5/02484 , H01L2924/00014
摘要： Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
摘要翻译：包含安装在金属支撑基板上的多层陶瓷电路板的集成封装可用于金属支撑基板的温度控制。各种电子部件以及附加的温度控制装置可以连接到电路板和金属支撑基板，以控制或调节部件的操作温度。集成包装可以用盖子气密密封。

6. 发明授权

US5953203A Multilayer ceramic circuit boards including embedded capacitors 失效
标题翻译：多层陶瓷电路板包括嵌入式电容器
公开(公告)号：US5953203A
公开(公告)日：1999-09-14
申请号：US812151
申请日：1997-03-06
申请人： Ellen Schwartz Tormey , Ashok Narayan Prabhu , Attiganal Narayanaswamy Sreeram
发明人： Ellen Schwartz Tormey , Ashok Narayan Prabhu , Attiganal Narayanaswamy Sreeram
IPC分类号： H01C7/00 , H01C13/02 , H01C17/30 , H01L23/64 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/46 , H01G4/06 , H01G4/20
CPC分类号： H01L23/64 , H01C13/02 , H01C17/30 , H01C7/003 , H05K1/162 , H05K1/167 , H01L2924/0002 , H01L2924/09701 , H01L2924/19041 , H05K1/0306 , H05K1/092 , H05K3/4611 , H05K3/4629 , H05K3/4688 , Y10T29/49128
摘要： Embedded capacitors are formed in multilayer ceramic circuit boards by screen printing a capacitor ink sandwiched between conductor ink layers onto a green tape stack and covering the ink layer with one or two green tapes, and aligning the green tape layers, and firing. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which do not shrink in the x and y dimensions during firing. Thus the capacitors can be made to close tolerances.
摘要翻译：嵌入式电容器通过将夹在导体油墨层之间的电容器油墨丝网印刷到生胶带堆叠上并用一个或两个生带覆盖油墨层，并对准生胶带层并进行烧制而形成在多层陶瓷电路板中。生胶带由结晶玻璃，非结晶玻璃和氧化物填料的混合物制成，其在焙烧期间在x和y尺寸上不收缩。因此，电容器可以制成紧密公差。

7. 发明授权

US06191934B1 High dielectric constant embedded capacitors 有权
标题翻译：高介电常数埋入式电容器
公开(公告)号：US06191934B1
公开(公告)日：2001-02-20
申请号：US09211668
申请日：1998-12-14
申请人： Michael James Liberatore , Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , In-Tae Kim , Je-Do Mun , Sung-Dae Park , Yun-Hwi Park , Joo-Dong Yu , Ellen S. Tormey
发明人： Michael James Liberatore , Attiganal Narayanaswamy Sreeram , Ashok Narayan Prabhu , In-Tae Kim , Je-Do Mun , Sung-Dae Park , Yun-Hwi Park , Joo-Dong Yu , Ellen S. Tormey
IPC分类号： H01G406
CPC分类号： H01F41/046 , C04B35/265 , C04B35/497 , H01F1/0027 , H01F17/0006 , H01F41/042 , H01F41/043 , H01G4/1254 , H01G4/30 , H05K1/0306 , H05K1/165
摘要： High dielectric constant capacitors are made from a dielectric ink of lead-magnesium-niobate and lead oxide powders. Dielectric inks are made by mixing the dielectric powders with a suitable organic vehicle which can be used to coat one or more glass-based green tapes. Buried capacitors are made by coating an overlying and an underlying green tape with a conductor such as silver. Capacitors can also be made by adjusting the organic vehicle and forming a green tape from the dielectric powders. These dielectric green tapes each can be coated with a conductive layer and stacked, the conductive layers connected in parallel. The resultant multilayer capacitors have a very high dielectric constant, while eliminating the need for very large area capacitors, as compared to single layer capacitors.
摘要翻译：高介电常数电容器由铌酸铅镁矾土和氧化铅粉末的电介质油墨制成。电介质油墨通过将介电粉末与可用于涂覆一种或多种基于玻璃的生胶带的合适的有机载体混合来制备。埋入式电容器是通过用诸如银的导体涂覆上覆的和下面的生胶带制成的。电容器也可以通过调节有机载体并从电介质粉末形成绿色带制成。这些电介质绿带可以涂覆有导电层并堆叠，导电层并联连接。与单层电容器相比，所得的多层电容器具有非常高的介电常数，同时不需要非常大的面积电容器。

8. 发明授权

US6055151A Multilayer ceramic circuit boards including embedded components 失效
标题翻译：多层陶瓷电路板包括嵌入式元件
公开(公告)号：US6055151A
公开(公告)日：2000-04-25
申请号：US31745
申请日：1998-02-27
申请人： Ellen Schwartz Tormey , Ashok Narayan Prabhu , Attiganal Narayanaswamy Sreeram , Michael James Liberatore
发明人： Ellen Schwartz Tormey , Ashok Narayan Prabhu , Attiganal Narayanaswamy Sreeram , Michael James Liberatore
IPC分类号： H01C7/00 , H01C13/02 , H01C17/30 , H01L23/64 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/46 , H01G4/06 , H01G4/20
CPC分类号： H01C7/003 , H01C13/02 , H01C17/30 , H01L23/64 , H05K1/162 , H05K1/167 , H01L2924/0002 , H01L2924/09701 , H01L2924/19041 , H05K1/0306 , H05K1/092 , H05K3/4611 , H05K3/4629 , H05K3/4688 , Y10T29/49128
摘要： Embedded passive components such as capacitors are formed in multilayer ceramic circuit boards by screen printing a component precursor compound ink sandwiched between conductor ink layers onto a green tape stack and covering the component ink layer with one or two green tape layers, aligning and laminating the green tapes and firing. Capacitor inks are made from dielectrics chosen from barium titanate, titanium oxide and lead-magnesium-niobate. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which does not shrink in the x and y dimensions during firing mounted on a metal support. Thus the embedded components can be made to close tolerances.
摘要翻译：诸如电容器的嵌入式无源部件通过丝网印刷夹在导电油墨层之间的组分前体复合油墨到一个生胶带堆叠上而形成在多层陶瓷电路板中，并用一个或两个生胶带层覆盖部件油墨层，对准和层压绿色磁带和射击。电容器油墨由选自钛酸钡，氧化钛和铌酸镁镁的电介质制成。生胶带由结晶玻璃，非结晶玻璃和氧化物填料的混合物制成，其在烧制安装在金属载体上时在x和y尺寸上不收缩。因此，嵌入式组件可以制成紧密公差。

9. 发明授权

US6017642A Low dielectric loss glasses 失效
标题翻译：低介电损耗眼镜
公开(公告)号：US6017642A
公开(公告)日：2000-01-25
申请号：US878176
申请日：1997-06-18
申请人： Ananda Hosakere Kumar , Barry Jay Thaler , Ashok Narayan Prabhu , Ellen Schwartz Tormey
发明人： Ananda Hosakere Kumar , Barry Jay Thaler , Ashok Narayan Prabhu , Ellen Schwartz Tormey
IPC分类号： C04B35/195 , C03C10/00 , C03C10/08 , C04B35/20 , C04B35/622 , C04B35/64 , H01L23/15 , H01L23/498 , H05K3/46 , C03C27/00 , C03C10/04
CPC分类号： C03C10/0045 , C03C10/0054 , H01L23/15 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10T428/12597 , Y10T428/12604
摘要： High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.
摘要翻译：高镁含量的硅铝酸镁玻璃被用来形成生长带组合物，其逐步烧制，即首先至约500℃以除去有机材料，然后在高于玻璃化转变温度的10-30℃温度下进行足以使玻璃成核，最后达到接近但低于软化温度的较高温度，以完成玻璃的结晶。所得到的玻璃陶瓷可包括大量的镁橄榄石结晶相。制造多层陶瓷印刷电路板，可用于高频微波应用。烧制的高镁氧化物含量的玻璃具有低的介电常数和低的损耗损耗因子，并且它们具有与赋予印刷电路板机械强度并且是导热性的金属或陶瓷支撑衬底相容的热膨胀系数。这些电路板与砷化镓器件兼容。

10. 发明授权

US5958807A Low dielectric loss glass ceramic compositions 失效
标题翻译：低介电损耗玻璃陶瓷组合物
公开(公告)号：US5958807A
公开(公告)日：1999-09-28
申请号：US874926
申请日：1997-07-01
申请人： Ananda Hosakere Kumar , Barry Jay Thaler , Ashok Narayan Prabhu , Ellen Schwartz Tormey
发明人： Ananda Hosakere Kumar , Barry Jay Thaler , Ashok Narayan Prabhu , Ellen Schwartz Tormey
IPC分类号： C04B35/195 , C03C10/00 , C03C10/08 , C04B35/20 , C04B35/622 , C04B35/64 , H01L23/15 , H01L23/498 , H05K3/46
CPC分类号： C03C10/0045 , C03C10/0054 , H01L23/15 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10T428/12597 , Y10T428/12604
摘要： High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.
摘要翻译：高镁含量的硅铝酸镁玻璃被用来形成分段烧制的生胶条组合物，即首先至约500℃以除去有机材料，然后在高于玻璃化转变温度的10-30℃温度下进行足以使玻璃成核，最后达到接近但低于软化温度的较高温度，以完成玻璃的结晶。所得到的玻璃陶瓷可包括大量的镁橄榄石结晶相。制造多层陶瓷印刷电路板，可用于高频微波应用。烧制的高镁氧化物含量的玻璃具有低的介电常数和低的损耗损耗因子，并且它们具有与赋予印刷电路板机械强度并且是导热性的金属或陶瓷支撑衬底相容的热膨胀系数。这些电路板与砷化镓器件兼容。

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